Yamaha YSM10 pick and place machine

The Yamaha YSM10 pick and place machine is a cutting-edge modular mounter designed for high-speed and precise placement of electronic components on circuit boards. It stands out with its ability to handle a wide range of component sizes without needing head replacements, making it a versatile solution for various production needs.

 

  • High-Speed Mounting: Achieves class-leading speed of 46,000 CPH, boosting production output.
  • Versatile Head: Handles a wide range of components (03015mm to 55x100mm) without head changes.
  • Advanced Camera System: Ensures high-precision placement, especially for BGA and CSP components.
  • Unified Platform: Integrates features from YS12 series for excellent compatibility and versatility.
  • Increased Efficiency: Reduces downtime, improves accuracy, and lowers costs.

 

YSM10
Applicable PCBL 510 x W 460mm – L 50 x W 50mm
Note : Available in lengths up to L950mm as an option.
Applicable components03015mm to W55 x L100mm (For parts sizes larger the width 45mm, recognition of parts is divided into sections.), Height 15mm or less
Note : A multi camera (option) is required for part heights exceeding 6.5mm or part sizes exceeding 12mm
Mounting capabilityHM head (10 nozzle) specification : 46,000CPH (under optimum conditions as defined by Yamaha Motor)
HM 5 head (5 nozzle) specification : 31,000CPH (under optimum conditions as defined by Yamaha Motor)
Mounting accuracy
(Under optimum conditions as defined by Yamaha Motor when standard evaluation materials are used)
+/-0.035mm (+/-0.025mm) Cpk 1.0 (3σ)
Number of component typesFixed plate : Max. 96 types (conversion for 8mm tape feeder) Note 1
Tray : 15 types (maximum when equipped with sATS15, JEDEC)
Power supply3-Phase AC 200/208/220/240/380/400/416V +/-10% 50/60Hz
Air supply source0.45MPa or more, in clean, dry state
External dimensionL1,254 x W1,440 x H1,445mm
WeightApprox. 1,270kg
  • Versatile Head Solution: The YSM10 uses a high-speed, general-purpose head that can place components ranging from tiny 03015mm chips to larger parts up to 55 x 100mm and 15mm in height. This eliminates the need for frequent head changes, saving time and increasing efficiency.

 

  • Advanced Camera System: The improved scan camera enhances the machine’s ability to accurately place larger components up to 12mm. It also supports ball recognition, which is essential for mounting BGA (Ball Grid Array) and CSP (Chip Scale Package) components.

 

  • Flexible Head Options:
    • HM (High-speed Multi) Head: This standard head features 10 nozzles, offering a balance of speed, compactness, and versatility.
    • HM 5 Head: An economical option with 5 nozzles, retaining the HM head’s functionality while catering to different productivity and budget requirements.
  • High-Speed Mounting: By incorporating a next-generation servo system and a lightweight universal head, the YSM10 achieves a class-leading mounting speed of 46,000 CPH (chips per hour), increasing production output.

 

  • Unified Platform: The YSM10 integrates the best features of previous models like the YS12, YS12P, and YS12F into a single platform. This provides excellent component compatibility and versatility in a compact and space-saving design.

 

  • Adaptable Production Configurations: The YSM10 is designed to adapt to various production setups, offering flexibility for different manufacturing needs.

 

  • Multi-Camera System: Enables high-speed and high-accuracy recognition of components with sizes exceeding 12mm or heights exceeding 6.5mm.

 

  • Automated Nozzle Management:
    • Nozzle Station: Allows automatic replacement of standard and special-order nozzles, ensuring continuous operation.
    • Blow Station: Automatically cleans nozzle shafts to maintain optimal condition, with health checks and protection against using faulty nozzles.
  • Automatic Tray Supply: The “sATS15” unit can load up to 15 parts trays, streamlining the component feeding process.

 

  • Intelligent Feeders: Compatible with electric-drive “SS feeder” and “ZS feeder” systems, ensuring reliable component delivery.
  • Increased Speed and Efficiency: The high mounting speed and versatile head design significantly boost production efficiency.
  • Improved Accuracy: The advanced camera system and stable pickup system ensure precise component placement, reducing errors and improving product quality.
  • Reduced Downtime: Features like automatic nozzle replacement and component recognition optimization minimize downtime and keep production running smoothly.
  • Greater Flexibility: The YSM10’s ability to handle a wide range of components and adapt to different production configurations makes it a flexible solution for various manufacturing environments.

