Best Automatic Tin dipping machine Supplier in China
This automated tin dipping system replicates manual immersion principles through programmable controls, executing PCB tin dipping operations where boards automatically enter the tin bath at optimized angles, achieve uniform solder immersion coating in the soldering zone, and transfer via conveyor to downstream processes – ensuring consistent solder coverage while eliminating manual handling risks.
MSD-500B Automatic Tin dipping machine advantage
- Flexible process adjustment
- Precise temperature control
- Energy-saving and efficient
- Strong adaptability
- Environmental design
- Complete machine technical parameters
- Other important system parts
- MSD-500B Automatic Tin dipping machine Control system
| Section | Description |
|---|---|
| Furnace Chamber Dimensions | L450 * W300 * H90 |
| Needle Plate Width | Max. L390 – W265mm |
| Working Surface Height | 750±20mm |
| PCB Board soldering Speed | Adjustable as needed |
| PCB Board Conveying Angle (soldering Tilt Angle) | Adjustable as needed (0-10°) |
| PCB Board Component Pin Height Limit | Max. 0-40mm |
| Preheating Time | Adjustable as needed (seconds) |
| Applicable Solder Types | Lead-free solder/Regular solder |
| Heating Method | High-efficiency U-shaped heating tube + cast iron plate |
| Solder Pot Power | 4kw |
| Solder Pot Solder Capacity | Approx. 90kg |
| Solder Pot Temperature | Room temperature to 300℃, control accuracy ±1-2℃ |
| Heating Time | 40 minutes |
| Temperature Control Method | P.I.D + SSR |
| Overall Machine Control | Mitsubishi PLC |
| Power Supply | 220V |
| Startup Power (Total Power) | Max. 4kw |
| Normal Operation Power | Approx. 0.6kw |
| Frame Dimensions | L735 × W640 × H1300mm |
| Outer Dimensions | L735 × W700 × H1350mm |
| Overall Machine Weight | Approx. 85kg |
Shell part
| Section | Description |
|---|---|
| Chassis Structure | The latest streamlined exterior design, using industrial square tubes as the frame, and steel plate bending for the casing. The machine has 4 casters at the bottom and 4 leveling feet for positioning (adjustable for machine level and height). |
| Front Door Structure | Detachable structure with hand knobs, providing maximum maintenance space. |
| Top of the Chassis | Removable vent design on the top. |
| Surface Treatment | The entire machine is spray-painted in computer white. |
Preheating mode
| Section | Description |
|---|---|
| Preheating Method | The PCB board is placed on the needle plate, then lowered to a position just above the solder surface, where it stays for a certain period to achieve preheating; the duration can be adjusted as needed. |
| Temperature Control Method | HuiBang temperature controller with PID control for precise and reliable temperature regulation, equipped with an imported thermocouple detection system. |
| Heating Component | An external U-shaped high-temperature heating plate is used, which heats up quickly, has a long lifespan, and low thermal inertia; the temperature zone is uniformly heated. |
Tin furnace section
| Solder Pot Material | Lead-free specialized stainless steel material, high-temperature resistant, corrosion-resistant, suitable for lead-free processes, and long-lasting. |
| Solder Pot Features | Sloped design at both ends to maximize space savings for solder. |
| Heating Component | Uses imported from Taiwan, dry-burning resistant ceramic high-temperature heating plates with a long service life; the external heating system employs lower layer heating for the solder pot, which is more precise, prevents tin splashing, and features multiple reinforcement ribs for anti-deformation. |
1.The control system is stable and reliable, with high-grade configuration and convenient operation.
2.The lower machine adopts Mitsubishi PLC and Huibang microcomputer temperature control;
3.Mitsubishi programmer (PLC) communication, communication is stable and reliable, the use of Mitsubishi communication software, the communication rate can be adjusted up to 187.5KBPS, instruction transmission time <=0.2 milliseconds.
The communication port of the upper computer is automatically identified, and the corresponding dialog box for selecting the communication port is not required on the interface. Communication line using Mitsubishi special line (PC/PPI CABLE), strong anti-interference;
4.Weekly time setting (can be set seven days a week, three times a day automatic switching time).
5.Head, with emergency emergency system, special, emergency, please press.
Why choose MSD-500B automatic environmental protection tin immersion machine?
Hand dipping furnaces, wave soldering and automatic dipping furnaces
| Project | Hand Solder Pot | Wave Soldering | Automatic Solder Dipper |
|---|---|---|---|
| Investment | Small | Large | Small |
| Labor Recruitment | Difficult to recruit and retain | Difficult to recruit, high wages | Ordinary workers |
| Labor Skill Requirements | Requires experience | Requires professional skills | Foolproof operation |
| Product Quality | Unstable | Stable | Stable |
| Work Efficiency | Low | High (requires large volume) | High (4 times that of hand solder pot) |
| Long Pin Operation | Possible | Requires two or more devices | Possible |
| Tin Oxidation | Small | Very large | Small |
| Product Batch Changeover Time | Short | Long | Short (different batches can be soldered simultaneously) |
Automated Tin Dipping System Application Scope
High-Mix PCB Tin Dipping
Universal immersion soldering machine accommodates multi-specification PCB batches with straight-pin components – zero machine adjustments required between product changeovers.Niche Electronics Tin Coating
Ideal for instrument manufacturers, power plants, and LED processors requiring precision solder coating for low-volume, high-variability boards.Complex PCB Immersion Solutions
Proprietary fixtures enable automated tin dipping for any PCB configuration – solving challenging solder joint coverage issues.
MSD-500B Eco Tin Dipping System Advantages
Precision Solder Coating Performance
Mimics manual technique ensuring uniform tin dipping without cold joints
Servo-controlled immersion depth (0.1mm accuracy)
Adjustable dipping angles & lift speeds reduce surface tension
Dual-heater tin bath maintains ±3°C uniformity (PID controlled)
Automated Immersion Soldering Efficiency
4× faster than manual PCB dipping
Batch processing capability
Oxide auto-scraping per cycle
<2kWh energy consumption with timer
Advanced Tin Dipping Technology
Flux activation preheating
Titanium alloy solder pot (600°C rating)
Programmable immersion parameters:
✓ 0-70mm coating depth
✓ 0.1s dwell time incrementsPLC+touchscreen tin dipping control
Industrial-Grade Tin Dipping Safety
Semi-enclosed solder coating chamber
Eliminates molten tin splash risks
ROHS-compliant fume management
Ergonomic loading/unloading
FAQ
Question:
What is the difference between soldering machine and wave soldering and reflow soldering?
Answer:
Tin-dipping machines are suitable for small batches or manual work, wave soldering is suitable for high volume production, and reflow soldering is suitable for surface mount technology (SMT) components.
Question:
How does the immersion machine reduce the oxidation of solder during soldering?
Answer:
The use of inert gas protection, the maintenance of a clean tin furnace and the correct temperature, and the regular removal of tin slag can reduce solder oxidation.
Question:
What does the daily inspection of the tin immersion machine include?
Answer:
Routine inspections include checking solder levels, cleaning the surface of the tin stove, checking the heating system and ensuring all safety measures are in place.
