Zenith Alpha True 3D AOI Machine
- AI-powered Patented True 3D Multi-projection Tech
- Ultra-high Component Inspection up to 25mm Height
- Full WFMI Whole-board Foreign Material Inspection
- Intelligent KAP Auto Programming & High-speed Throughput
- KSMART SPC Data System & Smart Factory Connectivity
- High Precision Zenith Alpha 3D AOI
- Key Features
| Category | Item | Specification |
| Core Inspection Technology | Inspection Principle | Patented Multi-projection Moiré Fringe 3D Measurement + AI Dynamic Defect Recognition Algorithm, shadow-free & reflection-resistant true 3D volumetric inspection |
| Core Advantage | Eliminates solder reflection & component shadow interference, reduces false rejection rate by over 80% vs traditional 2D AOI | |
| Vision System | Industrial Camera | 8MP high-resolution color industrial camera with premium telecentric lens |
| Configurable Resolution | 15μm / 20μm / 25μm (customizable for different precision & speed demands) | |
| FOV Options | 30×30mm / 40×40mm / 50×50mm | |
| Z-axis Resolution | 0.37μm; Height measurement accuracy: ±1μm | |
| Min Detectable Component | 01005 microchip, min solder pitch: 100μm | |
| Max Inspectable Component Height | 25mm (solves tall component inspection blind spot) | |
| Light Source | IR+RGB multi-band LED structured light, adaptive brightness adjustment | |
| Inspection Performance | Full 3D Scanning Speed | Max 86.4 cm²/s, standard: 12.8~52.5 cm²/s |
| Per FOV Inspection Time | ≈0.26s/FOV | |
| Measurement Repeatability | ＜10% @6 Sigma for 01005 solder joints | |
| Defect Coverage | Missing component, offset, tombstoning, reversed polarity, insufficient/excess solder, bridging, cold solder, pad contamination, foreign material, solder ball, burr | |
| Special Function | WFMI Whole-board Foreign Material Inspection, 2D+3D composite full-board detection | |
| Mechanical & Conveyor System | PCB Size Range | Single track: 50×50 ~ 490×510mm; Max optional size: 50×50~850×690mm |
| Conveyor Mode | Single lane, automatic width adjustment, fully SMEMA compliant | |
| PCB Warpage Compensation | Exclusive Z-tracking 3D real-time warp compensation + IR Pad referencing compensation, auto corrects bow/twist/stretch deformation | |
| PCB Thickness Range | 0.4~6.0mm | |
| Conveyor Height | 900±40mm, adjustable | |
| Software & Connectivity | Operating System | Windows 10 Enterprise 64-bit, multi-language support (English/Chinese/Spanish/German) |
| Core Software Function | KAP AI Auto Programming System, KSMART Industrial Big Data Platform, full SPC statistical analysis (Xbar/R chart, Cp/Cpk), real-time data recording & custom report export | |
| Connectivity | Open TCP/IP port, seamless MES/SMEMA docking, supports interconnection with SPI, printer, mounter, reflow oven for closed-loop production optimization | |
| Optional Upgrade | Offline programming module, auto barcode scanning, remote monitoring system | |
| Machine Basic Specifications | Overall Dimension | W1000×D1335×H1627mm |
| Net Weight | 820kg | |
| Power Supply | AC220V/200-240V, 50/60Hz, single phase | |
| Air Requirement | 0.4~0.6MPa (4~6kgf/cm²), standard factory compressed air | |
| Working Environment | Temperature: 10~40℃, Humidity: 30%~80% RH, non-condensing |
- AI-powered Patented True 3D Multi-projection Tech
Adopts proprietary multi-angle Moiré fringe projection + AI dynamic measurement, completely eliminates inspection shadow & solder reflection interference, delivers true volumetric 3D data for solder joints, cuts false failure rate drastically. - Ultra-high Component Inspection up to 25mm Height
Supports max 25mm tall component testing, solves traditional AOI blind spot for tall electrolytic capacitors and large modules; compatible with tiny 01005 microchip inspection for high-density PCB. - Full WFMI Whole-board Foreign Material Inspection
Integrated 2D+3D composite detection to spot full-board foreign debris, solder ball, burr, dropped chip besides component & solder defects, avoid hidden finished-product failure risk. - Intelligent KAP Auto Programming & High-speed ThroughputKAP AI auto-programming shortens program setup time; balances high inspection speed and micron-level precision, fits high-volume mass-production SMT inline lines with multiple configurable resolution options.
- KSMART SPC Data System & Smart Factory Connectivity
Built-in KSMART platform for real-time SPC statistical analysis, records full solder volume/height data; supports MES/SMEMA docking to realize closed-loop production optimization, easy for Industry 4.0 workshop construction.
CNSMT supplies brand-new and pre-owned Koh Young Zenith Alpha True 3D AOI equipment, a cost-effective mainstream automated optical inspection machine widely deployed for post-reflow PCBA quality testing across global SMT manufacturing industries. Developed with Koh Young’s patented multi-projection Moiré fringe + AI dynamic measurement technology, this 3D AOI effectively eliminates inspection shadow and solder reflection defects that plague conventional 2D and partial 3D detectors, generating authentic volumetric 3D data of solder joints and cutting false rejection rate significantly.
Supporting maximum 25mm tall component measurement, Zenith Alpha perfectly inspects tall electrolytic capacitors and large modules while covering ultra-fine 01005 tiny chips for high-density circuit boards, solving long-standing detection blind spots of traditional AOI devices. Equipped with unique WFMI whole-board foreign material inspection function, it combines 2D & 3D composite imaging to spot missing chips, bridging, insufficient solder, solder balls, burrs and scattered foreign debris comprehensively, avoiding hidden finished-product failures caused by overlooked tiny defects.
Featuring proprietary KAP intelligent auto-programming system, the machine shortens program setup duration drastically; multiple optional resolutions enable flexible configuration to balance high inspection speed and micron-level precision, matching diversified mass-production requirements of consumer electronics, automotive PCB and new energy circuit workshops. Built-in KSMART industrial big-data platform supports real-time SPC statistical analysis, records full solder height, volume and offset data, and seamlessly connects with MES and SMEMA communication ports to realize closed-loop intelligent production optimization for Industry 4.0 smart factories.
CNSMT has exported our new and refurbished Zenith Alpha 3D AOI to Southeast Asia, Europe, Middle East and Latin America. All second-hand units undergo full disassembly maintenance, precision calibration and aging testing before delivery, while brand-new machines come with official factory warranty. Beyond single AOI supply, our team provides full one-stop SMT & DIP turnkey production line service covering solder printers, chip mounters, reflow ovens, SPI and wave soldering equipment. Our global after-sales engineers deliver flexible on-site installation, calibration and operator training, alongside permanent remote online technical support to help customers smoothly launch production and control manufacturing cost efficiently.
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