Yamaha YRP10 Key Features

1. High-Speed Printing Performance
   • Core Cycle Time: The YRP10 boasts an impressive core cycle time of just 6 seconds, enabling rapid throughput.
   • Printing Accuracy: With a printing accuracy of μ±6σ : ±16μm Cpk≧2.0 (measured under optimal conditions), the YRP10 ensures precision in every print.
2. Complete Automation
   • Automatic Setups and Changeovers: The printer automates stencil and push-up pin replacements, significantly reducing manual labor and the risk of human error.
   • Nonstop Solder Supply: Equipped with a 12 oz. syringe, the YRP10 supports prolonged, unmanned, nonstop solder printing.
3. Dual-Lane Production
   • Fully Independent Dual-Lane Operation: By connecting two YRP10 units in series, you can achieve fully independent dual-lane operation, doubling your production capacity.
   • Flexible Dual-Lane Configuration: The addition of a traverse conveyor allows for flexible connection to downstream equipment, optimizing workflow.
4. Advanced Printing Head
   • YAMAHA’s Original 3S Head: The 3S (Swing Single Squeegee) head allows for program-controlled squeegee attack angle and speed, ensuring optimal printing conditions for various solders.
5. Stencil Vacuum
   • Consistent High Accuracy: The stencil vacuum mechanism ensures consistent, high-accuracy printing by eliminating stencil droop.
   • Reduced Setup Time: This feature drastically cuts setup time, as no offset entry is needed during back-and-forth printing movements.
6. Built-In Inspection Camera (Optional)
   • Pro-Level Inspections: The optional built-in inspection camera supports comprehensive inspections, providing feedback for over-printing and stencil cleaning.
7. Push-Up Pins for High-Density PCBs (Optional)
   • Versatile Arrangement: Supports up to 200 pins with options for both 5 mm and 2.5 mm-pitched matrix plates, offering a high degree of arrangement freedom.

Yamaha YRP10 Benefits

1. Increased Productivity
   • Faster Cycle Times: The 6-second core cycle time significantly increases the number of PCBs printed per hour.
   • Reduced Downtime: Automatic setups and changeovers minimize downtime, allowing for continuous production.
2. Enhanced Quality
   • High Printing Accuracy: The YRP10’s precision ensures consistent and reliable solder paste application, reducing defects.
   • Consistent Results: The stencil vacuum mechanism and advanced printing head contribute to uniform printing quality.
3. Cost Savings
   • Reduced Labor Costs: Automation reduces the need for manual intervention, lowering labor expenses.
   • Minimized Material Waste: Precise solder application and inspection feedback minimize material waste.
4. Flexibility
   • Dual-Lane Production: The ability to run dual-lane operations doubles production capacity without requiring additional floor space.
   • Versatile PCB Handling: Capable of handling a wide range of PCB sizes, from L50 x W50mm to L510 x W510mm in single-lane mode, and up to L420 x W330mm in dual-lane mode.
5. Improved Reliability
   • Nonstop Operation: The large solder syringe and automatic features ensure prolonged, unmanned operation.
   • M2M Link Solution: Integration with SPI (Solder Paste Inspection) systems allows for real-time feedback and adjustments, enhancing reliability.

Yamaha YRP10 Advantages

1. Superior Printing Technology
   • 3S Head: The Swing Single Squeegee head provides unparalleled control over printing parameters, optimizing solder paste application for various materials and conditions.
2. Automated Precision
   • Automatic Adjustments: The YRP10 automatically adjusts printing parameters based on inspection results, ensuring consistent quality.
   • Reduced Human Error: Automation minimizes the risk of errors associated with manual setups and changeovers.
3. Scalability
   • Dual-Lane Configuration: The ability to connect two YRP10 units for dual-lane production allows manufacturers to scale their operations easily.
   • Flexible Integration: The traverse conveyor and M2M link solution enable seamless integration with existing production lines.
4. Ease of Use
   • Intuitive Interface: The YRP10 is designed with a user-friendly interface, making it easy to program and operate.
   • Simplified Maintenance: Automatic features and robust design reduce the need for frequent maintenance.
5. Comprehensive Support
   • YAMAHA’s Expertise: Backed by YAMAHA’s extensive experience in manufacturing technology, the YRP10 comes with comprehensive support and training.

