SMT 3D SPI(Solder Paste Inspection System) Manufactuer
CNSMT 3d solder paste inspection is being designed for testing whether various printed circuit boards are printed correctly or not. Like any other product of CNSMT, this machine is of high quality and has a high inspection speed.
We produce different models of inline SPI machine in our factory, meet variety of requirement of SMT EMS factories. we also can customize this machine depends on your request.
This 3D SPI automatic solder paste inspection machine of CNSMT is consisting of unique 3d RSC (range scan cameras). Our SMT 3d solder paste inspection machine is cost-effective with the best accuracy. In this article, we are going to share tremendous features of the CNSMT 3d solder paste inspection machine, so without wasting time let’s dig into it.
- 3D inspection
- China top1 popular 3D SPI.
- Reliable and stable manufactuer.
- High precision camera
- Specification
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| 技术平台/Technology Platform 标准Type-B/C 双轨Type-B/C 超大平台 |
| 适用系列/Series S系列/Hero/Ultra S系列/Hero/Ultra 1.2米/1.5米系列 |
| 型号 Model S8080/S8030/Hero/Ultra S8080D/S8030D/HeroD/UltraD L1200/DL1200/DL1500 |
| 测量原理/Measurement Principle 3D 白光 PSLM PMP （可编程结构光栅相位调制轮廓测量技术） |
| 3D white light PSLM PMP(Programmable Spatial Light Modulation, Phase Measurement Profilometry) |
| 测量项目/Measurements 体积，面积，高度，XY偏移，形状(volume，acreage，height， XY offset, shape ) |
| 检测不良类型 |
| Detection of Non-Performing Types |
| 漏印、少锡、多锡、连锡、偏位、形状不良、板面污染 |
| (missing print,insufficient tin, excessive tin, bridging, offset, mal-shapes, surface contamination) |
| 镜头解析度/Lens Resolution 4.5um/5um/6um/8um/10um/12um/15um/16um/18um/20um(针对不同相机型号可选) |
| 精度/Accuracy XY (Resolution)：10um |
| 重复精度 Repeatability height：≤1um （4 Sigma）;volume/acreage：<1%（4 Sigma）; |
| 检测重复性/Gage R&R <<10% |
| 检测速度/Inspection Speed 0.35sec/FOV-0.5sec/FOV(根据实际配置确定） |
| 检测头数量/Quanlity of Inspection Head 标准1个，选配2个，3个 |
| 基准点检测时间/Mark-point Detection Time 0.3sec/piece |
| 最大检测高度/Maximun Meauring Head ±550um (±1200um as option) |
| 弯曲PCB最大测量高度 |
| Maximun Measuring Height of PCB Warp ±5mm |
| 最小焊盘间距/Minimun Pad Spacing 100um(焊盘高为150um焊盘为基准）80um/100um/150um/200um（根据实际配置确定） |
| 最小元件/Minimum element 01005/03015/008004(可选） 01005/03015/008004(可选） 0201 |
| 最大PCB载板尺寸 |
| Maximun Loading PCB Size(X*Y) |
| 450x500mm（B） 470x500mm (C) |
| 630x686mm(可测范围630x550mm 大平台 ） |
| 450×310+450×310(B) 470×310+470×310（C） |
| 630×310+630×310(大平台) |
| 1200x650mm(可测范围1200x500mm 一段式） |
| 600x2x650mm(可测范围1200x550mm 两段式） |
| 定动轨设置/Conveyor Setup 前定轨(后定轨 选件) |
| front orbit (back orbit as option) |
| 1定轨，2、3、4动轨 |
| 1 front orbit , 2、3、4 Dynamic Orbit |
| 前定轨(后定轨 选件) |
| front orbit(back orbit as option) |
| PCB传送方向/PCB Transfer Direction 左到右或右到左(Left to right or Right to left) |
| 轨道宽度调整/Conveyor Width Adjustment 手动&自动(manual & automatic) |
| 工程统计数据SPC/Engineering Statistics Histogram；Xbar-R Chart；Xbar-S Chart；CP&CPK；%Gage Repartability Data；SPI Daily/Weekly/Monthly Reports |
| Gerber和CAD 导入Gerber & CAD Data Import 支持Gerber格式（274x,274d),人工Teach模式，CAD X/Y,Part No.,Package Type等导入； |
| support Gerber format（274x，274d）,manual Teach model)；CAD X/Y，Part No.，Package Type imput) |
| 操作系统技持/Operating System Support Windows 7 Professional （64 bit） |
| 设备规格/Equipment Diemension and Weight W1000xD1150xH1530（B),965Kg |
| W1000xD1174xH1550（C),985Kg |
| W1000xD1350xH1530（B）,1200Kg |
| W1000xD1350xH1550（C）,1220Kg |
| W1730xD1420xH1530mm（一段式）,1630Kg |
| W1900xD1320xH1480mm（两段式）,1250Kg |
| W2030xD1320xH1480(1500),1450Kg |
| 选配件/Optional |
| 1带多集中管控软件、网络SPC软件、、1D/2D Barcode扫描枪、离线编程软件、UPS不间断电源、 |
| One person controls more machines、Network SPC（Software only ）、 1D / 2D Barcode scanner, |
| out-line programming software, UPS continuous power supply |