Presenting the details of

 Yamaha YSM10 pick and place machine

 

Yamaha-YSM10-pick-and-place-machine

 

The YSM10 is built upon a philosophy of integration and optimization. It combines the strengths of previous models, such as the YS12, YS12P, and YS12F, into a single, unified platform. This integration allows for a seamless transition for users familiar with these earlier models while providing a host of new features and improvements. The modular design ensures that the YSM10 can be easily adapted to various production needs, making it a versatile asset for any manufacturing facility.

Key Features in Detail

Versatile Head Solution:

  • Description: The YSM10 utilizes a high-speed, general-purpose head that is capable of handling an extensive range of component sizes. From the smallest 03015mm ultra-micro-chips to larger components measuring up to 55 x 100mm and 15mm in height, this head can manage it all.
  • Benefits: The primary advantage of this versatile head is the elimination of frequent head replacements. In traditional mounters, switching between different component sizes often requires manual head changes, which can be time-consuming and prone to errors. The YSM10’s universal head streamlines the process, saving valuable production time and reducing the risk of mistakes.
  • Application: This feature is particularly beneficial for manufacturers dealing with diverse product lines or those requiring frequent changeovers in component types.

 

Advanced Camera System:

  • Description: The YSM10 features an enhanced scan camera system that significantly improves the machine’s ability to accurately place components, especially those larger in size (up to 12mm). Additionally, it supports ball recognition, a critical function for mounting BGA (Ball Grid Array) and CSP (Chip Scale Package) components.
  • Benefits: The advanced camera system ensures high-precision placement, which is essential for modern electronic devices that demand tight tolerances. Ball recognition is particularly important for BGA and CSP components, where accurate alignment is crucial for reliable connections.
  • Application: This feature is vital for manufacturers producing high-density circuit boards or those working with advanced component types.

 

 

Flexible Head Options:

HM (High-speed Multi) Head:

  • Description: The standard HM head is equipped with 10 nozzles, providing an optimal balance of speed, compactness, and versatility.
  • Benefits: This head is designed for high-throughput applications, allowing for the rapid placement of components without sacrificing accuracy. Its compact design ensures that it can operate efficiently in tight spaces.
  • Application: Ideal for manufacturers who need to maximize production speed while maintaining high levels of precision.

 

HM 5 Head:

  • Description: The HM 5 head is an economical alternative with 5 nozzles, retaining the core functionality of the HM head but at a lower cost.
  • Benefits: This option is perfect for manufacturers with budget constraints who still require the advanced features of the YSM10. It provides a cost-effective solution without compromising on essential performance.
  • Application: Suitable for smaller production runs or manufacturers who prioritize cost savings without sacrificing quality.

 

 

 

High-Speed Mounting:

  • Description: The YSM10 incorporates a next-generation servo system and a lightweight universal head to achieve a class-leading mounting speed of 46,000 CPH (chips per hour).
  • Benefits: This high-speed capability significantly increases production output, allowing manufacturers to produce more units in less time. The advanced servo system ensures smooth and precise movements, while the lightweight head reduces inertia and allows for faster acceleration and deceleration.
  • Application: Essential for manufacturers who need to meet high-volume production demands or those looking to reduce their production cycle times.

 

 

Unified Platform:

  • Description: The YSM10 integrates the best features of previous models like the YS12, YS12P, and YS12F into a single platform.
  • Benefits: This unified platform provides excellent component compatibility and versatility in a compact and space-saving design. It simplifies maintenance and training, as operators only need to be familiar with one system.
  • Application: Ideal for manufacturers who want a versatile and reliable mounter that can handle a wide range of components and production requirements.

 

 

Adaptable Production Configurations:

  • Description: The YSM10 is designed to adapt to various production setups, offering flexibility for different manufacturing needs.
  • Benefits: This adaptability allows manufacturers to easily reconfigure the machine to meet changing production demands. Whether it’s a small-batch production run or a high-volume manufacturing operation, the YSM10 can be tailored to fit the specific requirements.
  • Application: Suitable for manufacturers who need a flexible mounter that can adapt to different production scenarios.

 

 

Multi-Camera System:

  • Description: Enables high-speed and high-accuracy recognition of components with sizes exceeding 12mm or heights exceeding 6.5mm.
  • Benefits: This feature ensures that even larger components are accurately recognized and placed, reducing the risk of errors and improving overall product quality.
  • Application: Vital for manufacturers who work with a wide range of component sizes and shapes.

Automated Nozzle Management:

    • Nozzle Station:
      • Description: Allows automatic replacement of standard and special-order nozzles, ensuring continuous operation.
      • Benefits: Automatic nozzle replacement minimizes downtime and ensures that the machine is always equipped with the correct nozzle for the job.
      • Application: Essential for high-volume production environments where nozzle wear and tear can be a significant issue.
      Blow Station:
      • Description: Automatically cleans nozzle shafts to maintain optimal condition, with health checks and protection against using faulty nozzles.
      • Benefits: This feature ensures that nozzles are always clean and functioning properly, which is crucial for maintaining high-quality placement.
      • Application: Important for manufacturers who need to ensure consistent and reliable performance from their mounter.

