Best PCB surface cleaning machine Supplier in China
LSM-400 PCB surface cleaning machine is specially designed for PCB manufacturing and assembly process, and is committed to solving problems such as pad oxidation and dust residue, significantly improving welding yield and product reliability.
It is suitable for the production of precision electronic components such as high density interconnection (HDI), flexible circuit board (FPC) and IC carrier board.
- Multi-mode clean technology
- Intelligent closed-loop control
- Super clean treatment, improve the yield
- High efficiency and energy saving, green production
- Fully automated integration
- Specification
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| LSM-400 Plasma panel cleaning machine Pecification | |
| Board size (L×W)~(L×W) | (50×50)~(500×350) |
| Overall dimension (L×W×H) | 530×820×1350 |
| Weight | 100Kg |
LSM-400 PCB surface cleaning machine core advantage
Pecification
| Technical parameter | |
| description | This equipment is used in the production ine before printing, to activate surface tension, can meet the high standard of cleaning needs increase solder joint adhesion, clean surface foreigrmatter and eliminate surface static electricity, applied between the plate machine and the printing press suitable for Al and SMT cleaning needs |
| Board thickness | 0.6-5mm thickness automatic adjustment |
| Power source | 100-230V AC(User specified), single phase, Max volt-amps |
| Air pressure and air flow | 4-6 bar, up to 40L/min |
| Cleaning roller | Up*2 |
| Dusting roll | On *1 volume |
| Single side cleaning support | 1 set of support frame |
| Brush set | Anti-static high-precision brush |
| Dust collection | Dust collector |
| Antistatic device | One set for eachentrance and exit |
| Speed | 0-9m |
| Transfer height | 900±20mm(or user specified) |
| Transmission direction | Left → Right or Right → Left(optional) |
Product instruction
- Modular drawer design, can be carried out at any time according to different workneedsBrush cleaning or roller brush synchronous cleaning switch
- PLC control system
- Easy to use touch screen panel, easy to operate
- High speed spiral brush ensures the cleanliness of working objects
- The use of high-quality cleaning roller to provide the best cleaning effect and service life
- Patented coupling transmission structure,easy to operate the machine, increase theservice life of the parts
- Roller and support group drawer design for easy operation and maintenance
- Using bottom support PCB plane contact, more conducive to cleaning effect
- Three-color warning device provides different warning messages* Compatible with SMEMA interface
Core technology highlights
Multi-mode cleaning technology:
The composite process of plasma cleaning, ultrasonic micro-etching and gas-liquid dual-phase injection is used to accurately remove oxides, organic residues and particulate pollutants on the surface of the pad, while activating the metal surface to enhance solder wettability and reduce the defects of virtual welding and air welding.
Intelligent closed-loop control:
Equipped with high-precision sensors and AI algorithms, real-time monitoring of cleaning effects and automatic adjustment of parameters (such as power, temperature, detergent concentration) to ensure batch stability, suitable for different materials PCB (FR4, ceramic base, metal substrate).
Super clean treatment, improve the yield
Cleaning accuracy of Danami level, remove contaminants without damaging copper foil, solder resistance layer, ensure line integrity.
After surface activation, the oxide layer thickness of the pad is reduced to < 1nm, and the welding strength is increased by more than 30%.
High efficiency and energy saving, green production
The use of recyclable environmental protection detergent, no toxic exhaust emissions, waste liquid treatment costs reduced by 50%.
The modular design supports fast cable change, and the cleaning cycle of the board is less than 30 seconds, which helps the production capacity climb.
Fully automated integration
Compatible with SMT production line online mode, support automatic loading and unloading, CCD alignment and MES data docking, to achieve unmanned operation.
Optional online AOI detection module, quality judgment immediately after cleaning, reduce rework rate.
Typical application scenario
PCB manufacturing end:
The inner copper foil is cleaned, the glue is removed after drilling, and the surface is activated before copper deposition/plating.
SMT pre-assembly processing:
Remove the oxidation of the pad, clean up the solder resistance ink residue, and improve the adhesion of the solder paste.
Semiconductor packaging:
Chip carrier board cleaning, gold finger surface decontamination, to ensure the reliability of wire/reverse welding.
Rework and high-end applications:
Precision cleaning and anti-oxidation treatment of military and aerospace PCB.
FAQ
Q1: How to quickly troubleshoot equipment failure?
A: Built-in intelligent diagnosis system, real-time monitoring of the operating status and prompt fault code (such as “insufficient air pressure”, “sensor abnormal”). Users can refer to the manual for preliminary handling, or contact engineers for online guidance through the remote operation and maintenance system.
Q2: Will the solder mask or copper foil of PCB be damaged during cleaning?
A: No. The device uses intelligent energy control technology (such as plasma power, injection pressure adaptive adjustment) to ensure that the cleaning effect is only for the pollutant layer, and does not damage the solder resistance ink, copper foil or micro-wiring, and guarantees the electrical performance of the PCB.
Q3: What are the advantages of LSM-400 PCB surface cleaning machines compared to traditional chemical cleaning or ultrasonic cleaning?
A: Traditional cleaning relies on chemical solvents or single physical cleaning, easy to residual pollutants and poor environmental protection. The LSM-400 PCB surface cleaning machine combines plasma, ultrasonic and gas-liquid dual-phase injection technology to completely remove nano-level oxides, organic residues and particulate pollution, while activating the pad surface to improve welding reliability, and no toxic waste liquid discharge throughout the process.
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