CNSMT-3D-SPI Sintec Offline SMT/PCB Inspection Machine
CNSMT-3D-SPI SinicTek Offline SMT/PCB Inspector is used for solder paste inspection on SMT production lines. It accurately checks solder paste thickness, volume and position deviation on PCBs. This CNSMT-3D-SPI SinicTek Offline SMT/PCB Inspector detects insufficient solder, excess solder and offset defects. It conducts offline precise PCB inspection to eliminate SMT process risks. The CNSMT-3D-SPI SinicTek Offline SMT/PCB Inspector ensures PCB quality and improves SMT production yield.
- High-precision 3D detection:Accurately measure solder paste thickness, volume and position
- Comprehensive defect recognition:Detect insufficient solder, excess solder, offset, bridging and other flaws
- Offline operation: Does not occupy production line stations
- Strict quality control: Eliminate process risks and boost production yield
- User-friendly design: Simple interface, easy operation and debugging
- CNSMT-3D-SPI SinicTek Offline SMT/PCB Inspection Machine Specifications
- Key Features
- Advantages
| Parameters | |||
| Model | T-1010a | T-2010a | T-3010a |
| Measurement Principle | 3D white light PSLM PMP(Programmable Spatial Light Modulation, Phase Measurement Profilometry) | ||
| Measurements | (volume、acreage、height、XYoffset, shape) | ||
| Detection of Non – Performing Types | (missing print,insufficient tin, excessive tin, bridging, offset, mal-shapes, surface contamination) | ||
| Camera Pixel | 1.3M | 5M | 5M |
| Lens Resolution | 20um/18um | 16um (13um asoption) | 16um (13um as option) |
| Measurable minimum component | 0402 | 0201 (01005 as option) | 0201 (01005 as option) |
| FOV Size | 26*20mm | 30*30mm | 30*30mm |
| Height Accuracy | 0.37um | ||
| Accuracy | XY direction: 15um XY direction: 10um | ||
| Repeatability | Volume:<lum (4 Sigma); Area:<1% (4 Sigma) (volume:<lum (4 Sigma)); acreage: <1% (4 Sigma) | ||
| GageR&R | <10% | ||
| Inspection Speed | 1.5sec/FOV | 0.5sec/FOV | |
| Quantity of Inspection Head | Single Head Single Head (Twin-Heads as optipon) | ||
| Mark-point Detection Time | 0.5 sec/piece | ||
| Maximun Meauring Height | ±350um ±550um | ||
| Maximun Measuring Height of PCB Warp | ±2mm ±5mm | ||
| Minimum Pad Spacing | 150um (pad height of 150um as the reference) | ||
| Smallest MeasuringSize | rectangle:150um;(round):200um | ||
| Maximum Loading PCB Size | X350 x Y250 mm | X460 x Y350 mm | X700 x Y600 mm |
| Fixed or Flexible Orbit Setting | left orbit | front orbit | front orbit |
| Engineering Statistics | Histogram; Xbar-R Chart; Xbar-S Chart; CP&CPK; %Gage Repartability Data; SPI Daily/Weekly/Monthly Reports | ||
| Gerber & CAD Data Import | Support Gerber format (274x, 274d); Manual Teach model; CAD X/Y, Import of Part No., Package Type, etc. (CAD X/Y, Part No., Package Type imput) | ||
| OperatingSystem Support | Windows 10 Professional (64 bit) | ||
| Equipment Diemension and Weight | 630x480x540mm;75KG | 810x930x530mm;125KG | 1500x1100x 600mm;345KG |
| Options | 1D/2D Barcode scanner;UPS continuous power supply;workstation (T-3010a except | ||
- Detection Technology: Equipped with PMP structured light, RGB triple-color light source and telecentric lens, supports PCB warpage dynamic compensation, low false alarm rate and compatible with special substrates.
- Detection Accuracy: XY resolution 1μm, height accuracy 0.37μm, excellent repeatability, capable of inspecting 01005 ultra-small components.
- Detection Scope: Conduct full 2D & 3D solder paste inspection, covers all common printing defects, compatible with PCB of various sizes and thicknesses.
- Operation Efficiency: 0.3-0.5s per FOV, fast programming via Gerber files, easy operation.
- Hardware Configuration: Integrated steel frame and precision transmission structure, stable and durable operation.
- Software Function: Built-in SPC data analysis system, works independently offline, ideal for sampling inspection, R&D and small-batch production.
- Advanced Technology: Self-developed PMP structured light, no mechanical movement, high precision and low maintenance.
- High Precision: 1μm XY resolution, 0.37μm height accuracy, compatible with 01005 components, volume repeat error ＜1%.
- Stable & Low False Calls: RGB light source, telecentric lens and warpage compensation, fits dark and ceramic substrates.
