DC-500AOI Automated Optical Inspection
Automated Optical Inspection (AOI) is an advanced non-contact imaging technology delivering <3μm resolution for critical quality control across electronics manufacturing. It enables:
PCB assembly verification per IPC-A-610 Class 3 standards
LCD panel defect detection (mura/particles/dead pixels)
Semiconductor package inspection (QFN/BGA lead coplanarity)
- Defect Detection
- Dimension Measurement
- Precision Positioning
- Recognition & Classification
- Data Intelligence
- Specification
- Feather
- Download
Automated Optical Inspection can detect the following common defects and faults:
- Soldering Defects:
- Open Circuits
- Solder Bridges
- Solder Shorts
- Insufficient Solder (not heel of joint)
- Excessive Solder
- Component Defects:
- Lifted Legs
- Missing Components
- Misaligned or Incorrectly Placed Components
- Incorrect Component Values
- BGA and CSP Defects:
- BGA Shorts
- BGA Open Connections
- Surface Feature Defects:
- Bumps, Scratches, and Stains
- Broken Traces
- Solder Paste Printing Defects:
- Presence or absence, misalignment, insufficient or excessive solder, open circuits, contamination, etc.
- Component Mounting Defects:
- Missing parts, misplacement, tilt, vertical components, side-standing components, flipped parts, polarity reversal, wrong parts, damage, etc.
- Solder Joint Defects:
- Excessive solder, insufficient solder, no solder, cold solder, short circuits, solder balls, lifting, etc.
- Other Defects:
- Foreign objects, porosity, indentation damage, color, white spots, cutting defects, chipping, stains, cracks, etc.
🔍 DC-500 Series AOI Technology
Industry-Specific Solutions:
- SMT/PCBA Inspection: Detects 01005 components @ 15μm resolution
- Automotive Electronics: IATF 16949-compliant defect tracking
- Medical Devices: FDA 21 CFR Part 11 validated reporting
- Semiconductor Wafers: ≤3nm particle detection
⚙️ Optical Engine Specifications
Imaging System:
- 5.1MP Sony IMX sensors
- RGB programmable dome lighting
- 0.001% distortion telecentric lenses
- Coaxial illumination for micro-void detection
AI Defect Recognition:
- Machine vision algorithms identify:
✓ Sub-10μm cracks/scratches (IPC-A-610 Class 3)
✓ 0.02mm component misalignment
✓ Solder joint anomalies (voids/insufficient wetting) - Deep learning classification: 99.98% accuracy
📊 Performance Highlights
| Capability | DC-500 AOI Performance |
| Inspection Speed | 25 cm²/sec |
| Defect Detection Rate | 99.95% (per IPC-T-650) |
| False Call Rate | <0.1% |
| BGA Void Detection | >95% correlation with X-ray |
Comprehensive Automated Optical Inspection Test Coverage
| Inspection Phase | AOI-Detectable Defects |
|---|---|
| Solder Paste AOI | Absence/deviation, insufficient/excess, bridging, contamination |
| Component AOI | Missing/misaligned/tombstoned components, polarity reversal, wrong parts |
| Solder Joint AOI | Insufficient/excess solder, bridging, cold joints |
| Wave Soldering AOI | Red adhesive verification |
| Through-Hole AOI | Insufficient solder, lifted leads, blowholes, bridging |
Comparison chart of non-conforming and qualified products
🔍 Automated Optical Inspection Detects:
1. Soldering Defects (Per IPC-A-610)
Opens • Bridges • Shorts
Insufficient Solder (Heel Voiding) • Excessive Solder • Cold Joints
2. Component Anomalies
Tombstoning • Missing Parts • Misalignment
Incorrect Values • Reversed Polarity • Lifted Leads
3. Advanced Package Faults
BGA/CSP: Shorts • Opens • Voiding (>15% X-ray correlated)
QFN: Skewing • Perimeter Wetting Defects
4. PCB Feature Defects
Scratches/Stains • Broken Traces • Solder Mask Peeling
Contamination • Micro-cracks (<10μm detection)
5. Solder Paste Defects
Misregistration • Insufficient/Excessive Deposit
Smearing • Stencil Clogging (SPI-correlated)
6. Assembly Process Faults
Missing Components • Misoriented ICs • Bent Leads
Damaged Packages • Incorrect Part Placement
7. Critical Process Deviations
Foreign Objects • Voids • Indentation Damage
White Residue • Delamination • Edge Chipping
⚙️ AOI Performance Metrics
| Defect Type | Detection Accuracy | Resolution |
|---|---|---|
| Solder Bridges | 99.97% | 20μm |
| Component Shift | 99.95% | 15μm |
| BGA Voiding | 99.2% (w/X-ray) | 5% volume |
| Trace Fractures | 99.8% | 30μm length |
The Specifications of Layana Automated Optical Inspection Machine
Scratch detection: the algorithm will search for dark stripes of a specified length in the target area and calculate the average brightness value of the dark stripe area.
The algorithm can be used to detect scratches, cracks, etc. on flat surfaces.
Intelligent judgment: This algorithm collects various qualified and unfavorable image samples, establishes an intelligent judgment model through training, and calculates the similarity of the images to be measured.
This algorithm simulates the human thinking mode and is difficult to detect problems with some traditional algorithms. You can handle it easily. For example: peak soldering spot detection, resetting tin ball detection, polarity detection of circular components, etc.
DC-500 Series AOI Optical Engine
Precision AOI Imaging System:
High-resolution AOI cameras (5MP+)
Tri-color dome AOI lighting technology
Telecentric lenses for distortion-free imaging
Coaxial LED illumination for surface defect detection
Advanced AOI Defect Recognition:
Machine vision algorithms detect:
✓ Sub-10μm scratches/cracks
✓ Component coplanarity deviations
✓ Micro-solder joint anomaliesAI-powered AOI classification engine
Hardware configuration:
- Size: 40 × 40mm~450 × 330mm (larger sizes can be customized according to customer requirements)
- Thickness: 0.3mm to 6mm
- Board weight: ≤ 3KG
- Testing PCB specifications: upper clear height ≤ 35mm, lower clear height ≤ 70mm (special requirements can be customized)
- Minimum test component: 0201 component, IC with a spacing of 0.3 millimeters or more (optional up to 01005 component)
If you need,please contact us.