Professional Cleaner for Packaging Substrate
The CN-6700SM In-line Cleaner for Packaging Substrate is a high-end and precise cleaning solution developed by CNSMT based on over 15 years of experience in electronic equipment manufacturing.
It is specifically designed for cleaning flux residues in high-reliability packaging devices such as Flip-Chip, SIP , and lead frames. This equipment integrates patented technology with intelligent control, meeting the strict requirements for cleanliness in advanced packaging processes
- Integrated cleaning
- Precision spray technology
- Intelligent control
- Reliable structure
- Widely applied
- Specification
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| Equipment Dimension | 7000(L)x1700(W)x1750(H) mm |
| Cleaning Product Dimension | Max 400(L)x600(W)x60(H) mm Min 50*50 mm (requires fixture for securing) |
| Conveying Speed | Adjustable between 100–1500 mm/min |
| Conveying Height | 850–950mm |
| Working Width | 600 mm |
| Water Consumption | 10~15L/min (adjustable based on actual cleaning conditions) |
| Board Entry/Exit Direction | Left in, right out |
| Control | Touch screen and Mitsubishi PLC control |
| Power Requirement | AC 380V 3P 50HZ 120KW 180A |
CN-6700SM In-line Cleaner for Packaging Substrate Detailed parameters
🔍 Solving Core Industry Challenges: Precision Cleaning
In high-end electronic packaging, cleaning sub-50μm micro-gaps beneath substrates has long been a critical challenge. Traditional equipment often leaves residual contaminants in dead zones, compromising device reliability. The CN-6700SM In-line Cleaner for Packaging Substrate eliminates flux, organic residues, and ionic contaminants through its innovative spray system and fluid dynamics design, achieving thorough penetration cleaning in micro-gaps and delivering a “contaminant-free” surface for chip packaging.
⚙️ Technological Highlights & Innovative Design
Integrated High-Efficiency Cleaning Process
Combines chemical cleaning → pure water rinsing → hot-air drying into a single inline workflow, enabling continuous production and significantly shortening cycle time. Its multi-stage cascade overflow rinsing system (fine-rinse water overflows to pre-rinse tanks) prevents cross-contamination, ensuring cleanliness exceeds IPC standards.Patented Drying & Precision Spray Technology
Air-Knife Shearing + Recirculating Hot Air Dual-Mode Drying: Achieves complete substrate drying in ≤30 seconds, eliminating watermarks.
Adjustable Spray Bar Matrix: Customizable spray angles and pressure adapt to diverse substrate sizes and gap structures.
Optional High-Frequency Ultrasonic Spray Bar: Enhances cleaning penetration for ultra-fine gaps (<50μm).
Intelligent Process Control
Real-time monitoring and auto-dosing of cleaning chemistry to ensure process consistency.
Centralized parameter management via 7-inch industrial touchscreen, with MES connectivity for traceable cleaning data.
Concentration sensors + closed-loop flow control reduce chemical consumption by 15%.
High-Reliability Structure & Scalability
Full stainless-steel corrosion-resistant body withstands high-temperature chemical solvents.
Modular design: Compatible with optional automated loading/unloading robots and custom multi-lane transport systems.
Future-ready spray bar layout with upgrade interfaces for evolving complex packaging processes.
🧩 Key Application Scenarios
Flip-Chip: Flux cleaning under BGA/CSP solder balls.
SIP (System-in-Package): Contaminant removal from multi-chip stacked substrates.
Lead Frame Devices: Organic residue clearance between leads.
High-Reliability Fields: Cleaning for 5G modules, automotive-grade power modules, and medical electronics.
Engineered for Future Packaging – The CN-6700SM In-line Cleaner for Packaging Substrate with its precision, intelligence, and scalability, establishing itself as foundational equipment for high-yield packaging production.
FAQ
❓ Q: Is the device compatible with substrates of different sizes/thicknesses?
✅ A: Supports highly customizable transport systems:
Standard configuration: Compatible substrate sizes ranging from 50×50mm to 300×300mm, with thicknesses from 0.2 to 5.0mm
Extended options: Customizable multi-channel (2-6 channels) or super-large substrate (up to 600×600mm) transmission solutions are available, with automatic adjustment and adaptation of spray pressure and Angle.
❓ Q3: How to control the consumption of cleaning solution? Does it support environmentally friendly solvents?
✅ A: Smart energy saving design + wide solvent compatibility:
Closed-loop concentration control system: Real-time monitoring and automatic liquid replenishment, reducing chemical consumption by 15%
Compatible solvent types: water-based cleaning agents, semi-water-based solvents, alcohols (such as IPA), environmentally friendly hydrocarbons
Waste liquid treatment: Built-in staged filtration device to extend the solvent life and reduce the amount of waste liquid discharged.
❓ Q5: How does the equipment ensure consistent cleaning?
✅ A: Triple intelligence guarantee:
Sensor network: Real-time monitoring of temperature, flow rate, concentration, and TOC (Total organic carbon)
Process traceability: Automatically record and store over 1,000 batches of cleaning parameters, and support MES data export
Self-diagnostic system: Abnormal parameters trigger audible and visual alarms and push shutdown protection instructions.