Yamaha YRP10: How It Works?

1. Setup and Configuration
   • Automatic Stencil Replacement: The system automatically replaces stencils, supporting multiple sizes (L750 x W750mm, L736 x W736mm, etc.).
   • Push-Up Pin Exchange: Capable of handling large PCBs (up to L420 x W420 mm), the system automatically exchanges push-up pins, with options for 5mm and 2.5mm pitch specifications.
2. Solder Paste Application
   • 3S Head Control: The 3S head precisely controls the squeegee’s attack angle and speed to optimize solder paste rolling and prevent dripping.
   • Stencil Vacuum: The stencil vacuum mechanism ensures the stencil remains flat and stable, providing consistent contact with the PCB.
3. Printing Process
   • High-Speed Printing: The YRP10 rapidly applies solder paste to the PCB, achieving a core cycle time of 6 seconds.
   • Dual-Lane Operation: In dual-lane mode, the system can simultaneously process two PCBs, doubling throughput.
4. Inspection and Feedback
   • Built-In Camera: The optional built-in camera inspects the solder paste application, identifying any defects or inconsistencies.
   • M2M Link: The M2M link connects the YRP10 to an SPI system, providing real-time feedback for stencil cleaning and position correction.
5. Continuous Operation
   • Nonstop Solder Supply: The 12 oz. solder syringe ensures a continuous supply of solder paste, minimizing downtime.
   • Automatic Adjustments: The system automatically adjusts printing parameters based on feedback, ensuring consistent quality over long production runs.

M2M Link Solution Details

1. Inspection Result Feedback
   • Stencil Cleaning: Based on inspection results from the SPI system, the YRP10 can automatically initiate stencil cleaning to remove excess solder paste and prevent defects.
   • Position Correction: The printer can correct its position based on feedback, ensuring accurate solder paste application even if there are slight misalignments.
2. Solder Paste Printing Analysis
   • Fluctuation Monitoring: The system displays the link between fluctuations in solder size and solder paste printing status, allowing operators to monitor performance in real-time.
   • Troubleshooting: When defects or problems occur, the analysis tool allows operators to quickly check the solder paste printer status, streamlining quality improvements and line operating rates.

Dual-Lane Fully Independent Production Explained

1. Independent Operation
   • Parallel Processing: The dual-lane configuration allows the printer to process two PCBs simultaneously, effectively doubling the production rate compared to a single-lane setup.
   • Independent Control: Each lane can be controlled independently, allowing for different PCB designs or production requirements to be accommodated at the same time.
2. Flexible Configuration
   • W330 Dual Lane: Large PCBs up to L420 × W330 mm can be produced in a dual lane, maximizing the use of available space.
   • Traverse Conveyor: The addition of a traverse conveyor flexibly connects the YRP10s to downstream equipment, optimizing the flow of PCBs through the production line.
3. Efficiency Gains
   • Increased Throughput: By increasing the number of PCBs taken and conveyed by the carrier, the dual-lane setup boosts production efficiency.
   • Reduced Handling: The automated features of the YRP10 minimize the need for manual handling, reducing the risk of damage and errors.

Prolonged Nonstop Operation

1. Automatic Replacements
   • Stencil Replacement: The system automatically replaces stencils, ensuring continuous operation without manual intervention.
   • Push-Up Pin Exchange: The automatic exchange of push-up pins further reduces downtime and ensures consistent performance.
2. Solder Supply
   • Large Syringe Capacity: The use of a 12 oz. syringe allows for a substantial supply of solder paste, minimizing the need for frequent replacements.
   • Stabilized Solder Rolling: The system maintains a stabilized solder rolling radius, ensuring consistent solder paste application throughout the production run.
3. Prevention Mechanisms
   • Solder Dripping Prevention: The design includes mechanisms to prevent solder from dripping from the squeegee, reducing waste and maintaining cleanliness.
4. Benefits of Nonstop Operation
   • Reduced Man-Hours: Automation reduces the need for manual labor, freeing up personnel for other tasks.
   • Minimized Errors: By minimizing human intervention, the risk of errors in model changeover is drastically reduced.

Conclusion

For inquiries, please contact us at +8613537875415 or Lizzy@smtlinemachine.com. Visit us at Xintian Industrial Area, Baoan, Shenzhen City, China.