CNSMT-3600PP Encapsulation Cleaning Machine

CNSMT-3600PP Encapsulation Cleaning Machine is professional industrial equipment made specifically for the semiconductor sector. It effectively eliminates flux residue, organic deposits, and inorganic impurities that remain on parts after soldering and assembly work. It works with components like IGBTs, IPMs, CSP, SIP, Flip-Chip units, and lead frames, serving as a key cleaning solution for packaging and assembly lines. Optimized for large-scale, high-density manufacturing, it combines excellent cleaning results with fast processing and reliable operation, fully meeting the strict purity requirements of today’s semiconductor production.

  • Multi-stage spray cleaning to thoroughly remove flux and all contaminants
  • Chemical recycling and water monitoring for stable, cost-efficient operation
  • Complete drying system to ensure components are moisture-free
  • PLC automatic control for precise, consistent processing results
ParameterDetails
ModelCNSMT-3600PP
Cleaning ObjectIGBT, IPM, CSP, SIP, Flip-Chip, Lead Frame and other semiconductor components; removes residual flux, organic/inorganic contaminants after welding
Conveyor Width500mm (customizable for larger sizes)
Conveyor Speed0–1500mm/min (adjustable)
Power Supply380V / 50Hz
Total PowerApprox. 80KW
Machine DimensionsL3600 × W1700 × H1650 mm
Machine WeightApprox. 1800kg
Construction MaterialImported PP material (acid & alkali resistant, no dust generation)
Control SystemPLC + Touchscreen (Chinese/English bilingual)
Core FunctionsChemical cooling & recycling; water resistivity monitoring (optional real-time monitoring); multi-stage spray cleaning & rinsing; air curtain isolation; high-pressure & hot air drying
Cleaning ProcessInfeed → Isolation → Chemical Pre-wash → Chemical Cleaning → Chemical Isolation → Air Curtain Isolation → DI Rough Rinse → DI Fine Rinse → Final Rinse & Isolation → High-Pressure Air Dry → Hot Air Dry → Outfeed
  • Designed for cleaning IGBT, IPM, CSP, SIP, Flip-Chip, Lead Frame and other semiconductor components
  • Large-flow spray washing removes both organic and inorganic contaminants effectively
  • Conveyor width 500mm (customizable), speed adjustable from 0–1500mm/min
  • Made entirely of imported PP material, acid and alkali resistant, no dust generation
  • PLC control with Chinese/English touchscreen, supports program storage and editing
  • Built-in chemical cooling recycling system and water resistivity monitoring function
  • Delivers superior cleaning performance, ideal for high-density mass production
  • Reduces cleaning agent consumption, lowers overall operating costs
  • Corrosion-resistant build ensures stable performance and long service life
  • Fully automatic process, easy to operate and saves labor
  • Meets strict cleanliness standards required in semiconductor packaging
  • Compact structure, easy to install and convenient for maintenance

Presenting the details of CNSMT-3600PP Encapsulation Cleaning Machine

 

CNSMT-3600PP Encapsulation Cleaning Machine

CNSMT-3600PP Encapsulation Cleaning Machine delivers exceptional cleaning results for a wide range of high-precision components including IGBT, IPM, power modules, CSP, SIP, Flip-Chip, QFP, BGA, and various lead frame packages, making it an indispensable core equipment for post-production cleaning in semiconductor packaging lines, SMT assembly, and power electronics manufacturing. Designed specifically for high-volume, high-density, and high-purity production environments, it combines powerful cleaning capability with stable throughput and outstanding operational efficiency, fully satisfying the strictest cleanliness and reliability standards required in modern electronic component fabrication.

