Best Automatic Depaneling Machine Supplier in China
CS-350 In-line Automatic Depaneling Machine is specially developed for the high-end electronic manufacturing field, equipped with a new generation of AI vision system and adaptive dynamic cutting algorithm, breaking the double bottleneck of traditional PCB splicer efficiency and accuracy.
CS-350 In-line Automatic Depaneling Machine redefines the intelligent board standard with ±0.015mm ultra-high precision and 2.5 seconds/piece ultra-fast beat, helping enterprises to seize 5G, AIoT, on-board electronics and other high value-added track opportunities
Core advantage
- Cutting speed up to 100mm/s
- ESD certified high-speed spindle
- Multifunctional off-line programming system
- Automatic tool life detection
- Specification
- Feather
- Download
| Control system | X,Y,Z&R axis |
| Axisinuse | 13 axis feed X;take plate X;milling cutter X/Y/Z; carrier Y1/Y2;High speed reclaimingX/Z1/Z2/R1/R2；discharge belt x; |
| Driven motors | Step motor;Full close loop AC servo motor |
| Positional accuracy | ±0.01mm |
| Workstation | Two work tables Up and down |
| Transferdirection | From left to right |
| E6fixation(optional) | Vacuumassist board fix |
| PCBloading/unloading | Material pick and place gripper |
| Working area | 350mmX300mm(customizable scope of work) |
| PCB thickness | 0.5mm-3mm |
| Cutting accuracy | ±0.05mm |
| Spindle system | High speed antistatic spindle |
| Max speed | 100,000rpm |
| Route bit change | Auto or manual |
| Routerbit diameter | 0.8mm-2mm |
| Dust collection system | Vacuum cleaning system |
| Vacuum cleaner power | 2.2kw |
| Filtration | External dust collecter |
| Dust collection method | Upward and downward dust removal |
| Operatingsystem | Windows 10 |
| online programming | Using 10 times CCD camera or scan whole picture to realize programming |
| offline programming | Support |
| Dimensions | 1700(L)X1450(W)X1600(H)mm+310(SIGNALINDICATOR) |
| Weight | 1000Kg |
| Powersupply | Three-phase electric AC380V 50HZ 7KW |
| Noiselevel | <72 dB |
1.Twin tables
The design of the upper and lower double table reduces the volume of the machine body, is conducive to the line body planning, and can be carried out at the same time, and improve the overall economic value.
2.Material handling arm
The take-and-place arm picks up the PCBA board and accurately places the fixture.
3.High speed pick and place system
The high-speed take-up and placement system is inspired by the SMT machine, which can accurately, effectively and safely put the finished products into the TRAY tray in an orderly manner, solving the problem of today’s plate machine industry such as chip, module and wafer cutting products directly into the unmanned cutting production. This system can be customized multi-head system according to their own production needs.
4.High efficency dust removing route system
The high efficiency dust removal sub-board system is mainly composed of anti-static high-speed spindle, anti-static brush and upper dust suction air pipe, which can effectively prevent dust residue caused by classic, keep the product clean and the machine clean.
5.Tray automatic supply system
When the cutter reaches its set cutting life or the tool inspection system identifies that the cutter needs to be replaced for special reasons, the system automatically replaces the cutter in the shortest possible time and immediately resumes production.
6.Multifunction routing program system
This system can realize online point-to-point visual aid cutting program setting live scanning full graphic programming, can also edit the cutting program offline, reduce the time of line change due to programming stop line, increase production capacity.
Technical highlight
🔹 Intelligent adaptive cutting
- Double CCD visual positioning + deep learning compensation technology, automatically identify V-cut, stamp hole, curve groove and other complex plate type, compatible with 0.2mm ultra-thin sheet and multi-layer stacked board cutting, yield up to 99.8%.
- Patented flexible cutter head design, real-time pressure feedback adjustment, completely solve the stress damage and micro-cracks hidden dangers.
🔹 The whole process is unmanned
- Integrated intelligent warehouse and mechanical arm operation, support 24 hours uninterrupted production, labor costs reduced by 90%.
- Equipped with IoT remote operation and maintenance module, real-time monitoring of equipment status, consumables life and productivity data, seamless docking MES system.
🔹 Super scene adaptation
- Working size covers 80mm×80mm~650mm×550mm, support LED lamp board, ceramic substrate, flexible circuit board and other special materials, change time < 5 minutes.
- Modular expansion design, optional laser cutting head, dust removal system and AI quality inspection unit, to meet the requirements of vehicle level process.
FAQ
Q: How long does it take to change the equipment? Does it require professional operation?
A: The S350 adopts modular fixture and intelligent program memory function, the standard board type change time is less than 5 minutes, and the ordinary operator can complete the training after 1 day; Complex shaped plates can be quickly generated by 3D scanning modeling.
Q: Does the equipment support ultra-thin sheet (e.g. 0.2mm thickness) or ceramic substrate cutting?
A: Yes. The S350 is equipped with an adaptive pressure control system that accurately adjusts the cutting force and is compatible with materials such as FR4, aluminum substrate, ceramic substrate, and flexible circuit board with a thickness of 0.2 to 6.0mm without micro-cracking or delamination risk.
Q: Can S350 be fully automated with SMT production line?
A: Yes. The equipment is equipped with the standard mechanical arm interface and SMEMA communication protocol, which can seamlessly integrate the automatic loading and unloading system (optional), and realize the linkage operation with the SMT machine and AOI detection equipment.