CNSMT-3D-SPI SinicTek Inline SMT/PCB Inspection Machine
CNSMT-3D-SPI SinicTek Inline SMT/PCB Inspection Machine is applied to solder paste inspection on SMT production lines for PCBs. CNSMT-3D-SPI SinicTek Inline SMT/PCB inspection machine accurately detects solder paste volume, height and area. CNSMT-3D-SPI SinicTek Inline SMT/PCB inspection machine identifies insufficient solder, excess solder, offset and other defects. CNSMT-3D-SPI SinicTek Inline SMT/PCB inspection machine ensures PCB quality and improves SMT production yield.
- 3D High-precision Inspection: Micron-level measurement for solder paste parameters, detects various printing defects accurately.
- Superior Imaging: Tricolor light source & high-definition camera, compatible with multiple substrates, anti-shadow interference.
- AI Intelligent Algorithm: Intelligent defect classification, low false alarm rate, automatic bad board identification.
- Easy & Efficient Operation: Fast programming and one-key operation, reduce downtime.
- Line Interconnection: Connect with production equipment and MES system for data traceability and analysis.
- Stable & Versatile: Dynamic compensation design, inline structure, fits all kinds of PCBs and full SMT lines.
- CNSMT-3D-SPI SinicTek Inline SMT/PCB Inspection Machine Specifications
- Key Features
- Advantages
| Parameters | |||
| Technology Platform | Standard Type-B/C | Dual track Type-B/C | super platform |
| Series | S series/Hero/ltra | S series/Hero/ltra | 1.2-meter/1.5-meter series |
| Model | S8080/S2020/Hero/Ultra | S8080D/S2020D/HeroD/UltraD | L1200/DL1200/DL1500 |
| Measurement Principle | 3D white light PSLM PMP(Programmable Spatial Light Modulation, Phase Measurement Profilometry | ||
| Measurements | volume、acreage、height、XYoffset,shape | ||
| Detection of Non-Performing Types | missing print,insufficient tin, excessive tin, bridging, offset, mal-shapes, surface contamination | ||
| Lens Resolution | 4.5um/5um/6um/8um/10um/12um/15um/16um/18um/20um (Optional for different camera models) | ||
| Accuracy | XY (Resolution): 10um | ||
| Repeatability | height: <lum (4 Sigma) ;volume/acreage: <1% (4 Sigma)； | ||
| Gage R&R | <<10% | ||
| Inspection Speed | 0.35sec/FOV-0.5sec/FOV (determined according to actual configuration) | ||
| Quanlity of Inspection Head | Standard 1, optional 2, 3 | ||
| Mark-point Detection Time | 0.3sec/piece | ||
| Maximun Meauring Head | ±550um (+1200um as option) | ||
| Maximun Measuring Height of PCB Warp | ±5mm | ||
| Minimun Pad Spacing | 100um (with a pad height of 150um as the reference) 80um/100um/150um/200um (determined according to the actual configuration) | ||
| Minimum element | 01005/03015/008004 (optional) | 01005/03015/008004 (optional) | 0201 |
| Maximun Loading PCB Size(x*Y) | 450x500mm (B) 470x500mm (C) 630x686mm (measurable range 630x550mm large platform) | 450×310+450×310 (B) 470×310+470×310 (C) 630×310+630×310 (large platform) | 1200x650mm (measuring range 1200x650mm in one section) 600x2x650mm (with a measuring range of 1200x550mm in two sections) |
| Conveyor Setup | front orbit (back orbit as option) | 1 front orbit,2,3,4 Dynamic Orbit | frontorbit (back orbit as option) |
| PCB Transfer Direction | (Left to right or Rightto left) | ||
| Conveyor Width Adjustment | (manual&automatic) | ||
| SPC/Engineering Statistics | Histogram; Xbar-R Chart; Xbar-S Chart; CP&CPK; %Gage Repartability Data; SPI Daily/Weekly/Monthly Reports | ||
| Gerber & CAD Data Import | support Gerber format (274x, 274d) ,manual Teach model); CADXN, Part No., Package Type imput) | ||
| Operating System Support | Windows 10 Professional (64 bit) | ||
| Equipment Diemension and Weight | W1000xD1150xH1530 (B),965Kg W1000xD1174xH1550 (C),985Kg | W1000xD1350xH1530 (B),1200Kg W1000xD1350xH1550 (C),1220Kg | W1730xD14200H1530mm (single-stage). 1630Kg W1900xD1320xH1480mm (two-stage), 1250Kg W2030xD1320xH1480(1500),1450Kg |
| 0ptional | One person controls more machines, Network SPC (Software only) 1D/2D Barcodescanner, out-line programming software, UPS continuous power supply | ||
- Advanced 3D Measurement: Adopts PMP programmable structured light grating, micron-level precision with excellent repeatability.
- Optimized Lighting System: RGB tricolor light source, clear imaging for various PCBs and anti-shadow performance.
- AI Algorithm: Deep learning technology reduces false alarms and identifies defects automatically.
- Inline High Efficiency: Inline structure, fast programming and one-click operation for smooth production.
- Data Management: Built-in SPC function, compatible with MES for data traceability and quality control.
- Wide Compatibility: Dynamic compensation design, supports all kinds of PCBs and linkage with upstream & downstream equipment.
