CNSMT PROVIDE Koh Young KY8030-3, 3D SPI machine
- Market-leading mainstream SPI
- Patented dual-projection 3D technology
- Excellent measuring repeatability
- Optimize stencil printing process
- Multi-resolution flexible configuration
- Koh Young KY8030-3 3D SPI Specification
- Key Features
| Category | Item | Specification |
| Vision System | Core Inspection Tech | Patented Dual-Projection 3D dual-inspection & Moiré interferometry, shadow-free measurementKoh Young |
| Camera | 8MP industrial color camera with telecentric lens | |
| Available Resolution | 15μm / 20μm / 25μm (configurable) | |
| FOV Options | 30×30mm / 40×40mm /50×50mm | |
| Z-axis Resolution | 0.37μm; Height measuring accuracy: ±1μm | |
| Min Detectable Component | 01005 chip, Min solder pitch:100μm | |
| Light Source | IR+RGB multi-band LED structured light | |
| Inspection Performance | Full 3D Scanning Speed | Max 91.2 cm²/s, standard:13.7~56.1cm²/sKoh Young |
| Per FOV Inspection Time | ≈0.24s/FOV | |
| Repeatability | ＜10% @6 Sigma for 01005 solder paste | |
| Detectable Defects | Missing paste, insufficient/excess solder, bridging, offset, shape deformation, foreign material | |
| Mechanical Conveyor | PCB Size Range | Single track:50×50 ~ 490×510mm; Max option:50×50~850×690mm |
| Conveyor Mode | Single lane, auto width adjustment, SMEMA compliant | |
| Warp Compensation | Exclusive Z-tracking 3D real-time PCB warp compensation + IR Pad referencing compensationKoh Young | |
| PCB Warpage Tolerance | Active auto correction for bow/twist/stretch board deformationKoh Young | |
| Software & Data | OS Platform | Windows 10 Enterprise, multi-language(EN/CN) |
| Core Function | Full SPC analysis(Xbar/R chart, Cp/Cpk), real-time production data recording & report export | |
| Connectivity | Open TCP/IP, seamless MES/printer/AOI interconnection, KSMART AI process optimization system | |
| Optional Function | Auto solder paste dispensing module (optional upgrade) | |
| Machine Basic Info | Overall Dimension | W1000×D1335×H1627mm |
| Net Weight | 800kg | |
| Power Supply | AC220V/200-240V,50/60Hz, single phase | |
| Air Requirement | 5kgf/cm² (0.5MPa), standard factory compressed air |
- Patented dual-projection 3D technology
Eliminate inspection shadow issues to boost detection precision and production efficiency.
Proven mainstream SPI solution - Widely used across global electronics manufacturing with mature stable performance.
High repeatable measurement accuracy - Consistent testing data supports scientific PCB printing process optimization.
Multiple adjustable resolutions - Flexible configurable specs to match various PCB production requirements.
- Data-driven process improvement
Reliable inspection data effectively reduces stencil printing defects and production waste.
KY8030-3 3D SPI Solder Paste Inspection Machine | CNSMT Supply (Word count:498｜SEO Keywords:KY8030-3 SPI,Koh Young 3D SPI,solder paste inspection machine,new & used SPI equipment,SMT production line solution)
CNSMT supplies brand-new and pre-owned Koh Young KY8030-3 fully automatic 3D SPI solder paste inspection machine, a top-ranked True 3D SPI widely recognized in global SMT electronics manufacturing industry. As the upgraded flagship model from Koh Young, KY8030-3 adopts patented dual-projection dual 3D inspection technology to eliminate shadow blind spots which commonly trouble traditional SPI devices, delivering faster inspection speed and stable measurement performance for PCB solder paste quality control after stencil printing.
Equipped with multi-selectable resolution options and configurable functional modules, this 3D SPI supports precision measurement for tiny 01005 components, accurately testing solder paste volume, height, area and offset while catching common printing defects including insufficient/excess paste, bridging, missing paste and pad deviation. Built-in exclusive Z-tracking active warp compensation automatically offsets PCB bow, twist and warpage error, paired with powerful SPC statistical analysis and KSMART AI process optimization system to record full inspection data, helping manufacturers adjust stencil printing parameters and lower production scrap rate efficiently.
CNSMT has exported new and second-hand KY8030-3 SPI equipment to Southeast Asia, Europe, Middle East and North America, gaining consistent positive feedback from PCBA factories across consumer electronics, automotive PCB and new energy sectors. Beyond standalone SPI supply, we deliver full one-stop SMT & DIP turnkey production line service covering solder printer, chip mounter, reflow oven, wave soldering and post-process AOI equipment to help clients build complete intelligent workshops.
Our professional after-sales team provides flexible technical support including on-site machine installation, calibration, operator training and remote online troubleshooting globally. All pre-owned KY8030-3 machines go through strict factory testing and full calibration before delivery to guarantee stable running performance, while brand-new units come with standard manufacturer warranty and lifetime remote software consultation service.
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