Inline High Resolution and High Speed Automated Optical Inspection System BF-Frontier II
SAKI BF-Frontier II is an in-line high-res high-speed 2D AOI system for large PCBs up to 460×500mm, featuring 18μm resolution for 0201 and 0.4mm IC defect detection, with a scan time of just 10 seconds.
- Alternate Scanning Technology: Utilizes SAKI’s proprietary Alternate Scanning Method, which captures multiple images simultaneously in a single line scan, significantly improving throughput.
- Optical System: Equipped with a large-aperture telecentric focusing lens to eliminate parallax errors, combined with an improved three-stage LED lighting system (including low-angle oblique illumination) to ensure clear imaging of miniature components such as 01005 packages.
- Inspection Speed: For M-size boards (250mm x 330mm), the inspection cycle time can be controlled within 10 to 25 seconds (depending on resolution settings and machine generation), meeting the production capacity requirements of 1.5 or more high-speed placement lines.
- Resolution Accuracy: Image resolution reaches 10μm level, supporting high-precision inspection of solder paste printing, component missing, misalignment, polarity errors, and solder defects (e.g., bridging, insufficient solder).
- Inline High Resolution and High Speed Automated Optical Inspection System BF-Frontier II
- Key Features
- Advantages
| Parameter | Details |
|---|---|
| Model | BF-Frontier II |
| Resolution | 18μm |
| Board Size | 50×60 – 460×500mm, 2×2.4 – 18×20in. |
| Board Thickness | 0.6 – 3.2mm, 24 – 126mils |
| Board Warp | +/-2mm, 79mils |
| PCB Clearance | Top: 40mm, 1.57in. Bottom: 40mm, 1.57in. |
| Rotated Component Support | Available for 0 – 359°rotation (unit of 1°) |
| Inspection Categories | Presence/Absence, Misalignment, Tombstone, Reverse, Polarity, Bridge, Foreign material, Absence of solder, Insufficient solder, Lifted lead, Lifted Chip, and Fillet defect. Each defect name can be changed freely by system function. |
| Tact Time¹² | Approx. 21sec. (460×500mm) |
| Image Scanning Time*¹ | Approx. 10sec. (460×500mm) |
| Camera (Image Processing) | Line color CCD camera |
| Lighting | LED lighting system |
| Transfer Conveyor Method | Flat belt transfer |
| Transfer Conveyor Height | 900+/-20mm, 36+/-0.8in |
| Transfer Conveyor Width Adjustment | Manual |
| Operating System | Windows XP English Version |
| Optional System | BF-Editor / BF-RP1 / BF-Monitor / BF-View |
| Optional | 2D Barcode Recognition, Journal Printer, Automatic Transfer Conveyor Width Adjustment |
- If PCB size is smaller than 460x500mm, Image scannig time will be shorter than this values.
- Including Image Scanning Time.
- 18μm high resolution for precise detection of 0201 and 0.4mm IC soldering defects.
- Supports large PCBs up to 460×500mm for strong compatibility.
- High-speed scanning – L-size board in just 10 seconds, 21-second cycle time.
- Covers missing components, misalignment, tombstoning, bridging, insufficient solder, cold joints, etc.
- Flexibly deployable post-printing, post-placement, or post-reflow stages.
SAKI BF-Frontier II is an in-line high-res high-speed 2D AOI system for large PCBs up to 460×500mm, featuring 18μm resolution for 0201 and 0.4mm IC defect detection, with a scan time of just 10 seconds.
Why choose this product?
Choose the BF-Frontier II because it helps you meet large-PCB inspection requirements and improve line efficiency while ensuring detection accuracy.
- High-Precision Inspection: 18μm high-resolution color line-scan CCD camera accurately identifies soldering defects on 0201 micro-components and 0.4mm-pitch ICs, effectively screening out defective boards.
- Large Board Compatibility: Supports boards up to 460×500mm with 40mm component clearance on both top and bottom, meeting large-PCB inspection needs.
- High Speed & Efficiency: SAKI linear scanning technology – L-size board scan in just 10 seconds, cycle time approx. 21 seconds, keeping pace with production lines.
- Broad Defect Coverage: Detects common SMT defects including missing components, misalignment, tombstoning, bridging, insufficient solder, and cold joints.
- Flexible Deployment: Can be flexibly installed at multiple stages – post-printing, post-placement, or post-reflow.
In short: the perfect combination of high precision, large-board compatibility, and high efficiency – an ideal choice for high-quality inspection of large PCBs.
How It Works
The working principle of the BF-Frontier II is to capture high-definition PCB images through high-precision optical imaging and high-speed scanning technology, then analyze them in real time using built-in algorithms to identify various SMT defects.
Application Process
- Optical Imaging: Equipped with an 18μm high-resolution color line-scan CCD camera, combined with a large-aperture telecentric lens and a multi-angle LED lighting system to ensure clear, shadow-free images.
- High-Speed Scanning: Utilizing SAKI’s linear scanning technology, it captures multiple images simultaneously in a single scan. An L-size board (460×500mm) can be scanned in approximately 10 seconds.
- Image Processing: After scanning, the system uses multiple algorithms to analyze images, examining component presence, position offset, solder joint shape, etc.
- Defect Detection: Accurately identifies common SMT defects such as missing components, misalignment, tombstoning, solder bridging, insufficient solder, and cold joints, then outputs inspection results.
- Real-Time Feedback: Inspection data is fed back to the line control system in real time, enabling timely process parameter adjustments and closed-loop quality management.
Requirements
- Electric Power Requirement: Single Phase ～100 – 120V / 200 – 240V +/-10%, 50/60Hz, 750VA
- Air Requirement: 0.5MPa, 5L/min (ANR), 73PSI, 0.18CFM
- Usage Environment: 15℃(59F) – 30℃(86F) / 15 – 80% RH (Non-condensing)
- Noise Level: 58.3dB
- Dimensions (W*D*H): 850 × 1340 × 1230mm, 34 × 53 × 49in.
- Weight: Approx. 450kg, 992lbs
What It Is Used For
The BF-Frontier II is used for automated optical inspection of solder paste printing quality, component placement accuracy, and post-reflow soldering quality on large-size PCBs in SMT production lines. It rapidly detects defects such as missing components, misalignment, and solder bridging to ensure product quality and production yield.
Conclusion
Do you provide after-sales service?
- Our professional after-sales service team will quickly resolve any emergencies you may encounter during use.
Warranty period?
- -The entire machine is covered by a one-year warranty, with free technical support provided after that year.
Do you provide installation and commissioning?
- On-site installation and commissioning will incur additional fees, including accommodation and airfare.
Shipping method?
- Typically, shipping is by sea or land. Air freight is more expensive for urgent needs.
Packaging and Delivery Information:
Delivery: Standard equipment is in stock, while less commonly used models require 10-15 days depending on the situation..
Minimum Order: We accept orders for a single machine or mixed orders to suit your needs.
Transportation: Products are shipped either in bulk or via containers, depending on the order size and destination.
Payment Terms: Flexible payment options are available, including L/C, D/A, D/P, T/T, Western Union, and MoneyGram.
Price: Prices are negotiable to ensure you receive the best possible value.
Packaging: We offer both standard export boxes and robust hardwood packages to ensure your order arrives safely and securely.