CNSMT-8208UL Ultrasonic Immersion Cleaning Machine
CNSMT-8208UL Ultrasonic Immersion Cleaning Machine is a specialized industrial cleaning system designed for high-precision cleaning of semiconductor components. It is built to meet the strict standards of advanced semiconductor manufacturing, providing efficient and thorough cleaning while protecting delicate parts. Constructed primarily from SUS304 stainless steel, the machine ensures high cleanliness, durability, and resistance to corrosion and chemical cleaning agents, making it a reliable solution for heavy-duty, long-term operation in cleanroom and production environments.
- Efficient Deep Cleaning: Uses ultrasonic immersion technology to thoroughly remove flux residues, organic dirt, and inorganic contaminants from complex and tiny structures of semiconductor parts.
- Real-Time Quality Monitoring: Equipped with DI water resistivity control system that tracks water quality instantly, ensuring stable and consistent cleaning results.
- Full Automatic Processing: Covers complete steps from chemical soaking, spraying, multi-stage rinsing, to drying, delivering fully cleaned and dry parts ready for next processes.
- Resource Saving & Protection: Features filtration and recycling system for cleaning agents and water, reducing usage and cost, while durable stainless steel build ensures long service life and high cleanliness.
- CNSMT-8208UL Ultrasonic Immersion Cleaning Machine Specifications
- Key Features
- Advantages
| Parameter | Details |
|---|---|
| Model | CNSMT-8208UL |
| Cleaning Objects | IGBT, JPM, CSP, SIP, Flip-Chip, Lead Frame, and other semiconductor components |
| Main Material | SUS304 stainless steel |
| Basket Size | 350×350×350 mm (customizable) |
| Power Supply | 380V 50Hz |
| Total Power | Approx. 75kW |
| Cleaning Speed | 3–15 minutes / basket (adjustable) |
| Equipment Dimensions | L8000 × W2200 × H2100 mm |
| Equipment Weight | Approx. 3000kg |
| Control System | PLC + Chinese/English graphical interface |
| Core Features | DI water resistivity monitoring; multi-stage filtration & recycling; immersion ultrasonic cleaning |
- Immersion ultrasonic cleaning technology for deep and thorough cleaning
- DI water resistivity monitoring system for real-time quality control
- Multi-stage filtration and recycling system for water and cleaning agents
- PLC control system with Chinese/English graphical operation interface
- Full automated process from soaking, rinsing to drying
- SUS304 stainless steel construction for corrosion resistance and durability
- Adjustable cleaning speed: 3–15 minutes per basket
- Customizable size and configuration to fit different production needs
- Removes even invisible and hard-to-reach contaminants effectively
- Ensures consistent cleaning results and prevents recontamination
- Reduces resource consumption and lowers operational costs
- Long service life and maintains high cleanliness standards
- Easy to operate, program, and adjust for various components
- Improves product quality and reduces manufacturing defects
CNSMT-8208UL Ultrasonic Immersion Cleaning Machine is a specialized system for high-precision cleaning of semiconductor components. Built to strict manufacturing standards, it delivers thorough, efficient cleaning while protecting delicate parts. Made from SUS304 stainless steel, it offers excellent durability, corrosion resistance, and reliable long-term performance in cleanroom and production environments.
Why choose this product?
- High Cleaning Efficiency & Precision: Uses immersion ultrasonic technology to remove invisible and hard-to-reach contaminants like flux residues and organic/inorganic impurities from complex part structures, suitable for mass production of ultra-fine components.
- Smart Monitoring & Control: Equipped with a DI water resistivity monitoring system that tracks water quality in real time, ensuring consistent cleaning results and preventing recontamination.
- Cost & Resource Saving: Features a multi-stage filtration and recycling system for cleaning agents and water, significantly reducing consumption, lowering operational costs, and supporting environmental protection.
- Durable & Hygienic Build: SUS304 stainless steel construction prevents rust, dust accumulation, and reaction with cleaning chemicals, maintaining high cleanliness standards and extending service life.
- User-Friendly Operation: Adopts PLC control with a Chinese/English graphical interface; programs can be easily set, modified, stored, or recalled, supporting flexible adjustment for different production needs.
- Customizable & Scalable: Can be tailored in size, speed, and configuration, adapting to different production scales and specific cleaning requirements.
How It Works
The machine combines ultrasonic technology, multi-stage chemical treatment, and precise fluid control to achieve deep cleaning:
- Ultrasonic Action: High-frequency sound waves create microscopic bubbles in the cleaning liquid; these bubbles collapse violently upon contact with the component surface, generating strong shockwaves that strip away contaminants from every crevice and gap—even in structures that are hard to reach by manual or other cleaning methods.