- Full Inspection: Simultaneous 2D & 3D testing, covers all solder paste printing defects.
- Efficient & User-friendly: 0.3–0.5s per FOV, fast Gerber programming and manual teaching available.
- Reliable Hardware: Integrated steel structure with precision transmission, stable for long-term use.
- Intelligent Analysis: Built-in SPC for process monitoring, anomaly warning and yield improvement.
- Flexible Deployment: Standalone offline operation, ideal for R&D, sampling and small-batch production.
- Cost-effective Solution: Independent core algorithm, equivalent to imported equipment with lower cost and prompt after-sales service.
The in-line platform rich
T series table top equipment providemedium,large and ulta large sizeplatform configuration.
CNSMT-3D-SPI SinicTek Offline SMT/PCB Inspection Machine is a high-precision offline 3D solder paste inspection device for SMT production. Adopting advanced phase modulation measurement technology, CNSMT-3D-SPI SinicTek Offline SMT/PCB Inspection Machine accurately detects PCB solder paste printing defects and realizes pre-process quality control.
Why choose this product?
CNSMT-3D-SPI SinicTek Offline SMT/PCB Inspection Machine supports dual 2D and 3D inspection with micron-level accuracy, avoiding detection errors. Its offline design fits flexible production without occupying line tact time. CNSMT-3D-SPI SinicTek Offline SMT/PCB Inspection Machine provides traceable detection data to help optimize printing processes and reduce production costs.
Core technologies and features
MultiArray Mark Detection
For multi-array PCB mark,use dynamic capture function, there is no need to capture image one by one and reduce detect time dramatically.
GLUE INSPECTION
PSLM 3D measur ement cam reach +1200um,with RGB Tune function is capable of high accurate measuring of none transparent glue process, include missing,overflow,excess,shape and combination view df 2D/3D images.
Bad Mark On The Fly Detection
Automatically on the fly detect PCB bad mark, feed info into pick and placement machine in real time controlloop.
MULTI OPTIONAL BARCODE FUNCTION
Both camera barcode and external 1D/2D barcodes are supported, also provide manual key in function.
Close Loop with Printer
Share real time measurement result with printer,and adjust printer parameter in time automatically.
THREE STAGE MAPPING TRACEABILITY
Coolaborate with pre and post AOl eauipment in SMT line ,forms close loop process and quality control system. And cpable to integrate and synchronize the data to customer EPR quality module.
5 MINUTES PROGRAMMING AND ONE PRESS OPERATION
Engineers with any levels of experience canindependently program the system quickly and accurately through Gerber importing software module and the friendly programming intertace. One-button operation by theoperator is designed also greatly reduces the requirements for training.
POWERFUL STATISTIC PROCESS CONTROL SOFTWARE
Real-time SPC information display,provides powerful quality control to the users. Complete variety of SPC tools, are aviable for users at a glance.
MES intelligent manufacturing access capability
Sinictek develops a variety of data format ports, through the SPC system provides simple, fast, and accurate data into the clients’ MES system.
How It Works
- Structured light scanning:CNSMT-3D-SPI SinicTek Offline SMT/PCB Inspection Machine projects precise grating to fully scan PCB solder pad areas.
- High-precision data analysis: The system calculates solder paste height, volume, area and offset through captured images.
- Intelligent defect judgment:It automatically detects insufficient solder, excess solder, bridging, missing print and offset with detailed reports.
New Type – C Technology Platform
Higher Accuracy,More Stable
Application Process
- Start CNSMT-3D-SPI SinicTek Offline SMT/PCB Inspection Machine, import PCB program and complete calibration.
- Place the finished PCB on the working platform of the machine.
- One-click inspection, the machine automatically completes scanning, analysis, judgment and data recording.
SMT whole line schematic diagram
Requirements
Technical & Site Requirements
- CNSMT-3D-SPI SinicTek Offline SMT/PCB Inspection Machine requires a flat, dust-free, constant-temperature workshop without vibration.
- It adapts to standard industrial power supply with compact size and flexible placement.
Operational Requirements
- Operators need to master basic program import, calibration and standard PCB placement.
- Regularly clean the lens and platform to maintain long-term detection accuracy.
What It Is Used For
- CNSMT-3D-SPI SinicTek Offline SMT/PCB Inspection Machine is applied for full inspection and sampling inspection after SMT solder paste printing.
- It eliminates printing defects in advance, reduces rework rates and improves final product yield.
Packaging and Delivery Information:
CNSMT-3D-SPI SinicTek Offline SMT/PCB Inspection Machine adopts customized shockproof wooden box packaging. All machines undergo strict precision calibration and quality inspection before shipment, supporting reliable global delivery.
qualification certificate
Workshop Honors
Partial Honorary Customers
