Best Semi-Automatic Dip Soldering Machine
The ZB series semi-automatic dip soldering machine features robotic arm operation with integrated flux spraying, PCB preheating, precision dip soldering, controlled cooling, fume extraction, and automatic dross collection.
This dip soldering system accommodates diverse substrates (FR4, aluminum, ceramics) and axial/radial components, producing void-free IPC-compliant solder joints at 30% lower operating costs than manual processes.
- Automatic spray system
- Efficient preheating and drying
- Temperature intelligent control
- Second-hand recycled tin slag
- Easy installation and commissioning
- Specification
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| Model | CN-3020ZB | CN-3525ZB |
|---|---|---|
| Solder Pot | 300×200×70mm | 350×250×70mm |
| Tin Capacity | 30kg | 45kg |
| Power | 2200W | 2700W |
| Throughput | 960~6720 boards/8h | Fits larger boards |
| Power Supply | AC 220V ±10% 50Hz | Same as left |
CN-757 Semi-Automatic Dip Soldering Machine Core advantage
I.Core Features & Technological Highlights
- All-in-One Process Design
- 4-Station Integration: Completes flux spraying, preheating, soldering, and cooling in one unit. Supports single/double-sided & multilayer PCBs, compatible with long/short-lead components.
- Smart Fluid Control: Patented float transition tank system (Patent: CN202517163U) auto-adjusts flux level, ensuring uniform spray and reducing manual refills by 30%.
- Precision Temperature Control & Efficient Soldering
- PID Microcomputer Control: 0~500°C adjustable range (±1% accuracy), real-time temperature display with auto-calibration. Energy and tin-saving.
- 30° Tilt Soldering Tech: Parallel immersion with forced air cooling delivers smooth, void-free joints. Shock resistance rivals wave soldering.
- Ergonomic & Eco-Friendly Operation
- Dual Spray Modes: Button/foot pedal control for flexible production.
- Built-in Eco System: Tin dross recycling tray + 5.5m³/min exhaust for rapid fume extraction, meeting green manufacturing standards.
II. Enhanced Technical Specifications
| Parameter | Detail |
|---|---|
| Flux Spray System | – Nozzle Type: Stainless steel fan-shaped mist nozzle (0.3mm aperture) – Spray Accuracy: ±0.5ml/board, coverage ≥95% |
| Preheating Zone | – Heating Method: Far-infrared ceramic tubes – Zone Length: 300mm (ZB3020BG)/350mm (ZB3525BG) – Heating Rate: 3℃/s (RT→150℃) |
| Solder Pot Material | – Titanium Grade: TA1 Grade 2 (ASTM B265) – Anti-Oxidation Layer: Micro-arc oxidation coating (hardness ≥800HV) |
| Cooling System | – Adjustable Airflow: 3~8m³/min – Cooling Gradient: 150℃→60℃ ≤15s (ambient 25℃) |
| Safety Certifications | CE EMC/LVD (EN 61010-1), RoHS 2.0, Grounding Resistance ≤0.1Ω |
III. Smart Control & Scalability
Digital HMI
7-inch touchscreen: Real-time monitoring (temp curve/production count/error codes for overload/overtemp/low-fluid)
Recipe Storage: 20 programmable profiles (preheat time/immersion depth/cooling intensity)
Industry 4.0 Ready
RS485 interface (Modbus protocol) for MES integration
Optional IoT module: Remote diagnostics + consumables usage analytics via cloud
IV. Process Performance Benchmark
| Metric | Manual Soldering | ZhengBang Machine | Improvement |
|---|---|---|---|
| Joint Consistency | ±40% | ≥98% | 58% defect reduction |
| Dross Generation Rate | 15~20% | ≤8% | Saves ¥4,200/month* |
| Operator Training Cycle | 2 weeks | 2 hours | 70% labor cost reduction |
| *Based on 50,000 boards/month |
Scenario-Based Dip Soldering Solutions
Case 1: Automotive ECU
Challenge: Vibration-resistant joints (ISO 16750)
Dip Soldering Solution: 30° tilt immersion + dual-channel cooling → shear strength ≥25N/mm²
Case 2: LED Aluminum PCB
Challenge: Voiding on high-thermal-conductivity substrates
Dip Soldering Solution: 150℃ preheat (90s) + 255±2℃ solder pot control
Value-Added Dip Soldering Options
- Quick-Change Kit: Adjustable rails (50~400mm) + titanium fixtures
- Post-Solder Inspection: AOI interface + cross-section analysis templates
- Green Upgrade: Nitrogen-assisted soldering (O₂≤100ppm) + halogen-free flux
Dip Soldering Machine FAQ
Q1: How does your dip soldering machine achieve ≥98% joint consistency?
*A: Our patented 30° tilt immersion technology ensures uniform solder flow in the dip soldering process, while PID temperature control (±1%) and forced-air cooling eliminate voids. IPC-A-610G Class 3 certification validates consistency across 10,000+ **dip soldering cycles*.**
Q2: Can this dip soldering machine handle high-density PCBs?
*A: Yes. The 0.3mm flux nozzle enables precision dip soldering for 0201 components. Adjustable immersion depth (1-10mm) prevents tombstoning, while ceramic preheating protects BGAs during **soldering immersion*.**
Q3: What’s the ROI vs wave soldering?
*A: Our dip soldering system generates 1/20th the cost and ≤8% dross – most clients break even in <6 months. Example: Vietnam LED factory saved $15,800/year on tin with **automated dip soldering*.**
Q4: Is dip soldering machine training complicated?
*A: No. The 7-inch touchscreen offers one-touch presets – 95% achieve stable dip soldering operation within 2 hours (video manuals included).*
Q5: How to maintain the titanium solder pot?
*A: Our dip soldering equipment uses TA1 titanium with micro-arc oxidation coating. Simply remove slag with non-abrasive tools – corrosion-resistant even with Sn99.3Cu0.7 lead-free **dip soldering*.*
