BH-4500CL Semiconductor Packaging Washer
| Relevant parameters | |||
| Net belt width: | 600mm customizable large size | Power Supply: | 380V50Hz |
| Cleaning speed: | 0-1500mm/min adjustable | Total power: | About 97KW |
| Equipment size: | L4500*W1700*H1650(mm) | Equipment weight: | About 2300kg |
BH-4500CL semiconductor packaging water washer works for pre-mold cleaning. BH-4500CL semiconductor packaging water washer clears flux residue and dust on BGA, SIP and lead frames. BH-4500CL semiconductor packaging water washer uses DI spray to wipe tiny pollutants, protect chips, stabilize packaging yield and serve mass production of consumer & automotive electronics.
- BH-4500CL Semiconductor Packaging Washer Specifications
- Key Features
- Advantages
- Integrated ultrasonic & spray cleaning thoroughly removes flux and solder paste residue without damaging precision packaged components.
- Closed-loop constant temperature and intelligent pressure adjustment fit lead frames, IC trays, COB substrates and multiple carriers.
- Multi-stage recycled deionized water filtration saves water, protects environment and cuts production cost.
- Sealed SUS316L stainless steel chamber prevents dust and secondary contamination, compatible with Class 10,000 clean rooms.
- Capable of 24-hour continuous mass production with stable operation, low failure rate and seamless connection to packaging assembly lines.
- Adopt deionized water circulation cleaning to thoroughly remove flux, solder paste residue and micro-particle impurities.
- Combine spray and gentle ultrasonic cleaning to protect precision components like chips, BGA and QFP from damage.
- Closed-loop constant temperature control prevents thermal deformation and ensures consistent cleaning results.
- Multi-stage water recycling filtration saves water and reduces consumption, complying with workshop environmental standards.
- Fully sealed dustproof chamber avoids secondary contamination, suitable for Class 10,000 clean workshops.
- Intelligent adjustable pressure is compatible with lead frames, IC trays, COB substrates and other carriers.
- SUS316L anti-corrosion liner supports 24-hour continuous mass production with low failure rate.
- High cleaning precision:Combined ultrasonic spraying technology achieves high cleanliness, thoroughly removes fine packaging contaminants without damaging precision chips.
- Strong production adaptability:Intelligent adjustable pressure and temperature fit various packaging carriers, applicable to Class 10,000 dust-free semiconductor workshops.
- Energy-saving, eco-friendly and cost-effective:Recycled water filtration reduces water consumption; constant temperature design cuts long-term operating costs.
- Durable and easy maintenance: SUS316L corrosion-resistant inner tank supports round-the-clock continuous production with low failure rate and simple upkeep.
- Strict cleanliness control:Fully sealed chamber prevents secondary pollution and meets strict cleanliness standards for semiconductor packaging.
Equipment Features
- Designed for high-volume ultra-precision centralized cleaning of advanced semiconductor chips, balancing cleaning efficiency and cleaning quality.
- Adopts medium-low pressure and high-flow design principle to deliver cost-effective and high-efficiency cleaning performance.
- Heated DI water spray cleaning efficiently removes water-soluble flux, dust and foreign contaminants.
- The whole machine is constructed with corrosion-resistant SUS304 stainless steel for long service life.
- Nozzles are made of SUS304 stainless steel with dense arrangement, delivering uniform and large flow under both medium and low pressure.
- Equipped with PLC control system and bilingual Chinese/English graphical interface; programs support easy setup, modification, storage and recall.
Cleaning Process
Loading → Board Isolation → DI Water Pre-Cleaning → Primary DI Fine Cleaning → Secondary DI Fine Cleaning → Final Rinse → Air Knife Blow-off → Hot Air Drying 1 → Hot Air Drying 2 → Unloading
Cleaning Objects
It is used for water-based cleaning of flux residues prior to molding for packaged components including Flip-Chip, SIP, CSP, BGA and Lead Frame.
Why choose this product?
The BH-4500CL Semiconductor Packaging Washer is a professional precision water cleaning equipment specially designed for semiconductor packaging. It features high-efficiency cleaning, damage-free treatment and energy-saving stable operation. Adopting a combined ultrasonic and spray cleaning process, the BH-4500CL Semiconductor Packaging Washer thoroughly removes flux residues, solder paste stains and micro-particle impurities without damaging precision components such as BGA and QFP. Equipped with intelligent constant temperature and pressure regulation systems as well as a water circulation filtration structure, it ensures high cleaning yield while reducing energy consumption and production costs. Fully adapted to dust-free workshop mass production, it serves as an optimal cleaning solution for semiconductor back-end packaging processes.
How It Works
- Purified Water Circulation Supply: The BH-4500CL Semiconductor Packaging Washer adopts a deionized water circulation system to provide ultra-pure cleaning water and avoid secondary contamination.
- Ultrasonic & Spray Combined Cleaning: It integrates high-pressure spray and gentle ultrasonic cavitation to strip stubborn stains and fine dust from component surfaces and tiny gaps.
- Constant Temperature Closed-Loop Control: The stable constant-temperature system prevents thermal deformation of precision packaging materials and guarantees consistent cleaning results for every batch.
- Filtration & Discharging: Wastewater is filtered and recycled through multi-stage purification. Automatic drying is completed after cleaning to deliver dry and impurity-free workpieces.
Application Process
- Power on and perform self-calibration on the BH-4500CL Semiconductor Packaging Washer to confirm normal operation of temperature, pressure and water circulation systems.
- Place workpieces such as lead frames, IC trays and COB substrates neatly into the chamber and close the sealed door.
- Start the fully automatic cleaning program. The equipment automatically completes spraying, ultrasonic cleaning, rinsing and drying processes.
- Take out finished workpieces and check cleanliness. The BH-4500CL Semiconductor Packaging Washer enters standby mode for continuous batch production.
Requirements
Technical & Site Requirements
- The BH-4500CL Semiconductor Packaging Washer must be placed in a flat, dry and Class 10,000 dust-free workshop.
- Stable industrial power supply and purified water supply are required to avoid fluctuating voltage and water pressure that affect cleaning accuracy.
- Reserve sufficient ventilation and heat dissipation space around the equipment, and keep away from strong vibration and intense light interference to ensure stable operation.
Operational Requirements
- Operators must be fully trained on the BH-4500CL Semiconductor Packaging Washer and are prohibited from adjusting parameters without authorization.
- Clean filter components and the inner chamber regularly to maintain water purity and extend equipment service life.
- Place workpieces in standard arrangement without stacking or extrusion to ensure all-round cleaning effect.
What It Is Used For
- Professional post-cleaning for semiconductor packaging substrates, lead frames and IC trays.
- Damage-free precision cleaning for BGA, QFP, COB and other packaged components.
- Suitable for mass cleaning of semiconductor devices applied in automotive, industrial control and consumer electronics industries.
Packaging and Delivery Information:
The BH-4500CL Semiconductor Packaging Washer is fully wrapped with thick vacuum moisture-proof film, fixed inside customized shockproof solid wood crates. Precision electrical control modules are separately packed with shock-absorbing buffer materials. Full no-load debugging is completed before delivery, accompanied by operation manuals, process program USB drives and a full set of spare filter consumables. Sealed dedicated trucks are adopted for logistics transportation. Professional engineers will conduct on-site unpacking, positioning, water & power commissioning upon arrival, deliver operator training, and provide long-term after-sales technical support.
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