Value for money is Reflow oven
CNSMT E-Series Compact Reflow oven
Engineered for SMEs in PCB manufacturing, this innovative system addresses the dual demands of high-efficiency reflow soldering and eco-friendly production.
Featuring a turbulence-optimized solder reflow design and intelligent control, it delivers exceptional defect-free soldering performance in a space-saving footprint—redefining precision standards with >99% first-pass yield.
- Scenario-based pain point strikes
- Authoritative endorsement of data
- Modular value
- Cost visualization
- Zero-risk transformation
- Why choose us?
- Feather
- Download
Energy-Efficient Precision Solution for Electronics Assembly
Engineered for small-to-medium PCB production, reducing dross oxidation by 40% with energy consumption surpassing industry standards.
HNY-8760E-XD Small reflow soldering system:
Energy-Efficient Precision Solution for Electronics Assembly
Engineered for small-to-medium PCB production, reducing dross oxidation by 40% with energy consumption surpassing industry standards.
Amid the dual trends of efficiency and eco-friendliness in electronics manufacturing, CNSMT presents the HNY-8760E-XD Small reflow soldering machine – a decade-refined solution tailored for small/medium PCB manufacturers. Featuring innovative molten tin flow dynamics and an intelligent control system, it redefines precision soldering performance benchmarks.
🔋 Core Advantages
🌟 Energy-Efficient Reflow Soldering
Smart Eco-Mode: Optically activated reflow zones minimize flux consumption
Thermal Optimization: Dual-layer insulation reduces preheat zone heat loss by 35%
On-Demand Heating: 6 independently controlled reflow zones (max 300°C) cutting nitrogen usage
🖥️ Intelligent Reflow Control
Mitsubishi PLC + 10″ Touchscreen: One-touch reflow profile recall
21-Point Diagnostics: Real-time thermocouple/heater fault monitoring
Scheduled Production: Auto-preheating eliminates standby consumption
🛠️ Precision Reflow Structure
Modular Conveyance: Thermal-compensated alloy mesh belt (100k+ cycles)
Closed-Loop Flux System: Stepper-driven spray (±0.1μL/mm² accuracy)
Multi-Zone Synergy: 12 thermocouples ensure ±1℃ reflow zone uniformity
Technical Specifications
The E Series integrates patented technologies to deliver professional performance in a compact footprint:
| Model | |
| Dimensions | 3500*710*1450 |
| Gross weight | 1000Kg |
| Number of heating zones | Above 6 Below 6 |
| Heating zone length | 1980mm |
| Heating method | Small circulation heating |
| Number of cooling zones | 1(built-in) |
| Cooling zone length | 500mm |
| Cooling method | Air Cooling |
| Machine color | Computer White |
| Air volume requirements | 10 M3/Minx2 toroughfare |
| Hearth open | Manual |
| Shipping Part Parameters | |
| Mode of transport | Chain + webbing/webbing |
| Transport belt width | 350mm |
| Rail width adjustment range | 50-250mm |
| Transport connection height | 900±20mm |
| Transport speed | 300-2000mm/min |
| Shipping direction | L-R(optional; R-L |
| Control section parameters | |
| PCB 3-point temperature difference | ±1.5℃ |
| Temperature Control Accuracy | ±1℃ |
| Adjacent temperature difference | The haeting zone is around 50 degress,and the heating and welding zones are around 100 degress |
| Temperature control range | room temperature~350℃ |
| Temperature control method | Closed loop control + SSR |
| Power supply | 3-phase 5-wire system |
| Total Power | 24KW |
| Nomal working power consumption | Settable |
| Starting power | 6KW/12KW |
| Abnormal alarm | Temperature alam (ultra-high and ultra-low temperature after constant temperature |
⚙️ Reflow Soldering Applications
| Industry | Technical Edge | Performance |
|---|---|---|
| LED Lighting | Progressive thermal profile | Prevents LED bead thermal shock |
| Power Modules | Bottom heating + forced convection | Penetrates 15mm PCBs without cold joints |
| Consumer Electronics | N₂-protected reflow (O₂<500ppm) | Meets smartphone PCBA zero-void requirements |
| Automotive | -40℃~150℃ reliability validated | IPC-A-610 Class 3 compliant |
Related products
❓ Reflow Operation Guide
Q1: First startup after transportation?
Level calibration: ≤0.5°/m inclination
Empty preheating: 150℃ for 30min (dehumidification)
Zone test: Measure reflow zone variance (<±2℃)
Q2: Resolving soldering defects?
Solder balls: ↑ Preheat rate (1.5-2℃/s recommended) OR ↓ peak temperature
Cold joints: ↑ Reflow zone dwell time (60-90s) OR ↑ convection speed
Severe oxidation: Activate N₂ shield (O₂<1000ppm recommended)
Q3: Suitable production scenarios?
R&D labs: 220V±10%, ≤5kW peak load
High-mix low-volume: <10min reflow profile changeover
Mid-volume lines: 800-1200pcs/day (board length ≤200mm)