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Engineered for high-efficiency electronics manufacturing, this reflow soldering system features a Dual-Waveform Synergistic Reflow Soldering System (turbulent wave + laminar wave). This innovation significantly reduces defects including voids and bridging during reflow soldering, while supporting lead-free processes.
Integrated with a PLC intelligent control system, the reflow oven enables one-click reflow profile recall for automated operation. Ideal for large-scale production in consumer electronics, automotive components, and other high-volume SMT applications.
- Dual-track parallel production capacity
- Precision welding control
- Four-stage hot air preheating
- Ultra-low energy consumption design
- Features
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High-Reliability Reflow Oven Transport System
Hardened Double Tracks: Support synchronous or variable-speed transportation for flexible reflow soldering line configuration.
Turbocharged Airflow & Quick-Plugin Heaters: Ensures rapid thermal recovery in all reflow zones.
Precision Reflow Zone Control
Variable-Frequency Hot Air Circulation: Adjustable airflow (3-12m/s) for uniform heating throughout the reflow oven chamber.
High-Efficiency Flux Recovery: Integrated vapor extraction system reduces residue by >90%.
Safe Reflow Oven Operation
Dual Lead-Screw Lift Mechanism: Enables single-button furnace opening/closing with safety interlocks.
Configurable Reflow Zones: Dual or triple reflow zone options accommodate complex thermal profile requirements.
Intelligent Process Control
Closed-Loop Conveyor System: Computer-controlled speed (0.2-2.5m/min) with manual override capability.
Online UPS Protection: Automatic reflow profile preservation during power failures prevents product damage.
HNY-8820-ASXD Large double track reflow soldering machine — Intelligent Soldering Solution for High-Efficiency Electronics Manufacturing
Specification
| Model | |
| Dimensions | 5000*1400*1500 |
| Gross weight | 2000Kg |
| Number of heating zones | Above 8 Below 8 |
| Heating zone length | 2900mm |
| Heating method | Small circulation heating |
| Number of cooling zones | 2 |
| Cooling zone length | 1100mm |
| Cooling method | Air Cooling |
| Machine color | Computer White |
| Air volume requirements | 10 M3/Minx2 toroughfare |
| Hearth open | Electric screw |
| Shipping Part Parameters | |
| Mode of transport | Double track chain + mesh belt |
| Transport belt width | 700mm |
| Rail width adjustment range | 50-(50~510)mm |
| Transport connection height | 900±20mm |
| Transport speed | 300-2000mm/min |
| Shipping direction | L-R(optional; R-L |
| Control section parameters | |
| PCB 3-point temperature difference | ±1.5℃ |
| Temperature Control Accuracy | ±1℃ |
| Adjacent temperature difference | The haeting zone is around 50 degress,and the heating and welding zones are around 100 degress |
| Temperature control range | room temperature~350℃ |
| Temperature control method | Closed loop control + SSR |
| Power supply | 3-phase 5-wire system |
| Total Power | 70KW |
| Nomal working power consumption | Settable |
| Starting power | 23KW/35KW |
| Abnormal alarm | Temperature alam (ultra-high and ultra-low temperature after constant temperature |
| Option | |
| Dualtrack differential speed | |
| Water-cooling system | |
| N2 system |
Core technology of the machine
Computer control
Transport network chain
Furnace structure
HNY-8820-ASXD Large Double Track Reflow oven
Engineered for high-volume electronics production, the HNY-8820-ASXD integrates dual-track synchronous processing and an intelligent control system. This reflow soldering solution significantly enhances soldering efficiency and yield, meeting the demanding large-scale manufacturing requirements in consumer electronics, automotive electronics, telecommunications equipment, and more.
🔥 Core Technological Innovations
Dual-Waveform Synergistic Reflow Soldering System
Turbulent + Laminar Dual-Wave Design: Turbulent waves penetrate high-density pin gaps to eliminate voids during reflow soldering; laminar waves refine joint morphology, minimizing bridging, icicles, and other defects. Adapts perfectly to complex SMT hybrid assembly requirements.
Adjustable Nozzle Solder Pot: Supports 70-350mm nozzle width adjustment, compatible with diverse PCB sizes. Reduces tin oxidation by over 70%, lowering material waste in the reflow oven.
Four-Stage Independent Preheating & Precision Thermal Profile Control
1.8m Full Hot-Air Preheating Zone (four independently controlled stages): Ensures uniform PCB heating to prevent thermal stress damage throughout the reflow process. Preheating temperature (90–130°C) precisely activates flux and evaporates solvent residues.
PID Closed-Loop Temperature Control: Ensures a stable thermal profile with real-time solder pot monitoring (250±5°C) and thermocouple anomaly alerts for consistent reflow soldering quality.
High-Reliability Hardware for Reflow Ovens
Patented Titanium Alloy Fingers: High-temperature resistant, non-sticking, and permanently deformation-free. Triples service life while reducing maintenance downtime in the reflow oven.
Anti-Deformation High-Strength Rails: Worm gear + precision ball screw adjustment structure (accuracy <0.2mm), eliminating board-dropping risks during transport through the oven.
Smart Management & Energy-Saving Reflow Oven Design
PLC + Industrial PC Dual-Control System: Features one-click reflow profile recall, scheduled power/temperature control, and self-diagnosis with troubleshooting guidance.
Eco Mode: Wave auto-start/stop triggered by PCB presence + dynamic tin flow design minimizes energy consumption and dross generation in the reflow soldering process.
Core Technology of the Reflow Soldering Machine
Advanced Computer Control
Robust Transport Network Chain
Optimized Furnace Structure
🚀 Applications & Benefits of Reflow Soldering
Dual-Track Parallel Processing: Supports large boards (70–350mm) for continuous reflow soldering production, boosting throughput by 40%. Ideal for automotive controllers, power modules, and large PCB assemblies.
Lead-Free Reflow Soldering Compatibility: Strong-air cooling and precise temperature compensation meet the high-temperature requirements of lead-free alloys (e.g., SAC), ensuring compliance with RoHS standards.
Zero-Defect Reflow Soldering Assurance: Closed-loop flux spraying (digital pressure display) and isolated fume extraction ensure soldering cleanliness, with residues consistently below stringent IPC thresholds.
Empowering High-Efficiency Reflow Soldering — Three Reasons to Choose HNY-8820-ASXD
✅ Reliability: Torque limiter + motor overload protection enables 24/7 uninterrupted reflow oven operation.
✅ Intelligence: Cloud-based reflow profile storage and remote monitoring enable seamless Industry 4.0 integration.
✅ Cost Efficiency: Advanced tin oxidation control + anti-oxidant additives reduce annual solder costs by >15% in your reflow soldering process.