MSO-400C 3-Axis Synchronized Selective Wave Soldering System

Precision Selective Wave Soldering Technology is indispensable in electronics manufacturing, delivering micron-level accuracy for specialized applications. This targeted wave soldering solution excels in:

MSO-400C 3-Axis Synchronized Selective Wave Soldering System

Low-volume selective PCB soldering of complex assemblies
Precision component soldering for connectors, shields, and through-hole devices
Mixed-technology soldering where reflow cannot be applied
Mission-critical electronics soldering (aerospace/medical/automotive)

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Specification
PCB parameter
Selective spray system
Selective Soldering System
Option
Control system

specifications	Parameter
Overall Dimensions	1000L1133W1810H (mm)
Machine frame	Steel structure+baking paint
machine appearance	closed – type
Operating height	900±20mm
Weight	Approx.380KG
Power supply	1φ 220V 50/60HZ
Total power	3KW
Board handling method	Manual picking and placing
Programming methods	Picture programming, Gerber document, visual teaching programming, etc.
Soldering real-time monitoring	standard configuration
Operating mode	Tin furnace Y-axis movement, PCB board XZ axis movement

PCB size	Min:30(L)30(W); Max：320（L）420（W）(mm)
Top component height	Max280mm
Bottom component height	Max30mm
PCB Weight	Max10Kg
PCB Process Edge	＞3mm

Spray movement mode	PCB movement in XZ axis Y-axis movement of flux spray valve
Spray flux volume	1L
Spray flux add mode	Manual
Spray nozzle type	Needle
Spray cycle time	1 Sec/soldered dot（The minimum spray time can be set to 0.1 seconds）
Spray movement precision	±0.05mm
Spray flow control	pressure gage + flow valve

Soldering movement mode	PCB movement in XYZ axis Y-axis movement of tin furnace
Movement mode	Servo motor + linear rail
Solder feeding mode	Manual
Solder capacity	15KG
Solder melting time	45min
Solder power	1.2KW
Solder nozzle size	Standard with 5 solder tips (3-64-8 6-10 8-12 10-14)
Solder cycle time	1~5Sec/ soldered dot
Temperature control mode	PID+SSR
Temperature setting range	Max350^OC
Temperature accuracy	±2^OC
Waver height	Max 0-8mm adjustable
Soldering precision	±0.1mm
Solder dross	0.2Kg/8H（Not N2 protection）；0.01Kg/8H( N2 protection)

Tin furnace peak correction

Flux injection valve

Safety door switch and safety grating

Anti-static wrist strap electrostatic monitoring

2 cubic nitrogen generator

PCB placement in place detection.

Mes data docking

Common Wear & Tear Parts

soldering nozzle, nozzle cleaning fluid, high-temperature bearing

Control mode	PC+ motion control card
PCB Process parameter	Setting, save , open in the PC screen
Other	PCB counting, message, alarm can be read in the PC

What are the advantages of the MSO-400C 3-Axis Synchronized Selective Wave Soldering System?

Significantly Enhance Selective Soldering Quality:

Achieve unparalleled precision in selective wave soldering by individually programming soldering parameters for each joint, catering to diverse component requirements.
Programmable control over flux spray volume, soldering time, and wave height ensures consistent, high-quality selective soldering results.
Minimize thermal shock and protect sensitive components by applying heat only where needed during the selective wave soldering process, avoiding stress to the entire PCB.

Deliver Substantial Cost Savings in Selective Soldering Operations:

Benefit from the system’s compact footprint, reducing valuable production floor space required for selective soldering.
Experience lower material costs due to significantly reduced flux consumption inherent in targeted selective wave soldering.
Minimize tin dross generation, lowering associated cleaning and maintenance expenses for your selective soldering process.

Boost Overall Production Efficiency with Precision Selective Soldering:

While selective wave soldering per joint may be slower than bulk methods, the exceptional precision and control drastically reduce defect rates and rework, leading to higher net throughput and efficiency.
Eliminate the need for complex custom fixtures or pallets, simplifying the selective soldering workflow and setup.

Frequently Asked Questions: Selective Wave Soldering

Q: What are the key advantages of selective wave soldering?
A: Selective wave soldering delivers significant benefits across production operations:

Enhanced Efficiency: Automates soldering processes, reducing manual labor time and intensity
Cost Reduction: Minimizes solder waste and rework expenses through targeted application
Design Flexibility: Accommodates diverse components (SMT, through-hole, large/shaped parts)
Quality Assurance: Ensures reliability through precision process control and rigorous inspection

Q: What maintenance is critical for online selective wave soldering systems?
A: Consistent maintenance ensures optimal selective soldering performance and longevity:

Perform daily nozzle cleaning to prevent flux buildup
Conduct weekly calibration of wave height and solder temperature
Monthly replacement of high-wear components (spray nozzles, heater elements)
Quarterly validation of conveyor alignment and flux delivery systems
Maintain preventive logs tracking dross removal and nitrogen levels

Q: How is soldering quality evaluated in selective wave soldering?
A: Quality assessment employs a multi-method approach:

Visual Inspection: Verify fillet formation, wetting angles, and absence of defects (bridges, icicles) per IPC-A-610 standards
Mechanical Testing: Conduct solder joint strength tests (pull/ shear testing)
Electrical Validation: Perform continuity testing and insulation resistance checks
Metallurgical Analysis: Cross-section analysis for void percentage and intermetallic coverage
Automated Optical Inspection (AOI): Implement for high-volume process control