Why choose this product?

• Durable & reliable ESD performance to cut scrap cost: Integrally molded conductive PPE side panels never lose anti-static function from peeling coating. Stable surface resistance of 10⁴~10⁶Ω eliminates ESD damage to BGAs and tiny chips, meeting SGS & RoHS dust-free workshop standards.
• Tool-free quick width adjustment for higher changeover efficiency: Gear buckle design allows fast PCB width switching without tools, ideal for mixed production. Smooth slot edges prevent board scratches and component drop-off during handling.
• Heavy-duty composite frame for long-hour mass production: Thickened carbon steel & aluminum frame supports stacking transport. Hollow ventilated base speeds up cooling of post-reflow PCBs and reduces warpage. Oil and dust resistant for easy daily cleaning, suitable for 24-hour non-stop operation.
• Standard universal size compatible with full SMT lines: Uniform dimension fits all mainstream automatic PCB loaders and unloaders without modification, widely adopted in consumer, automotive and new energy electronics factories.
• Dual temperature options fit all production processes: Standard 80℃ and high-temperature 200℃ versions are available for cooling tunnels and aging rooms. With 50 slots, 50–250mm adjustable width, it works with all 0.8–3.5mm thin/thick PCBs and panel boards.

How It Works

1. ESD Protection Principle: The side panels are integrally molded permanent conductive PPE filled with evenly distributed conductive particles to form a continuous conductive path. Static electricity generated during PCB handling is quickly discharged to ground via conductive panels and metal frame, keeping surface resistance stable at 10⁴~10⁶Ω. It prevents static buildup that damages BGAs and micro components. Unlike coated racks, it will not lose ESD function due to coating peeling and meets SGS & RoHS dust-free workshop standards.
2. PCB Storage & Width Adjustment Principle: The gear buckle adjustment mechanism drives two side baffles synchronously to adjust the slot width from 50–250mm without tools. Equipped with 10mm evenly spaced rounded slots, it holds PCBs of 0.8–3.5mm thickness separately to avoid scratches and component falling.
3. Load-bearing & Heat Dissipation Principle: The composite frame consists of thick galvanized carbon steel base and aluminum columns, which evenly bear weight and allow stacking. Hollow ventilated base facilitates air circulation to dissipate heat from post-reflow PCBs and reduce board warpage, meanwhile resisting flux dust accumulation for easy cleaning.
4. Production Line Matching Principle: Standard overall dimensions fit mainstream SMT automatic loaders and unloaders. The machine identifies the magazine rack and automatically transfers PCBs, realizing automatic PCB buffering and circulation through printing, mounting, soldering and inspection processes.

Application Process

1. Width Adjustment Before Loading: Adjust the slot width by pressing the gear buckle and sliding side baffles according to PCB width, lock after setting. No tools required.
2. PCB Loading: Insert PCBs smoothly into rounded slots with boards separated individually to prevent scratch and component drop. Max capacity: 50 pcs PCB (0.8–3.5mm thickness).
3. Continuous ESD Discharge During Operation: Static electricity generated by PCB friction is steadily dissipated through conductive PPE panels and metal frame, avoiding ESD damage to micro chips.
4. Heat Dissipation for Post-Reflow Storage: Hollow ventilated base accelerates heat exchange to reduce PCB warpage. The 200℃ high-temperature version fits cooling tunnels and aging rooms.
5. Automatic Circulation on SMT Line: Filled magazine rack feeds into automatic PCB loader. The machine automatically picks PCBs and delivers them to printing, mounting and inspection stations.
6. Empty Rack Collection & Stacking: After all PCBs are unloaded, empty racks can be stacked to save storage space. Clean flux and dust on surface for repeated circulation.

Requirements

Environmental Requirements

• Temperature & Humidity: Standard 80℃ version works under 18–25℃, 45%–60%RH; 200℃ high-temperature model only bears short-time post-reflow heat, cannot stay above 200℃ continuously. Humidity below 40% will boost static generation, humidifier is required.
• ESD Workshop Requirement: Must be used in EPA protected area with grounded conductive floor and shared ESD ground bus. Metal base of rack shall connect to ground fully to discharge static, comply with ANSI/ESD S20.20, SGS & RoHS.
• Cleanliness Standard: Applicable for Class 100,000 / 10,000 dust-free workshops, away from corrosive gas, heavy dust and flux residue; regular slot cleaning is mandatory.

Storage and Storage Conditions

• Store idle racks on dry, ventilated ESD racks, avoid long-term damp & open-air storage.
• Keep away from open fire and heat sources; ambient temp shall not exceed 80℃ for standard version.
• Separate storage from non-ESD plastic & foam materials.

Operational Requirements

• Operator ESD Rules: Staff must wear grounded anti-static uniform, shoes and wrist strap before handling PCBs; bare hand contact with BGA & chips is prohibited.
• Width Adjustment Standard: Adjust slot width via gear buckle and fully lock before transfer. Unlocked baffles will scratch PCBs during moving.
• Stack & Transport Rule: Only empty racks can be stacked; fully loaded racks are not stackable. Handle gently without heavy impact to avoid frame & conductive panel damage.
• Daily Maintenance: Clean slot dust and flux residue daily; test surface resistance (10⁴~10⁶Ω) regularly. Replace rack if panels crack or ESD performance fails.

What It Is Used For

• ESD protection for sensitive circuit boards: Constant static dissipation prevents electrostatic damage to PCBs, BGAs and micro chips, cutting production scrap rate and meeting ESD standards of dust-free workshops.
• Standard classified PCB storage: Equidistant slots separate circuit boards to avoid scratches and component falling off, neatly storing bare PCBs and semi-finished PCBA products.
• Automatic circulation on SMT production lines: Compatible with automatic PCB loaders and unloaders to realize automated board transfer among printing, mounting, reflow soldering and inspection stations.
• Support flexible mixed production: Adjustable width fits various PCB sizes for mass mixed production of consumer, automotive and new energy electronics, shortening production changeover time.
• Heat dissipation buffer after reflow soldering: Hollow ventilated base accelerates cooling of hot PCBs to reduce warpage; high-temperature variant is applicable for cooling tunnels and aging rooms.
• Workshop transit and space-saving storage: Empty racks can be stacked to save warehouse space, convenient for mass workpiece handling and standardized 5S workshop management.

Conclusion