      Automatic Tray Supply:

      • Description: The “sATS15” unit can load up to 15 parts trays, streamlining the component feeding process.
      • Benefits: Automatic tray supply reduces the need for manual intervention, allowing the machine to run continuously for longer periods.
      • Application: Ideal for manufacturers who want to automate their component feeding process and reduce labor costs.

      Intelligent Feeders:

      • Description: Compatible with electric-drive “SS feeder” and “ZS feeder” systems, ensuring reliable component delivery.
      • Benefits: These intelligent feeders provide precise and reliable component delivery, reducing the risk of misfeeds and ensuring smooth operation.
      • Application: Essential for manufacturers who need to ensure consistent and reliable component feeding.

Advantages in Depth

 

 

  • Enhanced Speed and Efficiency: The YSM10’s high mounting speed, versatile head design, and automated features significantly boost production efficiency. By reducing the time required to place components, manufacturers can produce more units in less time, leading to increased profitability.
  • Improved Accuracy and Reliability: The advanced camera system, stable pickup system, and automated nozzle management ensure precise component placement, reducing errors and improving product quality. This leads to fewer defects, lower rework costs, and higher customer satisfaction.
  • Reduced Downtime and Maintenance: Features like automatic nozzle replacement, component recognition optimization, and intelligent feeders minimize downtime and keep production running smoothly. This reduces maintenance costs and ensures that the machine is always available when needed.
  • Greater Flexibility and Adaptability: The YSM10’s ability to handle a wide range of components and adapt to different production configurations makes it a flexible solution for various manufacturing environments. This allows manufacturers to easily switch between different product lines and adapt to changing market demands.

How It Works: A Detailed Look

 

The YSM10 automates the process of placing electronic components onto printed circuit boards (PCBs). Here’s a more detailed breakdown of the process:
  1. Component Feeding: Components are fed into the machine using tape feeders, tray units, or other supply methods. The intelligent feeders ensure that components are delivered to the pickup point accurately and reliably.
  2. Component Recognition: The multi-camera system identifies the components and their orientation. The advanced algorithms ensure that even complex components are accurately recognized, reducing the risk of misplacement.
  3. Pickup and Placement: The high-speed head picks up the components and precisely places them onto the PCB according to the programmed coordinates. The servo system ensures smooth and accurate movements, while the lightweight head allows for fast acceleration and deceleration.
  4. Quality Control: The side view function detects any missing parts or pickup errors, ensuring high-quality mounting. If any errors are detected, the machine can automatically correct them or alert the operator.

The YSM10 in the Modern Manufacturing Landscape

 

 

In today’s competitive manufacturing landscape, companies need to be agile, efficient, and innovative to succeed. The  Yamaha YSM10 pick and place machine provides the tools and capabilities needed to meet these challenges. Its high speed, accuracy, and flexibility make it an ideal solution for manufacturers looking to improve their production processes and gain a competitive edge.

Conclusion

The YSM10 is more than just a component mounter; it’s a comprehensive solution that combines speed, accuracy, and versatility. Its advanced features and flexible design make it an excellent choice for manufacturers looking to improve their production efficiency, reduce costs, and enhance product quality. By investing in the YSM10, manufacturers can future-proof their operations and stay ahead of the curve in the ever-evolving world of electronics manufacturing.

FAQ

Do you provide after-sales service?

  • Our professional after-sales service team will quickly resolve any emergencies you may encounter during use.

Warranty period?

  • -The entire machine is covered by a one-year warranty, with free technical support provided after that year.

Do you provide installation and commissioning?

  • On-site installation and commissioning will incur additional fees, including accommodation and airfare.

Shipping method?

  • Typically, shipping is by sea or land. Air freight is more expensive for urgent needs.

 

Packaging and Delivery Information:

 

Delivery: Standard equipment is in stock, while less commonly used models require 10-15 days depending on the situation..

Minimum Order: We accept orders for a single machine or mixed orders to suit your needs.

Transportation: Products are shipped either in bulk or via containers, depending on the order size and destination.

Payment Terms: Flexible payment options are available, including L/C, D/A, D/P, T/T, Western Union, and MoneyGram.

Price: Prices are negotiable to ensure you receive the best possible value.

Packaging: We offer both standard export boxes and robust hardwood packages to ensure your order arrives safely and securely.

 

If you have any other questions, please contact us to obtain more information.

Send Your Inquiry
Scroll to Top