Your Best SMT YAMAHA 3D AOI(Automatic Optical Inspection machine)

The YAMAHA YSi-V 3D AOI Hybrid Optical Inspection System is a state-of-the-art solution that combines multiple inspection capabilities in a single unit. This advanced system includes 2-dimensional inspections, 3-dimensional inspections, and 4-way oblique imaging inspections, providing comprehensive coverage for defect detection and quality assurance.

One of the standout features of the YSi-V is its ability to perform these varied inspections simultaneously, ensuring that all aspects of a PCB (Printed Circuit Board) are thoroughly examined. The system’s 2D inspection checks for surface defects and component placement accuracy, while the 3D inspection measures solder joint volume and height, crucial for ensuring reliable electrical connections. The 4-way oblique imaging offers additional perspectives to detect issues that might be missed by conventional inspection methods.

The TypeHS2 variant of the YSi-V takes inspection speed to new heights by further enhancing the capabilities of the original TypeHS model. This results in the highest level of inspection speed available, making it ideal for high-volume production environments where time and accuracy are critical.

In summary, the YAMAHA YSi-V 3D AOI Hybrid Optical Inspection System is a versatile and powerful tool for PCB inspection, combining multiple advanced inspection techniques to deliver unparalleled accuracy and efficiency in quality control processes.

  • 2D High-speed, high-resolution 2-dimensional inspections
  • 3D Height, and sloped surface 3-dimensional inspections (option)
  • 4D∠ 4-direction angular camera (option)
  • Software suite supporting high quality production
Applicable PCB mmL610 x W560mm (Max) to L50 x W50mm (Min) (Single lane)
Note : L750mm long length PCBs available (option)
Number of pixels12Megapixels
Resolution12μm / 7μm
Target itemsComponents status after mounting, components status and solder status after hardening
Power supply3-Phase AC 200/208/220/240/380/400/416V ±10% 50/60Hz
Air supply source0.45MPa or more, in clean, dry state
External dimensionL1,252 x W1,498 x H1,550mm (excluding protrusions)
WeightApprox. 1,300kg


Related Series

The YAMAHA YSi-V 3D AOI boasts world-leading optical inspection technology, distinguished by its exceptional performance and advanced capabilities in PCB inspection. Utilizing a 12-megapixel industrial-grade high-resolution camera paired with a high-pixel compatible telecentric lens, it delivers precise 2D, 3D, and 4D inspection functions, ensuring comprehensive and accurate quality control.

Most importantly, the YSi-V offers a significant price advantage compared to other brands of 3D AOI equipment. Customers benefit not only from top-tier inspection performance but also from competitive pricing. The YSi-V strikes a perfect balance between price and performance, making it the ideal choice for electronics manufacturing enterprises seeking to enhance product quality and production efficiency. Whether in high-volume production environments or scenarios requiring intricate inspection, the YSi-V delivers outstanding value for money.

The YAMAHA YSi-V 3D AOI Hybrid Optical Inspection System is an industry-leading solution that not only excels in core technology but also offers a variety of optional features to meet the diverse needs of different customers. The system supports 2D, 3D, and 4D inspection options and can be configured with single or dual tracks to suit various production line requirements.

Multi-Dimensional Inspection Options

2D Inspection: The 2D inspection is primarily used for detecting surface defects and verifying the accurate placement of components on the PCB. Utilizing a high-resolution camera and precision optics, the YSi-V can identify issues such as solder joint defects, component misalignment, and other surface anomalies. This inspection method is fast and ideal for initial checks in high-volume production environments.

3D Inspection: The 3D inspection enhances accuracy and depth of analysis. By measuring the volume and height of solder joints, 3D inspection ensures the reliability of electrical connections, preventing potential soldering issues. The YSi-V’s 3D inspection capability captures the three-dimensional shape of solder joints, providing more detailed quality data.

4D Inspection: The 4D inspection is a unique advantage of the YSi-V system. Through four-way oblique imaging, the system can observe the PCB from multiple angles, identifying issues that traditional 2D and 3D inspections might miss. This multi-angle inspection method allows for a more comprehensive check of component status and placement, ensuring overall product quality.

Track Configuration Options

Single Track Configuration: The single track configuration is suitable for smaller-scale or highly specialized production lines. It is simple in structure, easy to operate, and has lower maintenance costs, making it ideal for startups or small to medium-sized production lines. This configuration offers efficient inspection at a lower cost, ensuring product quality.