Product Highlight

  1. Superior & Consistent Cleaning Performance: Adopts a high-flow, high-pressure targeted spray technology combined with multi-stage process design. It penetrates deep into gaps, crevices, and dense structures to strip away both organic and inorganic pollutants thoroughly, ensuring uniform surface purity and zero residue, even for complex-shaped components.
  2. High Flexibility & Customization: Features a standard effective working width of 500mm, with options to customize wider sizes up to 800mm or more according to production needs. The conveyor speed is continuously adjustable from 0–1500mm/min, allowing precise matching with different component types, contamination levels, and production speeds.
  3. Maximum Cost & Resource Efficiency: Equipped with advanced chemical cooling, filtration, and recycling systems that extend cleaning agent lifespan and reduce consumption by over 30%, significantly lowering running costs. It also includes a precision water resistivity monitoring system (with real-time data logging option) to maintain rinse water quality while optimizing water usage and minimizing waste discharge.
  4. Ultra-Durable & Contamination-Free Construction: The entire machine body, tanks, and fluid contact parts are manufactured from high-purity imported PP polypropylene material. It offers excellent resistance against acids, alkalis, and most industrial solvents, generates zero dust or particles, prevents secondary contamination, and supports long-term stable operation in cleanroom environments.
  5. Intelligent Control & Easy Operation: Built with a reliable PLC control system and user-friendly bilingual (Chinese/English) touchscreen interface. It allows storage of up to 50 different cleaning programs, one-click operation, parameter memory, and fault self-diagnosis. This enables fully automated processing, minimizes human error, and lowers operator skill requirements.
  6. Robust & Production-Oriented Design: Features a compact, space-saving layout with a sturdy structural frame. Designed for 24/7 continuous industrial operation, it includes safety interlocks, leakage protection, and over-temperature alarms, ensuring high stability, safety, and long service life under heavy-duty working conditions.
  7. Complete Process Integration: Combines cleaning, rinsing, isolation, and drying in one continuous line. It integrates air curtain separation technology to prevent cross-contamination between zones and ensures components exit completely clean, dry, and ready for the next manufacturing stage.

How It Works

The CNSMT-3600PP operates through a scientifically designed, fully automated multi-stage process flow that ensures effective cleaning while providing maximum protection for sensitive components. The workflow is precisely controlled by the PLC system, with parameters adjustable for different requirements:

  1. Infeed & Isolation: Components are evenly placed on the conveyor and enter the first isolation chamber. This separates the unclean loading area from the internal processing environment, preventing external dust and contaminants from entering and maintaining internal cleanliness.
  2. Chemical Pre-Washing: Heated cleaning solution is sprayed at controlled pressure to wet components, soften hardened flux, dissolve oils, and loosen surface residues, preparing them for deep cleaning.
  3. Chemical Main Cleaning: High-flow, high-pressure spray nozzles arranged in upper and lower rows deliver powerful, uniform coverage. The specialized chemical solution reacts with contaminants, breaking down their structure and lifting them away from surfaces and hidden gaps completely. Continuous filtration keeps the cleaning fluid pure and effective.
  4. Chemical Isolation: Special water-based barriers and baffles prevent chemical solution from flowing into the rinsing section, avoiding cross-contamination and reducing chemical carry-over loss.
  5. Air Curtain Isolation: High-velocity air streams form an effective barrier between processing zones. This eliminates mixing of different media, reduces solvent evaporation, and ensures stable process conditions.
  6. DI Water Rough Rinsing: Low-resistivity deionized water flushes away the bulk of remaining chemicals and dissolved impurities, rapidly reducing surface contamination levels.
  7. DI Water Fine Rinsing: High-purity deionized water (monitored by resistivity sensors) performs precision rinsing to remove all trace residues and ionic contaminants, ensuring the surface meets ultra-high purity standards.
  8. Final Rinse & Isolation: A final rinse cycle ensures absolute cleanliness, with isolation preventing recontamination before the drying phase begins.
  9. High-Pressure Air Drying: Powerful air knives blow off surface water and force air into small gaps and under components to remove trapped moisture effectively.
  10. High-Temperature Hot Air Drying: Heated, filtered air circulates uniformly to evaporate any remaining moisture completely, ensuring components are 100% dry without water spots or oxidation risks.
  11. Cooling & Outfeed: Components pass through a cooling zone to stabilize temperature before exiting, ready for direct packaging, testing, or further processing.

Application Process

Suitable Applications

  • Post-soldering and post-encapsulation cleaning for semiconductor discrete devices, integrated circuits, and power modules
  • Precision cleaning for advanced packaging: CSP, SIP, Flip-Chip, WLCSP, and System-in-Package
  • Cleaning of lead frames, ceramic substrates, PCB assemblies, and metal carriers after reflow or wave soldering
  • Removal of rosin-based, water-soluble, and no-clean flux residues
  • Elimination of ionic contamination to prevent electrochemical migration and corrosion
  • Cleaning before coating, potting, or wire bonding processes to ensure strong adhesion and reliability

Application Steps

  1. Preparation: Identify component specifications, type of contamination, and required cleanliness level. Select the appropriate cleaning agent and confirm process requirements such as temperature and pressure.
  2. Program Setup: On the touchscreen, create or recall a stored program. Set parameters including conveyor speed, chemical temperature, spray pressure, rinse time, water resistivity threshold, and drying temperature. Save settings for repeated use.
  3. Pre-Operation Check: Verify levels of cleaning solution and DI water, ensure filtration systems are installed, check air supply pressure, and confirm all safety guards are in place.
  4. Loading: Arrange components evenly and flat on the conveyor belt, ensuring no overlapping or stacking that could block cleaning or drying.
  5. Automatic Processing: Start the cycle. The machine runs all stages automatically. Sensors monitor water quality, temperature, and system status in real time; alarms activate if any parameter deviates from the set range.
  6. Quality Verification: After processing, inspect components using visual check, ion contamination testing, or particle counting to confirm results meet standards.
  7. Routine Maintenance: Follow the schedule to replenish chemicals, replace filter elements, clean spray nozzles, check pumps, and drain or refresh tanks to maintain consistent cleaning quality and extend machine lifespan.