3D solder paste inspection machine
Features:
- A professional lens is used:
Lenses play an important role in solder paste inspection machines to produce highly accurate results. So they must be of high quality. CNSMT 3d solder paste inspection machine uses high-quality professional lenses that make the image more uniform and delicate which greatly improves the stability of detection.
Professional lenses deliver better optical performance as compared to other lenses. They are quicker and more accurate and are ruggedly built. These lenses offer the fastest maximum apertures.
- High Inspection speed and accuracy:
The solder paste inspection machine used in high production lines should be of high speed. SMT 3d solder paste inspection machine has a very high speed to inspect the PCB and its various products.
It has a specified inspection speed measured in cm2/sec to ensure that the machine is capable of keeping up with the processing time of the largest board to be processed. Its accuracy is about 0.67 um.
- Multi-direction 3d projection method:
CNSMT solder paste inspection machine uses a 3d multi-direction projection method. With the help of this method, errors are detected very quickly and easily. It enhances the solder paste inspection process and the errors that are caused by the shadow effect are detected efficiently.
This multi-direction method has the capability of manipulating images in size and resolution. These characteristics are of great benefit to CNSMT 3d solder paste inspection machine. Adopting this method greatly increases the quality of the images along with speeding up the detection process.
- Based on 3d measurement data:
It is based on 3d measurement data that helps the users and makes it easier for them to optimize the whole project in a short time. 3d measurement is a metrology process that uses different kinds of 3d tools, such as 3d scanners, to collect 3d data from physical objects like their shapes textures, etc.
In simple words, the CNSMT solder paste inspection machine needs the information to start its process. The information is based on 3d measurement data that data can include texture, color, or shape of the object, etc. After getting all this information it starts up its process of inspection of the object as by getting information about the object it becomes familiar with the object and it becomes easy for it to inspect the machine.
FAQS:
Why does paste inspection matter?
The majority of PCBs are assembled with the screen printing process, and most defects occur during solder placement. Choosing solder paste inspection means you find those problems and correct them efficiently.
By evaluating solder paste volume and height, you can determine the longevity and strength of a solder joint. If your boards are durable, it gives you an edge over your competitors.
To be sure 3D inspection is right for you; we recommend a consultation with our experienced technicians to find the equipment that will best suit your needs.
What is SPI?
Solder Paste Inspection is the next station on the production line after the solder printer. After solder paste has been printed on a PCB, an SPI system measures the area, volume, and height of the solder point to ensure they are within pre-determined parameters. The SPI system then inspects if there is any solder bridge.
What benefits can we have by using the SPI machine?
It can immediately offer the information to the solder printer to modify the parameters, and it also helps to avoid producing defective products. Thus, an SPI system contributes directly to an increase in productivity, reducing the cost of manufacturing and repair.
What knowledge should a user have before learning SPI?