- Sequential Processing: Parts pass through a series of dedicated tanks and stations, each performing a specific function (chemical soaking, spraying, rinsing, drying). Each stage is carefully timed and controlled to ensure complete removal of residues and thorough washing.
- Water Quality Control: DI water system continuously monitors and maintains high-purity water standards, preventing impurities from redepositing on cleaned parts.
- Drying & Finishing: After cleaning and rinsing, parts go through centrifugal drying, cold air drying, and high-pressure hot air drying to ensure they are fully dry and ready for next production steps without water spots or oxidation.
Application Process
The cleaning process follows a strict, automated sequence:
- Loading: Semiconductor parts (IGBT, JPM, CSP, SIP, Flip-Chip, Lead Frame, etc.) are placed in standard or customized baskets and loaded into the system.
- Chemical Immersion & Cleaning: Parts enter the chemical soaking tank and chemical cleaning tank, where ultrasonic waves and specially formulated cleaning agents dissolve and loosen flux, organic residues, and inorganic dirt.
- Spray & Rinsing: High-pressure spraying removes loose contaminants, followed by multiple stages of DI water rinsing (overflow, fine rinsing) to wash away all cleaning agents and dissolved impurities.
- Drying Phase:
- Centrifugal drying removes most surface water
- Cold air drying stabilizes temperature and prevents condensation
- High-pressure hot air drying ensures complete moisture removal
- Unloading: Fully cleaned and dried parts are unloaded, ready for assembly, testing, or packaging.
Note: Speed is adjustable between 3–15 minutes per basket, allowing optimization for different part types and cleanliness requirements.
Requirements
Technical & Site Requirements
- Power Supply: 380V, 50Hz; total power approx. 75kW, requiring stable industrial power connection.
- Space & Installation: Standard dimensions: L8000 × W2200 × H2100 mm; weight ~3000kg. Floor must be flat, strong enough to support weight, and allow easy access for maintenance. Custom sizes available upon request.
- Utilities: Access to DI water supply, compressed air, and drainage system compatible with industrial wastewater standards.
- Environment: Installed in a clean, dust-controlled area; suitable temperature and humidity range to protect equipment and components.
Operational Requirements
- Operators trained in basic operation, parameter setting, and safety procedures.
- Regular maintenance: filter replacement, tank cleaning, and system checks to keep performance stable.
- Use only compatible cleaning agents recommended for semiconductor processing.
What It Is Used For
This machine is specially developed for the semiconductor industry, used to clean components including but not limited to:
- IGBT modules, JPM, CSP, SIP packages
- Flip-Chip and Lead Frame structures
- Other advanced semiconductor chips and microelectronic parts
Its main purpose is to remove flux residues left after soldering, plus organic and inorganic contaminants, ensuring parts meet strict cleanliness standards required for reliability, electrical performance, and long service life. It is essential in manufacturing processes where even microscopic contamination can cause product failure or reduced quality.
Conclusion
The CNSMT-8208UL Ultrasonic Immersion Cleaning Machine is a comprehensive, high-performance solution designed specifically for the rigorous demands of semiconductor manufacturing. It combines powerful ultrasonic cleaning, intelligent control, and resource-saving design to deliver consistent, high-quality results, while being durable, easy to operate, and adaptable to different production needs. By ensuring thorough removal of contaminants and maintaining strict cleanliness levels, it plays a vital role in improving product quality, reducing defects, and supporting efficient mass production in the microelectronics and semiconductor industry. It is an ideal investment for manufacturers aiming for precision, reliability, and cost-effectiveness in their cleaning processes.
Do you provide after-sales service?
- Our professional after-sales service team will quickly resolve any emergencies you may encounter during use.
Warranty period?
- -The entire machine is covered by a one-year warranty, with free technical support provided after that year.
Do you provide installation and commissioning?
- On-site installation and commissioning will incur additional fees, including accommodation and airfare.
Shipping method?
- Typically, shipping is by sea or land. Air freight is more expensive for urgent needs.
Packaging and Delivery Information:
Delivery: Standard equipment is in stock, while less commonly used models require 10-15 days depending on the situation..
Minimum Order: We accept orders for a single machine or mixed orders to suit your needs.
Transportation: Products are shipped either in bulk or via containers, depending on the order size and destination.
Payment Terms: Flexible payment options are available, including L/C, D/A, D/P, T/T, Western Union, and MoneyGram.
Price: Prices are negotiable to ensure you receive the best possible value.
Packaging: We offer both standard export boxes and robust hardwood packages to ensure your order arrives safely and securely.
If you have any other questions, please contact us to obtain more information
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