High-end GKG SMT PRINTER

The GT++ fully automatic, high-performance solder paste printer is not only suitable for applications in laptops, aerospace, motherboards, and mobile phones, but is also compatible with key growth sectors such as semiconductors and Mini LEDs, meeting the printing demands of fine pitch, multiple solder joints, and demanding features.

With accuracy of ±17um@6o with a CPK>2.0 standard, it also integrates high-speed mode, flexible wiring layout (BTB+HTH), and intelligent options, maximizing equipment capabilities and providing an optimal customer experience.

 

  • Max PCB Size :510*510mm
  • Board thicknes: 0.4~6mm
  • Camera type: 1.3 megapixel
  • Transport direction:One stag
  • Fast delivery.
Performance
Repeated Positioning Accuracy±10um@60,CPK>2.0
Repeated Printing Precision±17um@6 o,CPK>2.0
Excluding cleaningand printing<7.5 sec
Processing CT4min
Line change CT2min
Laminate Processing Parameters
Maximum Laminate Dimension510*510mm (optional upgrade to:610*510mm)
Minimum Laminate Dimension50*50mm
Laminate Thickness0.4-6mm
Mechanical Range of Capture528*510mm (optional upgradeto:590*510mm)
Maximum Laminate Weight5kg
Marginal Gap ofLaminate2.5mm
Height over the Top25mm
Transmission Height900 士40mm
Transmission SpeedControl by section, 1500mm/s (Max)
Way of TransmissionOne-section transmission guide rail
Transmission DirectionFrom left to right
From right to left
Same in and out
Laminate Support MethodMagnetic thimble (65mm)
Spacer blocks of equal height(65mm)
Self adjustable jacking platform
Laminate ClampingSelf-retractable upward pressing sheet
Flexible side clamps
vacuum suction function
Printing Parameters
Printing Speed10-200mm/sec
Printing Pressure0.5-20Kg
Printing ModeSingle or double squeegee printing
squeegee TypeRubber squeegee’steel squeegee langle: 45/55/60)
Stripper Distance0-20mm
Stripper Speed0-20mm/sec
Size of Steel Mesh Frame470*370mm~737*737mm (Thickness:20-40mm)
Positioning Method of Steel MeshAutomatic positioningin Y direction (compatible with manual compensation adjustment
Printing Parameters
Printing Speed10~200mm/sec
Printing Pressure0.5~20KG
Printing Mode
Scraper TypeSingle ordouble scraper printing
Stripper Distance0-20mm
Stripper Speed0-20mm/sec
Size of Steel Mesh Frame437-737MM
Positioning Method of Steel MeshAutomatic positioning in Y direction (compatible with manual compensation adjustmenty
Cleaning Parameters
Cleaning MethodDrywiping, wet wiping, vacuum
High Speed CleaningIntegral & back and forth cleaning
Cleaning SystemSide spray type
Cleaning StrokeGenerated automatically based on the length and width ofthe laminate
Cleaning PositionRear
Cleaning Speed10-200mm/sec
Consumption of Cleaning FluidGenerated automatically, Manually adjustable
Consumption of Cleaning PaperGenerated automatically. Manually adjustable
lmage Parameters
Field of visian of lmage10*8MM
Camera type1.3 megapixel digital camera
lmage Pickup SystemUp-down imaging, stepless adjustment of light source
Capture CT100ms
Type of Datum PointDatum point ofstandard shapes
Suchas circle,square,rhombus,cross
Bonding pad and special-shaped
Mark Size0.15-5mm
Number of MarksMax : 4pCs
Numberof Foal Proof PointsMax : 1pcs
Machine Parameters
Power RequirementAC:220 士10%,50/60Hz 2.2KW
Requirement of Compressed Air4-6Kgf/cm
Gas ConsumptionAbout 5L/min
Temperature ofWorking Environment-20°C~+45C
Humidity of Working Environment30%-60%
Machine Hieight (excluding tricolour light)1500(H)mm
Machine Length1240(L)mm
Machine Width1410W)mm
Machine Weight ApproxApprox:1100Kg

The GT++ high-performance, fully automatic solder paste printer is a global bestseller. One of its strengths lies in its industry-leading capabilities, encompassing all electronic products. Furthermore, its printing processes are not limited to solder paste, FLUX, and silver paste processes; it is also fully compatible with silicone, red glue, ink, and adhesive processes. This allows customers to purchase a single GT++ machine and gain access to the potential for multiple process technologies.

A second advantage lies in the GT++ high-performance, fully automatic solder paste printer, which, while maintaining both performance and output efficiency, is limited to substrate sizes of 510*510mm, meeting a wide range of customer needs. It can also be upgraded to 610*510mm substrates, enabling customers to achieve a higher return on investment with lower costs.

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