Basic knowledge of computer operation and the SMT production process are necessary. Also, knowledge of optical inspection techniques is recommended. These courses are included in TRI’s basic training program.
Does the use of SMT SPI machines harm the human body?
When used properly, no. During machine operation, the operator must not put any part of his/her body into the SPI system to avoid injury due to electrical or mechanical causes. Also, looking directly at the light source, laser, or sensors should be avoided. Shut down the system completely before performing any maintenance. There is no harmful radiation created by SMT SPI systems.
How does the solder paste inspection machine work?
A 3D solder paste inspection is a method of visually monitoring printed circuit boards for defects in the solder paste. This method uses 3D imaging to detect issues such as scratches, stains, and nodules. It also measures volume, area, height, shape, shift, bridge, and overflow.
What type of errors does the solder paste inspection machine detect?
The leading defects SPI can find out contain missing, insufficient solder, excessive solder paste, bridging, displacement, improper shape, and board residue. SPI usually comes after solder paste printing to find out printing defects in time so that they can be corrected or eliminated before chip placement.
How is a PCB assembled?
The PCB assembly processes vary depending on the circuit board requirements, such as halogen-free, lead-free, fine-pitch, double-sided, etc. However, the basic steps are PCB/Gerber files check, BOM check, component sourcing, PCB and SMT stencil manufacturing, SMT assembly, and PTH Assembly.
What is the difference between AOI and SPI in SMT inspection?
SPI is used for quality inspection of solder printing and validation and control of printing process after printing machine.SPI plays a considerable role in the whole SMT. The advantage of SPI is that it can detect printing defects in time before PCB placement, improve them, prevent them from flowing into the next process, reduce the cost of secondary repairs, and improve product quality. For example, when the camera detects that there is little tin or missing printing in a certain part of the printed solder paste, the machine can automatically fill the part with the little tin and complete tin filling. After that, it will be tested again to confirm that the tin amount after the tin filling is normal before it can be released, which minimizes the cost of repair.
AOI is the abbreviation of automatic optical inspection, it’s used to detect various PCBA misfit and welding defects by high visual processing technology.AOI is divided into two types: before the oven and after the oven. The former detects components mount and the latter detects solder joint.
The two functions are different, SPI tests solder paste printing, while AOI is to check the stability of mounted parts and welding quality.
What is the purchase process typically like?
When a client decides that they would like to pursue a machine, they will issue a conditional purchase order. Our company will then place the machine on hold and schedule a demonstration for their approval
. The demonstration is either conducted at our facility or by video. If the client accepts the machine, we will then invoice against this purchase order. The machine will be prepared by our technicians for shipment. We will load the machine onto the buyer’s truck.
If there are special packing needs, we will be happy to help with all the arrangements. We can provide ocean packing when needed.
Is the CNSMT SPI machine difficult to process?
Clarity and simplicity are words rarely associated with the complex process of solder paste inspection. But CNSMT changes this. Thanks to an intuitive touch screen interface the users can easily operate the machine with great ease. It can easily be set up and run by anyone with just an hour of training. Calibrations require only the touch of a button.
What are the issues with the 3d solder paste inspection machine?
Solder paste inspection machines are the capital expense that some are reluctant to make. You need to make space on the assembly line to install them. That requires time, money, and planning. All of this requires making an up-front investment that causes some to delay or avoid solder paste inspection despite the potential cost saving.
What is the inspection speed of solder paste inspection machines?
Most machines will have a specified inspection speed measured in cm2/sec. this speed ensures that the machine being selected is capable of keeping up with the processing time of the largest boards to be processed.
How solder paste inspection process improves the yield of the product?
When processing large batch numbers it is important to consider the ability of SPI to connect with the printer to enable automatic adjustment of certain parameters such as alignment. There are many manufacturers in the market using different technologies so it is important to consider the above point before choosing a particular machine.
As assemblies are becoming more complex and components used are becoming smaller it is becoming more complex to control the solder paste inspection process. Solder paste inspection machines are a significant investment but the benefit of tightly controlling the manufacturing process will pay back in the long term by improving yield.
