What It Is Used For?

• Removing residual flux, solder pastes, and organic pollutants from component surfaces, gaps, and internal structures
• Eliminating particles, oils, and chemical residues that could cause electrical faults, poor connection, or reduced product lifespan
• Ensuring components meet strict cleanliness standards required for subsequent processes like coating, testing, and packaging
• Improving product reliability, stability, and performance in final electronic applications
• Supporting high-quality manufacturing for products used in power electronics, communications, consumer electronics, and industrial control systems

Cleaning Scope

• IGBT modules
• Integrated Circuits (IC)
• Integrated Power Modules (IPM)
• Chip Scale Packages (CSP)
• System in Package (SIP)
• Flip-Chip assemblies
• Lead Frame structures
  

  It thoroughly eliminates residual flux and organic contaminants left after soldering and packaging processes, meeting strict industry cleanliness requirements.

Key Features

1. Optimized for Advanced Semiconductor Manufacturing: Designed for ultra-fine, high-concentration cleaning of semiconductor chips in large batches. It delivers excellent cleaning results while maintaining high processing efficiency, perfectly matching the production rhythm and quality standards of advanced packaging processes.
2. High-Efficiency Cleaning Technology: Adopts a high-flow spray cleaning method. This design enables deep cleaning of tiny gaps and complex structural surfaces, completely removing organic pollutants and residual impurities that are difficult to reach with ordinary cleaning methods.
3. Intelligent Monitoring System: Equipped with a DI water resistivity monitoring system, which can track and display the concentration and status of cleaning solution in real time. This ensures consistent cleaning quality and allows timely adjustments to process parameters.
4. Cost-Saving Design: Integrated with a cleaning solution condensation recovery system. It significantly reduces the consumption of cleaning agents, lowers production costs, and also supports environmental protection goals by reducing waste discharge.
5. Durable and Reliable Construction: The entire machine is made of corrosion-resistant SUS304 stainless steel material. It has strong adaptability to acidic and alkaline cleaning agents, ensuring long-term stable operation and extending the service life of the equipment.
6. User-Friendly Control System: Uses a PLC control system with both Chinese and English operation interfaces. The program is designed with clear logic and simple operation; users can easily set, modify, store, and call up different cleaning processes according to production needs.

How It Works?

1. Conveying and Isolation: Components are placed on the mesh belt and move automatically through each section. Isolation zones prevent cross-contamination between different cleaning stages, ensuring each process works independently and effectively.
2. Chemical Cleaning: Special cleaning agents are sprayed at high flow and pressure. These chemicals dissolve and loosen flux, organic residues, and dirt from surfaces and crevices. The system monitors solution quality in real time to maintain consistent cleaning strength.
3. Rinsing Process: After chemical treatment, components go through multiple rinsing steps with deionized (DI) water. Pre-rinsing removes most chemical residues, while fine rinsing and final rinsing ensure all traces of cleaning agents and remaining particles are completely washed away.
4. Blow and Drying: High-pressure air blows off excess water and moisture from surfaces and gaps. Multiple stages of high-temperature hot air drying then remove any remaining moisture, leaving components completely dry and residue-free.
5. Recovery and Circulation: Used cleaning solution is collected, condensed, and filtered for reuse. This system reduces waste and keeps operating costs low while maintaining cleaning performance.

Application Process

1. Preparation: Confirm component type, size, and cleaning requirements. Select or set the appropriate program on the control panel, adjusting speed, temperature, and solution concentration as needed. Prepare and check cleaning agents, DI water supply, and power connection.
2. Loading: Place components evenly and stably on the inlet mesh belt, ensuring they are properly positioned to avoid blockage or overlapping during transport.
3. Automatic Processing: Components move through all stages automatically: isolation → chemical cleaning → multiple rinses → air blow → hot air drying. The system controls every parameter accurately without manual intervention.
4. Monitoring and Inspection: Operators monitor the process through the interface and check real-time data like water resistivity. After processing, inspect cleaned samples to confirm cleanliness meets required standards.
5. Unloading and Storage: Collect fully cleaned and dried components at the outlet, then transfer them to the next production stage or storage area.
6. Maintenance: Regularly clean filters, check fluid levels, and maintain recovery and drying systems to keep the machine performing well.

Requirements

Operational Requirements

• Power Supply: Stable 380V, 50Hz power input with proper grounding and protection devices to ensure safe and continuous operation.
• Water Supply: Reliable supply of high-quality deionized water with stable resistivity levels, meeting the machine’s technical specifications.
• Environment: Installed in a clean, well-ventilated, temperature-controlled production area, free from excessive dust, corrosive gases, or humidity that could affect performance or safety.
• Personnel: Operators must be trained to use the control system, understand process parameters, and follow safety and maintenance guidelines.
• Consumables: Use only compatible cleaning agents and chemicals recommended for semiconductor applications to avoid damage or contamination.

Technical Requirements

• Components to be cleaned must match the allowed size and weight range; oversized or irregular items may need customized settings or modifications.
• Ensure proper connection and functioning of drainage, exhaust, and waste treatment systems as required by environmental regulations.
• Regular calibration of monitoring sensors and instruments to maintain accuracy of measurements.

Product Advantages:

1. Superior Cleaning Quality: The combination of high-flow spray and multi-stage chemical + pure water cleaning ensures that even micro-sized gaps and complex structures are thoroughly cleaned, meeting the strictest cleanliness standards in the semiconductor industry.
2. High Production Efficiency: Supports continuous, large-batch processing with adjustable speed. It adapts to different production capacities and helps enterprises improve overall production throughput.
3. Lower Operating Costs: The cleaning agent recovery system greatly reduces material consumption. At the same time, durable construction minimizes maintenance and replacement costs, bringing long-term economic benefits.
4. High Stability and Safety: Made of anti-corrosion materials and equipped with real-time monitoring functions, it prevents equipment damage and abnormal quality issues, ensuring stable and safe long-term operation.
5. Strong Compatibility and Flexibility: Suitable for multiple types of semiconductor products, with customizable specifications and adjustable processes. It can be adapted to different cleaning requirements and product specifications.
6. Easy Operation and Management: Dual-language interface and programmable functions reduce the requirements for operator skills, simplify production management, and support standardized production.

Conclusion

For inquiries, please contact us at +8613537875415 or Lizzy@smtlinemachine.com. Visit us at Xintian Industrial Area, Baoan, Shenzhen City, China.

Do you provide after-sales service?

• Our professional after-sales service team will quickly resolve any emergencies you may encounter during use.

Warranty period?

• -The entire machine is covered by a one-year warranty, with free technical support provided after that year.

Do you provide installation and commissioning?

• On-site installation and commissioning will incur additional fees, including accommodation and airfare.

Shipping method?

• Typically, shipping is by sea or land. Air freight is more expensive for urgent needs.

Packaging and Delivery Information:

Delivery: Standard equipment is in stock, while less commonly used models require 10-15 days depending on the situation..

Minimum Order: We accept orders for a single machine or mixed orders to suit your needs.

Transportation: Products are shipped either in bulk or via containers, depending on the order size and destination.

Payment Terms: Flexible payment options are available, including L/C, D/A, D/P, T/T, Western Union, and MoneyGram.

Price: Prices are negotiable to ensure you receive the best possible value.

Packaging: We offer both standard export boxes and robust hardwood packages to ensure your order arrives safely and securely.

If you have any other questions, please contact us to obtain more information