Why choose this product?

How It Works

1. Size Compatibility Adjustment: The spacing between the movable side plate and fixed side plate can be adjusted to quickly accommodate PCBs of different widths, ensuring the boards are securely clamped.
2. ESD Protection: Constructed from ESD-safe materials (e.g., conductive aluminum or anti-static plastic), it effectively dissipates or shields static electricity to prevent sensitive electronic components from being damaged by electrostatic discharge (ESD) during production or transfer.
3. Layered Storage and Protection: Internal parallel slots allow multiple PCBs to be placed vertically and separately, effectively preventing boards from colliding, scratching, or becoming contaminated with debris, facilitating easy buffering and conveyance along the production line.
4. Operation and Locking: Typically features convenient locking mechanisms to firmly secure the movable side plate after adjustment, ensuring stability and positioning accuracy during transport or automated loading/unloading processes.

Application Process

1. Preparation: Adjust the spacing between the movable and fixed side plates according to the actual width of the PCBs, then secure the position using the locking mechanism to ensure compatibility with the board size.
2. Loading Boards: Insert PCBs vertically into the parallel slots of the rack one by one, either manually or by an automatic loader, ensuring each board is placed separately and securely.
3. ESD Protection: During loading and handling, the rack’s ESD-safe materials continuously dissipate or shield static electricity to protect sensitive components on the boards from electrostatic discharge (ESD) damage.
4. Transfer and Buffering: The loaded magazine rack is moved by operators or conveyor systems to the next process station (e.g., pick-and-place, reflow soldering, or inspection equipment) for unloading, or used as buffer storage between processes.
5. Unloading for Use: At the target station, PCBs are taken out from the rack one by one by an automatic unloader or manually, and then fed into the production equipment for further processing, completing the transfer task.

Requirements

• PCB Size Compatibility: The internal width must be adjustable to accommodate PCBs of varying dimensions.
• ESD Performance: The surface resistance of the rack must meet industry standards (typically 10⁴–10⁶ Ω) to ensure effective static dissipation and protect sensitive components.
• Temperature Resistance: Must withstand the temperatures encountered in SMT production environments (e.g., 80°C, 120°C, or higher) to ensure stability during high-temperature baking or storage.
• Structural Strength and Capacity: Typically constructed with a metal base and ESD-safe side panels, requiring durability to hold a certain number of PCBs (e.g., 50 slots).
• Cleanliness Requirements: The product should be suitable for cleanrooms or ESD-protected areas (EPA), generating no dust or contamination.

What It Is Used For

Conclusion