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HNY-M310-MH In-line 3D SPI Equipment detailed information

HNY-M310-MH Device Architecture

Technological features

The HNY-M310-MH 3D SPI inspection machine follows the development trend and integrates AI technology. The machine system contains an AI database, which can assist engineers in debugging and programming, significantly improving the programming efficiency. At the same time, it greatly reduces the time cost and economic cost for training engineers. With the assistance of AI technology, the 2-hour programming process can now be completed in just about 15 minutes.

Moreover, the machine can automatically identify programming errors and eliminate programming mistakes. The machine enables multiple machines to be interconnected for data sharing, efficiently and conveniently transmitting PCB board images and solder paste data, eliminating information discrepancies during production. At the same time, the machine is customizable. By choosing the dual-track dual-head model, the efficiency is increased by 70% compared to the single machine with a single track.

Technical Parameter Summary

1. Detection speed: 0.3 seconds per plate (standard plate)
2. Measurement range: Height 0.1 to 15 mm, Component size 01005 to 100 mm²
3. Precision indicators: Z-axis ±1 μm, XY-axis ±5 μm, GR&R < 10%
4. Data interface: Supports SECS/GEM protocols, seamlessly integrating with the MES system.

Technology of machine

Scope of detection

Defect detection instances

Deep learning algorithm

In the field of industrial detection, the application of deep learning algorithm, big dataoptimization, intelligent minimalist programming, one-click automatic identification oftrained components and solder joints, intelligent judgment of poor, to solve the twotraditional algorithm pain points of long programming time and high false alarm rate.

Phase modulation contour measurement technology

The phase modulation contour measurement technology isused to realize the 3D measurement of the precision printing solder paste, which greatly improves the measurement accuracy while ensuring the high-speed measurement.

Phase modulation contour measurement technology (PMP)known as phase shift contour technique (PSP for short), isbased on the sinusoidal structure grating projection,discrete phase shift to obtain multiple deformed light fieldimages, and then calculate the phase distribution accordingto the multi-step phase shift method, and finally the high precision volume measurement results are obtained bygeometric methods such as triangulation.

Technological superiority

Dynamic Mark Point Recognition

FAQ

1. What is the detection accuracy of this equipment? Can it meet the requirements of high-density PCBs?

A:

1. HNY-M310-MH 3D SPI employs multi-frequency Moiré fringe profiling technology combined with phase measurement profiling technology to achieve Z-axis accuracy of ±1μm, XY-axis accuracy of ±5μm, and repeatability GR&R of less than 10%.
2. It can precisely measure the solder paste volume, height, and coverage area of 01005 micro-components down to large BGA, fully meeting the detection requirements for high-density PCBs such as mobile phone mainboards and automotive electronics.

2.What are the prohibitions for cleaning optical components?

1. Disable the oily cleaning agents (which are prone to causing oily mist);
2. Avoid using alkaline solutions (which can corrode silicate glass);
3. The phosphate glass components should be cleaned with dilute ammonia water and then thoroughly dried.

3. How do AI algorithms enhance the defect identification rate?

Built-in deep learning engine, trained on millions of defect samples, can intelligently distinguish complex defects such as bridging, insufficient soldering, and offset in solder paste printing. The recognition rate is over 99.5%, and the false alarm rate is reduced by 80%.

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