Technical Requirements

  • Power Supply: 3-phase 380V / 50Hz, stable power source with sufficient capacity (minimum 100KW supply recommended); proper grounding is required for safety and control stability.
  • Water Supply: Continuous supply of Deionized (DI) water with inlet resistivity ≥ 10 MΩ·cm; pressure 0.2–0.4 MPa; standard connection size provided.
  • Compressed Air: Clean, dry compressed air supply at pressure 0.5–0.7 MPa, free from oil and water; required for air curtains, drying, and pneumatic components.
  • Drainage: Connected to industrial waste water treatment system; machine includes collection and drainage ports for liquid discharge.
  • Installation Environment: Indoor installation only; clean, dust-free, well-ventilated space; ambient temperature 15–30°C; relative humidity 40%–80%; suitable for Class 1000–10000 cleanroom integration.
  • Floor Requirements: Flat, level floor with load-bearing capacity ≥ 2000kg; adequate space for operation, maintenance, and material handling.
  • Operator Training: Basic training on operation interface, program setting, safety procedures, and daily maintenance is required; no special technical background needed after training.

Primary Uses

  • Semiconductor Packaging Industry: Essential cleaning step for power semiconductors, logic chips, sensors, and discrete components; ensures reliability and extends service life of devices.
  • Power Electronics Manufacturing: Used in production of IGBT modules, rectifiers, inverters, and automotive electronic components where insulation and corrosion resistance are critical.
  • Advanced SMT Assembly: Ideal for high-end PCB assemblies, medical electronics, aerospace components, and communication devices requiring zero-defect standards.
  • Quality Assurance & Reliability: Removes ionic residues that cause leakage, corrosion, or short circuits; helps manufacturers pass industry reliability tests and certification requirements.
  • Process Standardization: Provides consistent, repeatable cleaning results essential for ISO, IATF, and other quality management system compliance.

Conclusion

CNSMT-3600PP Encapsulation Cleaning Machine represents an advanced, comprehensive solution designed to meet the highest demands of modern semiconductor and electronics manufacturing. It combines powerful multi-stage cleaning technology, durable corrosion-resistant construction, intelligent automated control, and eco-friendly resource-saving features into one complete system.

It effectively handles a wide range of component types and contamination levels, ensuring superior, consistent cleanliness that directly improves product reliability and production yield. While it has defined requirements for utilities, installation environment, and regular maintenance, these are balanced by significant advantages: low long-term operating cost, easy operation, safety, and stable performance.

For manufacturers focused on quality, efficiency, and compliance with international standards, the CNSMT-3600PP is not just cleaning equipment — it is a strategic investment that ensures product excellence and strengthens market competitiveness in high-tech industries.

For inquiries, please contact us at +8613537875415 or Lizzy@smtlinemachine.com. Visit us at Xintian Industrial Area, Baoan, Shenzhen City, China.

FAQ

Do you provide after-sales service?

  • Our professional after-sales service team will quickly resolve any emergencies you may encounter during use.

Warranty period?

  • -The entire machine is covered by a one-year warranty, with free technical support provided after that year.

Do you provide installation and commissioning?

  • On-site installation and commissioning will incur additional fees, including accommodation and airfare.

Shipping method?

  • Typically, shipping is by sea or land. Air freight is more expensive for urgent needs.

 

Packaging and Delivery Information:

 

Delivery: Standard equipment is in stock, while less commonly used models require 10-15 days depending on the situation..

Minimum Order: We accept orders for a single machine or mixed orders to suit your needs.

Transportation: Products are shipped either in bulk or via containers, depending on the order size and destination.

Payment Terms: Flexible payment options are available, including L/C, D/A, D/P, T/T, Western Union, and MoneyGram.

Price: Prices are negotiable to ensure you receive the best possible value.

Packaging: We offer both standard export boxes and robust hardwood packages to ensure your order arrives safely and securely.

 

If you have any other questions, please contact us to obtain more information

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