Best reflow oven Supplier in China
The advantages of the MSD-B6610-LF six temperature zone hot air reflow soldering machine include high soldering accuracy, good soldering quality, suitable for high density and complex circuit board designs, and low labor costs. It is particularly suitable for large-scale production environments, as it can be integrated with automated equipment for efficient and high-yield soldering operations.
MSD-B6610-LF six temperature zone hot air reflow soldering machine advantage
- High efficiency
- Consistency
- Flexibility
- Reduced labor
- Energy saving
- Complete machine technical parameters
- Model and brand of key accessories
| PLC and Temperature Control Module | Siemens PLC |
| Computer Control Host, Monitor | Lenovo |
| Number of Heating Zones | 6 small circulation heating zones on top, 6 small circulation heating zones on bottom. |
| Length of Heating Zones | 2400MM |
| Number of Cooling Zones | 1 external air cooling system |
| Length of Cooling Zones | 600 mm |
| Conveyor Belt Width | 450 mm |
| Guide Rail Width Adjustment Range | 50～350 mm |
| PCB Dimensions | 50-350 mm |
| PCB Height Limit | 25mm |
| Conveying Direction | L-R (R—L), direction can be chosen before manufacturing |
| Conveying Method | Belt + Guide Rail |
| Conveyor Belt Height | 900±20 mm |
| PCB Transport Speed | 0～1.8m/min |
| Temperature Control Accuracy | ±1-2℃ (static) |
| Temperature Control Range | Room temperature to 300℃ adjustable |
| Applicable Solder Types | Lead-free solder/Tin-lead solder |
| Temperature Control Method | PID+SSR |
| Types of Components Used | CSP, BGA, μBGA, 0201 chip, etc., for single/double-sided panels |
| Abnormal Alarm | Temperature(over-temperature alarm after stabilization) |
| Power Failure Protection | UPS effectively prevents PCB board damage during sudden power outages |
| Power Supply | 3Φ, 380V, 50HZ |
| Startup Power | 25KW |
| Operating Power | 6KW |
| Heating Time | Approx. 20min |
| Machine Dimensions | L38009501450 mm |
| Net Weight | 800kg |
| Component | Description |
|---|---|
| PLC and Temperature Control Module | Hoson PLC |
| Computer Control Host | Professional brand machine: CPU: Intel G530 dual core, Motherboard: Gigabyte H61M |
| Memory | Kingston 2GB |
| Hard Drive | SSD Solid State 60GB |
| Monitor | Lenovo 18.5-inch LCD |
| Conveyance Motor | Taiwan Leohard |
| Gearbox | Taiwan Leohard 90W 1:100K |
| UPS Power Supply | ATA |
| Hot Air Motor | Sanyo 90W |
| Chain | 35B Carbon Steel Chain |
| Cylinder | AKS |
| Solenoid Valve | AKS |
| Regulating Valve, Fittings | AKS |
| Intermediate Relay | Chint |
| Frequency Converter | Taiwan Delta |
| Heating Wire | Taiwan Taizhan, imported nickel-chromium wire |
| Photoelectric Switch | Omron |
| Solid State Relay | Berme 40A |
| Main Switch | Chint |
| Air Switch | Chint |
| Cooling Fan | Chint |
| Three-Color Light | Chint |
| Fuse | Chint |
| Emergency Stop Switch | Chint |
| Buzzer | Chint |
| AC Contactor | Chint |
| Thermocouple | Insulated K-type, Taiwan Pandate |
| Push Button Switch | Chint |
MSD-B6610-LF six temperature zone hot air reflow soldering machine detailed information
MSD-B6610-LF six temperature zone hot air reflow soldering machine technical characteristics
⚡ High Efficiency
Completes high-volume soldering in minimal time, boosting production throughput.
🎯 Consistency
Precise control of reflow soldering parameters ensures uniform joint quality across all PCBs.
🔄 Flexibility
Adapts to diverse PCB sizes/shapes and multiple solder materials (including SAC305/SnBi).
🤖 Reduced Labor
Automated reflow process minimizes manual intervention and human error.
💡 Energy Saving
Advanced insulation and optimized thermal profile reduce power consumption by 25% vs conventional ovens.
♻️ Waste Reduction
Closed-loop solder paste dispensing (±0.01g accuracy) minimizes material waste.
✨ Enhanced Quality
±1°C zone temperature control improves joint reliability (IPC Class 3 compliant).
📱 Programmability
Intuitive HMI with 100+ reflow profile storage for rapid process changeovers.
🧼 Low Maintenance
Minimal flux residue generation reduces post-soldering cleaning.
⚙️ Versatility
Simultaneously handles mixed-technology assemblies (SMT/THT).
🤝 Automation Ready
SMEMA-compatible interfaces for seamless inline integration.
⏱️ Rapid Adaptation
<5-minute reflow profile switching supports high-mix production.
❄️ Thermal Shock Mitigation
Gradual heating/cooling slopes (0.5-3°C/sec) protect sensitive components.
🛡️ Safety Compliance
Meets CE/UL safety standards with automatic emergency shutdown.
🌱 Eco-Friendly
Integrated flux fume filtration (>95% capture efficiency).
CAD diagram of MSD-B6610-LF machine
🔥 Reflow vs Wave Soldering: Key Differences
| Aspect | Reflow Soldering | Wave Soldering |
|---|---|---|
| Principle | Pre-applied paste melted in hot zones | PCB passes over molten solder wave |
| Process | Closed oven with controlled atmosphere | Open tank with exposed solder |
| Component Suitability | SMD dominance (0201 to large BGAs) | Through-hole components priority |
| Thermal Control | Multi-zone thermal profiling | Limited temperature adjustment |
| Residue | Minimal flux residue | Requires post-cleaning |
| Precision | ±1°C per zone control | ±5°C typical variance |
What is the difference between reflow soldering and wave soldering?
Soldering principle:
Reflow soldering:
A solder (usually solder paste or preformed solder) pre-placed on the PCB board is melted by heat in a reflow furnace to form a soldering. The hot air or steam in the reflow furnace transfers heat to the PCB board, melting the solder to form a solder joint.
Wave soldering:
By melting the solder (usually tin alloy) to form a wave peak, PCB board through the wave peak, the solder melts to form a soldering. Wave soldering usually uses a nozzle or roller to form a wave crest.
Solderingprocess:
Reflow soldering:
The soldering process is closed and solder melting is done in a controlled environment, usually in a sealed reflow furnace.
Wave soldering:
The soldering process is open, the solder is melted in an open container, and the PCB board passes directly through the melted solder crest.
Applicable components:
Reflow soldering:
Suitable for mounting surface mount components (SMD) and through-hole components. Reflow furnaces can handle components of various shapes and sizes.
Wave soldering:
Mainly suitable for the soldering of through-hole components, for mount surface-mount components, usually require additional equipment or processes.
FAQ
Question:
What is the difference between reflow soldering and wave soldering?
Answer:
Reflow soldering uses a pre-placed solder paste that is melted by heat to form a solder joint, while wave soldering is to soldering the PCB through a melted solder crest.
Question:
How to improve the production efficiency of reflow soldering?
Answer:
Production efficiency can be improved by optimizing temperature curves, increasing equipment automation and adopting advanced soldering techniques.
Question:
What is the temperature curve of reflow soldering?
Answer:
The temperature curve is the temperature setting for the different stages of the reflow process, including the preheating, thermal activation, melting and cooling stages.
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