- High Detection Precision: Micron-level 3D measurement ensures accurate data and full defect detection.
- Strong Adaptability: Optimized light source delivers clear imaging for various PCBs with anti-shadow effect.
- Reliable AI Recognition: Low false alarm rate, automatic defect judgment cuts manual workload.
- High Operational Efficiency: Fast programming and simple operation save downtime and boost productivity.
- Complete Data Management: Compatible with MES and SPC for full data traceability and quality analysis.
- Excellent Line Compatibility: Inline design and dynamic compensation fit diverse PCBs and realize closed-loop production.
The in-line platform rich
InSPlre sefes,S series,F series inlinemachine provide not only standard Aand B platform,but also ultra large sizeand dual lane with multi projectionhead configuration.
The CNSMT-3D-SPI SinicTek Inline SMT/PCB Inspection Machine is a professional inline 3D solder paste inspection equipment for SMT and PCB production lines. It adopts advanced PMP phase modulation profilometry and PSLM programmable structured light technology, realizing full 3D quantitative detection of solder paste height, volume and area. Different from traditional 2D detection, this machine eliminates shadow interference and supports high-precision measurement for micro components and large-size PCBs, widely used in standardized electronic manufacturing quality control.
Core technologies and features
Multi-frequency PSLM
The original PSLM technologyemulates the cycle of the optical grating by using software. This greatly improvesthe accuracy and scope of application by abolishing the mechanical drive and transmission parts. (Thedetection height can reach to ± 1200um) and avoids mechanicalwear and maintenance costs.
PHASE MODULATION PROFILERMETRY
Through the phase modulation of full light spectrum, provide a height resolution down to (0.37um), thenumber of 4-8 times sampling ensure high repeatability. Use high-precision ball screw and linear guide rail torealize perfect detection result.
HIGH RESOLUTION AND HIGH FRAME RATE IMAGE PROCESSING UNIT
Megapixel industrial CCD camera of ultra-high frame rate ensure a steady and rapid detection of very small components and high-density mounting(009004). It provides a variety of detection accuracy of 5um,7um,8um,10um,12um,15um,18um,20um etc. It meets the customer’s requirements for product diversity and detection speed.
Telecentric lens for static compensation
Sinic-Tek solves the problem of ordinary lens, squint and deformation by using high-cost telecentric lens andspecial software test algorithm, which greatly enhances the inspection accuracy and inspection ability.Achieves the industry’s leading static compensation for FPC warping.
2D lamp panel
2D lamp panel avoids problems caused by the angle of the red RGB color distortion effect in solder, RGB tuning in Different PCB colors is more versatile ; Fulfill a variety of dispensing process testing; greatly improve theequipment (height,volume,area) repeatability accuracy.
ACTIVE RGB 2D LIGHT SOURCE
Patented RGB Tune function takes Red, Green and Blue images and with unique filter algorism, to solve solderbridge detection false alarm and relative zero surface uncertain issue. In the mean time, provide the 2D/3D measurements and image of printed solder paste.
HIGH ACCURATE HARDWARE PLATFORM
Highrigid grade steel frame combines with dose loop servo control and high precision level ball screw makeshigh speed and steady positioning. Optional linear and high precision linear encode positioning system iscapable measure 030is device pad with ultra high resolution and high speed. The repeatable accuracy can down to lum.
How It Works
- Project structured grating light onto the PCB solder paste surface to form deformed optical fringes.
- High-resolution telecentric lenses capture real-time fringe images of the tested board.
- The system calculates 3D height, volume and area data through phase change algorithm.
- The CNSMT-3D-SPI SinicTek Inline SMT/PCB Inspection Machine intelligently judges defects like less solder, excessive solder, missing print and bridging.
New Type – C Technology Platform
Higher Accuracy More Stable
Application Process
- Install the CNSMT-3D-SPI SinicTek Inline SMT/PCB Inspection Machine after the solder paste printing process.
- Import PCB Gerber files to complete parameter setting and program calibration.
- Realize full-board inline automatic inspection while the PCB transmits.
- Generate SPC statistical data reports to assist process optimization.
SMT whole line schematic diagram
Requirements
Technical & Site Requirements
- Equipped with standard SMT production line transmission interface, compatible with mainstream printing and mounting equipment.
- Require stable voltage and dust-free constant temperature workshop environment.
- Reserve standard installation space for inline connection of the CNSMT-3D-SPI SinicTek Inline SMT/PCB Inspection Machine.
Operational Requirements
- Operators only need simple training to complete programming, detection and data viewing.
- Regular lens cleaning and system calibration to ensure long-term detection accuracy.
What It Is Used For
The CNSMT-3D-SPI SinicTek Inline SMT/PCB Inspection Machine is specially used for 3D full inspection of SMT solder paste printing quality. It accurately detects various solder paste defects, realizes early quality interception, reduces rework rate, and is widely applied in consumer electronics, automotive electronics, 5G base station PCB and semiconductor auxiliary production.
Packaging and Delivery Information:
The CNSMT-3D-SPI SinicTek Inline SMT/PCB Inspection Machine adopts standard export wooden box packaging with shockproof and anti-collision protection. Support sea and air transportation, complete with official operation manual, parameter report and after-sales service guarantee, ensuring intact and safe delivery.
qualification certificate
Workshop Honors
Partial Honorary Customers
