Best Plasma panel cleaning machine Supplier in China
The LSM-360 Plasma panel cleaning machine is a high-end surface treatment machine based on plasma technology, designed for industrial precision cleaning, activation and modification needs.
Through the physical and chemical reaction of high-energy plasma and material surface, pollution-free surface treatment is realized, which is widely used in electronic manufacturing, semiconductor packaging and other fields to improve product yield and process reliability.
- Efficient cleaning and modification
- Broad material compatibility
- Green and low cost
- Intelligent and high precision control
- Wide range of applications
- Specification
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| Technical parameter | |
| description | This equipment is used in the production ine before printing, to activate surface tension, can meet the high standard of cleaning needs increase solder joint adhesion, clean surface foreigrmatter and eliminate surface static electricity, applied between the plate machine and the printing press suitable for Al and SMT cleaning needs |
| Board thickness | 0.6mm to 5mm |
| Power source | 100-230V AC(User specified), single phase, Max volt-amps |
| Air pressure and air flow | 4-6 bar, up to 40L/min |
| Clean dust removed method | Plasma efficient cleaning |
| Antistatic device | Plasma efficient elimination |
| Speed | 0-9mm |
| Transfer height | 900±20mm(or user specified) |
| Transmission direction | Left → Right or Right → Left(optional) |
LSM-360 Plasma panel cleaning machine core advantage
Efficient cleaning and modification
A single treatment can complete decontamination, activation, etching and other multiple functions, adapt to complex process needs, reduce production links.
Nano-level cleaning depth, only a few microns on the surface layer, does not damage the substrate, to ensure the performance of precision devices.
Broad material compatibility
Support metal, ceramics, glass, polymer materials (such as PTFE), semiconductors and other substrates to meet the needs of multiple industries.
Green and low cost
No chemical solvent in the whole process, only a small amount of process gas, no waste water exhaust gas discharge, in line with environmental standards.
The equipment has low energy consumption, less maintenance cost, and significant long-term economic use.
Intelligent and high precision control
Equipped with PLC or touch screen control system, support process parameters (gas flow, power, processing time) accurate adjustment to ensure batch consistency.
Optional CCD visual positioning or automatic loading and unloading system, seamless integration of production lines, improve efficiency.
LSM-360 Plasma panel cleaning machine Pecification | |
| Board size (L×W)~(L×W) | (50×50)~(500×350) |
| Overall dimension (L×W×H) | 800×1150×1550 |
| Weight | 180Kg |
Product instruction
- Modular design, can be fixed point or whole surface cleaning switch at anytime according to different work needs
- Efficient and stable PLC control system
- Easy to use touch panel, easy to operate
- High speed screw cleaning head to ensure the cleanliness of working objects
- Clean by X/Y moving screw head
- Patented coupling transmission structure, easy to operate the machine.increase the service life of the parts
- Three-color warning device, providing different warning messages
- Compatible with SMEMA interface
Typical application scenario
Electronics Industry:
PCB/FPC surface degumming, metal bonding pre-treatment, enhance bonding force.
Clean the chip before packaging to remove organic residue and improve lead bonding strength.
New energy field:
Lithium battery electrode and blue film surface activation to optimize coating uniformity.
Medical equipment:
Surgical instruments, catheter surface cleaning and hydrophilic modification to meet aseptic requirements 12.
Automobile Manufacturing:
Engine parts to remove oil, seals before bonding treatment, extend the service life.
FAQ:
Q1: What is the difference between plasma cleaning and traditional chemical cleaning?
A: Traditional chemical cleaning relies on solvents to dissolve pollutants, which may retain chemicals and have poor environmental protection; Plasma cleaning through the physical bombardment and chemical reaction of high-energy ions and active groups, without chemical solvents, can completely remove nanoscale pollutants, while realizing surface activation, environmental protection and high efficiency.
Q2: What materials can the equipment handle? Is there damage to the substrate?
A: Compatible with metals, ceramics, glass, polymer materials (such as PTFE, PI), semiconductors, etc. The plasma action depth is limited to a few micrometers on the surface, and the energy parameters are precisely controlled to ensure the cleaning/modification effect without damaging the substrate.
Q3: Can it be used for aseptic treatment of medical devices?
A: Sure. Plasma cleaning can efficiently kill surface microorganisms, combined with hydrophilic modification function, widely used in surgical instruments, implants and other medical products sterilized pretreatment.
Q4: Does it support integration with automated production lines?
A: Yes. The equipment provides standard communication interface (RS485/Ethernet), optional mechanical arm loading and unloading, conveyor belt docking or CCD visual positioning system, seamless integration of SMT, packaging and other intelligent production lines.