BH-3600PP Packaging Cleaning Machine with Corrosion-Resistant PP Chamber
BH-3600PP Corrosion-Resistant PP Chamber Encapsulation Cleaning System is specifically designed for advanced semiconductor packaging. The entire machine is constructed from imported PP material, offering excellent acid and alkali resistance and high cleanliness. The equipment utilizes high-flow spray cleaning to efficiently remove flux and other contaminants, and is equipped with a PLC intelligent control system and a condensation recovery system, balancing high productivity with low operating costs.
- Integrated corrosion-resistant PP chamber, acid & alkali resistant, compatible with alkaline cleaning fluid
- High-flow spray removes flux and micro contaminants efficiently
- Chemical condensation recycling reduces cleaner consumption and operating cost
- Real-time DI water monitoring ensures consistent ultra-high cleanliness
- PLC bilingual automatic control, gentle cleaning protects delicate semiconductor components
- BH-3600PP Packaging Cleaning Machine with Corrosion-Resistant PP Chamber Specifications
- Key Features
- Advantages
| Relevant parameters | |||
| Net belt width: | 500mm customizable large size | Power Supply: | 380V50Hz |
| Cleaning speed: | 0-1500mm/min adjustable | Total power: | About 80KW |
| Equipment size: | L3600*W1700*H1650(mm) | Equipment weight: | About 1800kg |
- The entire machine is constructed from imported PP (polypropylene) material, offering excellent acid and alkali resistance, high cleanliness, and non-particulating operation.
- High-flow spray cleaning method effectively penetrates tight gaps beneath components.
- Equipped with a PLC control system and graphical user interface, supporting process program setting and recall.
- Optional DI water resistivity monitoring system and chemical stage condensation recovery system.
- Compatible with both acidic and alkaline cleaning agents, offering a wide range of applications and eliminating the need to change equipment when switching cleaning chemistries.
- Efficiently removes flux and other contaminants, ensuring the cleanliness and reliability of packaged devices.
- Intelligent control simplifies operation, reduces human error, and improves consistency in batch cleaning.
- Condensation recovery system reduces cleaning agent consumption, effectively lowering long-term operating costs.
Cleaning Objects
Flux residues and organic/inorganic contaminants remaining after soldering of semiconductor devices including IGBT, IPM, CSP, SIP, Flip-Chip and Lead Frame.
Equipment Features
- Suitable for high-volume ultra-precision centralized cleaning of advanced semiconductor chips, balancing cleaning efficiency and cleaning performance.
- Adopts high-flow spray cleaning to efficiently remove flux and other organic/inorganic contaminants trapped in bottom gaps.
- Equipped with DI water resistivity monitoring system; real-time concentration monitor is available as an optional upgrade.
- Fitted with chemical section condensation recovery system to greatly reduce cleaner consumption and lower operating costs.
- Constructed entirely from imported PP material with high cleanliness, free of dust and impurities, compatible with acidic and alkaline cleaning agents.
- PLC control system with Chinese/English graphical operation interface allows convenient program setup, modification, storage and recall.
Cleaning Process
Board Loading → Isolation → Pre-Chemical Cleaning → Chemical Cleaning 1 → Chemical Isolation → Air Knife Isolation → DI Water Pre-Rinse → DI Water Rinse 1 → Final Rinse → Isolation → 1-Stage High-Pressure Cold Air Blow → 2-Stage High-Pressure Hot Air Blow → 3-Stage High-Pressure Hot Air Blow → Board Unloading
Why choose this product?
The BH-3600PP is designed for advanced semiconductor packaging, balancing high cleanliness with high throughput. Built from imported PP material, it offers non-particulating operation and compatibility with both acidic and alkaline cleaners—no need to change equipment when switching chemistries. Equipped with condensation recovery and DI water resistivity monitoring, it reduces cleaner consumption and lowers long-term operating costs.
How It Works
- Utilizes a high-flow spray cleaning method, delivering cleaning solution evenly onto component surfaces and into bottom gaps through a high-pressure spray system to efficiently remove contaminants.
- Equipped with a PLC control system and a Chinese/English graphical user interface, allowing cleaning programs to be easily set, modified, stored, and recalled.
- The cleaning process encompasses multiple stages including chemical cleaning, DI water rinsing, fine rinsing, and hot air drying, ensuring stable and reliable cleaning performance.
Application Process
- Board loading → Chemical cleaning stage → Spray rinsing → DI water pre-rinse → DI water rinse → DI water fine rinse → High-pressure hot air drying → Board unloading
- The entire cleaning process operates fully automatically, with the PLC system precisely controlling parameters at each stage.
- The conveyor belt width is 500mm, with customizable larger sizes available to accommodate different batch production capacity requirements.
Requirements
- Provide special eco-friendly cleaning agents for semiconductors and supply qualified ultrapure water.
- Install standard exhaust systems and waste liquid collection & treatment devices inside the workshop.
Technical & Site Requirements
- The installation floor shall meet load-bearing requirements with reserved access for equipment maintenance; the workshop needs a dust-free clean environment with constant temperature and humidity.
- Stable three-phase industrial power, compressed air and deionized water supply are required, together with supporting waste liquid pipelines and ventilation purification systems.
Operational Requirements
- Operators must receive equipment operation training and become familiar with the PLC graphical user interface.
- Cleaning programs must be set and optimized according to product type and contaminant characteristics.
- The chemical stage condensation recovery system requires regular inspection to ensure cleaning agent recovery efficiency.
- Regular monitoring of DI water resistivity is recommended to ensure rinse water quality meets standards.
- Routine equipment maintenance includes spray nozzle cleaning, filter replacement, and PP chamber surface cleaning.
What It Is Used For
| Device type | |
| IGBT | Insulated Gate Bipolar Transistor |
| IPM | Intelligent Power Module |
| CSP | Chip Scale Package |
| SIP | System In Package |
| Flip-Chip | Flip-Chip |
| Lead Frame | Lead Frame |
Packaging and Delivery Information:
The BH-3600PP Corrosion-Resistant PP Chamber Packaging Cleaning Machine is packed in moisture-proof and shockproof wooden cases, with vulnerable electric control and spray parts individually cushioned. Special logistics delivery is adopted; professional engineers provide on-site installation, commissioning, operation training, complete warranty and lifelong technical support after arrival.
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