Dual Track Configuration: The dual track configuration is designed for large-scale, high-speed production lines. This system can simultaneously handle PCBs on two production lines, significantly increasing production efficiency. For manufacturing environments requiring high throughput and speed, the dual track configuration is an ideal choice. Additionally, the dual track system offers greater flexibility, allowing for quick switches between different production modes to meet varying needs.

Comprehensive Advantages

The YAMAHA YSi-V 3D AOI system not only leads in technology but also offers great flexibility in configuration options. This flexibility allows the YSi-V system to be widely applicable across various scales and types of electronics manufacturing enterprises. From initial surface inspections to in-depth three-dimensional and multi-angle inspections, and flexible track configurations, the YSi-V provides customized solutions tailored to specific customer needs.

Furthermore, the YSi-V system is designed with an intuitive user interface and simple operation, enabling users to quickly get started and operate efficiently. Its modular design not only facilitates maintenance and upgrades but also allows for functional expansion as needed, ensuring long-term reliability and adaptability of the equipment.

In summary, the YAMAHA YSi-V 3D AOI Hybrid Optical Inspection System, with its 2D, 3D, and 4D multi-dimensional inspection options, and single and dual track configuration options, offers customers a comprehensive, flexible, and efficient PCB inspection solution. Whether for small batch production or large-scale manufacturing, the YSi-V can help enterprises improve product quality and production efficiency with its superior performance and versatile adaptability.

The YAMAHA YSi-V 3D AOI Hybrid Optical Inspection System is the industry’s first to utilize a 12-megapixel industrial-grade high-resolution camera and a high-pixel compatible telecentric lens. These high-resolution components are indispensable for high-accuracy inspections. The YSi-V system integrates multiple advanced technologies, providing a comprehensive and efficient solution for Printed Circuit Board (PCB) inspection.

Key Advantages

High-Resolution Imaging: One of the core advantages of the YSi-V system is its high-resolution imaging capability. In addition to the standard 12μm lens, the YSi-V series includes a 7μm lens, enabling even higher resolution inspections. This flexibility allows the YSi-V to adapt to various inspection requirements, delivering excellent performance in a wide range of complex applications.

Advanced Optical Components: The YSi-V system relies not only on its advanced optical components but also features a high-speed image processing control system. This system achieves a perfect balance between high speed and high accuracy. Furthermore, the extended field of view allows the system to maintain efficiency and accuracy even in large-area inspections. Whether detecting minute solder joint defects or verifying the placement and status of components, the YSi-V provides precise and reliable results.

Multi-Dimensional Inspection

2D Inspection: The 2D inspection function can check for surface defects on PCBs and verify component placement accuracy. This is achieved through high-resolution imaging that can identify issues like solder joint defects and component misalignments.

3D Inspection: The 3D inspection function measures the volume and height of solder joints, ensuring the reliability of electrical connections. This function captures the three-dimensional shape of solder joints, providing more detailed quality data.

4D Inspection: Four-way oblique imaging offers additional perspectives, detecting issues that conventional methods might miss. This multi-dimensional inspection method provides unparalleled advantages in quality control by comprehensively checking the status and placement of components.

High-Speed Performance

The TypeHS2 model further enhances inspection speed by accelerating the original TypeHS model’s capabilities. High-speed inspection is crucial for high-volume production environments. The YSi-V system significantly improves production efficiency while maintaining inspection accuracy, reducing production cycles and costs.

User Experience and Design

The YSi-V system is designed with user experience in mind. Its intuitive user interface and straightforward operation enable users to quickly get started and operate efficiently. Additionally, the system’s modular design facilitates maintenance and upgrades, ensuring long-term reliability and flexibility.

Comprehensive Solution

In summary, the YAMAHA YSi-V 3D AOI Hybrid Optical Inspection System integrates high-resolution imaging, high-speed image processing, and multi-dimensional inspection technologies, offering an industry-leading PCB inspection solution. Its features of high precision, high speed, and high reliability make it an essential tool for quality control in various electronics manufacturing enterprises. Whether inspecting complex circuit boards or in high-volume production lines, the YSi-V’s superior performance and flexible adaptability help businesses enhance product quality and production efficiency.


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