Best PCBA Aqueous Cleaning Machine

JEH-300C Offline PCBA Aqueous Cleaning Machine

I. Advanced Aqueous Cleaning System

The JEH-300C delivers cost-effective batch aqueous cleaning for electronics and stencils, eliminating:
✓ Water-soluble residues ✓ RMA/no-clean fluxes ✓ Plating salts ✓ Fingerprints
✓ Dust ✓ Solder balls

Engineered with U.S. TDC’s aqueous cleaning technology, it features:

• Single-chamber processing (wash/rinse/dry)

• Scalable tank capacities reducing chemical use

• Corrosion-resistant stainless-steel construction

• PLC + touchscreen HMI control

Ideal for small-to-medium PCBA aqueous flux cleaning with superior cost-performance.

II. Aqueous Cleaning Advantages

Precision Cleaning Performance

• 360° oscillating nozzles eliminate blind spots

• Adjustable spray pressure (delicate to intensive)

• IPC-610D Class III compliance (<1.56μg/cm² ionic)

Eco-Conscious Operation

• DI water/chemical auto-blending (5%-25%)

• Heated standard dilution tank

• MIL-28809 Class I cleanliness

Automated Aqueous Process

• Single-chamber aqueous cleaning workflow

• Real-time viewing window with LED

• 1000×800×40mm capacity (single-layer)

User-Centric Design

• Maintenance-optimized access points

• Customizable process parameters

• Snap-buckle doors for rapid loading

III. Aqueous Cleaning Process Flow

1. Chemical Aqueous Cleaning Stage

• Auto DI water/chemistry blending

• Temperature-controlled spray

2. Pure Water Rinsing Stage

• Dual DI water cascading rinse

• Contaminant discharge system

3. High-Velocity Drying Stage

• HEPA-filtered air knife system

• Ambient–99°C adjustable drying

Material Handling

• Push-pull rack loading

• Single-layer configuration

Cleaning schematic flowchart:

Internal structure of the product:

IV.Frequently Asked Questions (FAQ) 

Q1: What types of PCBA is the JEH-300C suitable for cleaning?

A:
The JEH-300C is designed for small-to-medium batch, high-reliability PCBA cleaning, including:

• Removal of rosin/flux residues after SMT/DIP soldering

• Solder paste residues, dust, and oils from assembly processes

• High-reliability applications (automotive, medical, aerospace electronics)

• R&D prototyping, rework boards, and flexible small-batch production

Q2: What are the advantages of aqueous cleaning vs. traditional solvent cleaning?

A:
Aqueous cleaning offers superior environmental, safety, and sustainability benefits:

• ✅ Eco-friendly: Low-VOC aqueous agents comply with RoHS/REACH regulations

• ✅ Safety: Non-flammable, reduces workshop hazards

• ✅ Compatibility: Gentle on most components, ideal for complex assemblies

• ✅ Cost efficiency: Lower consumable costs and simpler wastewater treatment

Q3: Can the JEH-300C clean PCBAs with underfill or sensitive components?

A:
Yes, with optimized protocols:

• Adjustable spray pressure (0.5–2 bar) and temperature (RT–60°C) minimize stress

• Submit samples for compatibility validation prior to full-scale cleaning

• Avoid boards with unsealed electrolytic capacitors, mechanical connectors, or paper labels

Q4: How does the system ensure complete drying without water spots?

A:
Three-stage drying technology:

1. Powerful rinsing: Deionized water removes residual contaminants

2. Precision hot-air drying: Adjustable 40–80°C airflow penetrates component gaps

3. Uniform evaporation: Chamber airflow design eliminates moisture traps
   Post-drying surface resistance >10¹⁰ Ω meets IPC cleanliness standards.

Q5: How is process consistency guaranteed?

A:

• Full automation: PLC/touchscreen controls with preset cleaning/drying recipes

• One-touch operation: Minimizes human error

• Real-time monitoring: Temperature, pressure, and fluid parameters tracked; automatic fault alarms

If you can’t find the device you want on our website, please email or contact us online for more information!