Your Reliable WDS-750 High Definition Optical BGA Repair Platform Supplier in China

CNSMT has over 15years WDS-750 High Definition Optical BGA Repair Platform experience in China, we have a skilled after-sale team and technique team support your business.

We have vast WDS-750 High Definition Optical BGA Repair Platform in our warehouse, both new and used WDS-750 High Definition Optical BGA Repair Platform available. about used WDS-750 High Definition Optical BGA Repair Platform, don’t worry about the quality, our professional engineer will inspect and calibrate its perfect condition before ship to your place.

As we are the one-stop-shop of WDS-750 High Definition Optical BGA Repair Platform, we always provide you the best price and best quality WDS-750 High Definition Optical BGA Repair Platform, save your time and money is also our final goal.

WDS-750 High Definition Optical BGA Repair Platform – Product Introduction

The WDS High-Precision BGA Repair Platform is designed for accurate and reliable rework of BGA, CSP, and QFN components on small to medium PCBs. It features a 7600W multi-zone heating system (upper, lower, and infrared), supports PCB sizes up to 570 × 480 mm, and offers ±0.01 mm mounting precision. With 2–30× optical magnification, 4 temperature measurement interfaces, and compatibility with chip sizes from 0.8 × 0.8 mm to 120 × 120 mm, it is ideal for electronics assembly, repair, and prototyping.

WDS High-Precision BGA Repair Platform – Key Advantages

1. Powerful Multi-Zone Heating System
Equipped with a 7600W total heating system, including upper (1600W), lower (1600W), and infrared bottom heating (4200W), ensuring uniform and stable temperature control.

2. Wide PCB Compatibility
Supports PCB sizes up to 570 × 480 mm and as small as 10 × 10 mm, suitable for a broad range of electronic assemblies.

3. High Optical Magnification
Adjustable 2× to 30× magnification allows for clear inspection and precise alignment of components.

4. Excellent Mounting Precision
±0.01 mm placement accuracy ensures high reliability in BGA, CSP, and QFN rework.

5. Multiple Temperature Sensors
Comes with 4 independent temperature measuring interfaces for real-time thermal monitoring and control.

6. Versatile Chip Support
Handles chip sizes from 0.8 × 0.8 mm up to 120 × 120 mm, ideal for various applications from mobile electronics to industrial boards.

7. User-Friendly Design
Compact footprint (750 × 835 × 880 mm) and optimized layout make it suitable for both repair workshops and production environments.

8. Lightweight and Durable
With a machine weight of approximately 80 kg, it balances portability and structural stability for long-term use.

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Our Services

1.Are you a trading company or manufacture?

    We are a manufacturer, OEM & ODM service are available.

2.What is your delivery date?

   The delivery date is about 1-2 days after receipt of payment.

3.What is your payment terms?

   Accept payment by T/T, Paypal, Western Union.

4.Can you provide a whole line solution?