CNSMT-BH-3500CL packaging cleaning machine
CNSMT-BH-3500CL packaging washing machine is designed for semiconductor packaging cleaning. The CNSMT-BH-3500CL packaging washing machine removes flux residues from BGA and SIP components. The CNSMT-BH-3500CL packaging washing machine fits lead frame pre-molding washing. The CNSMT-BH-3500CL packaging washing machine ensures component cleanliness and steadily raises packaging production yield.
- High-pressure spray cleaning:CNSMT-BH-3500CL packaging washing machine eliminates flux residues completely with no cleaning blind spots.
- Water circulation energy-saving system: Multi-stage filter recycles water to reduce pure water consumption.
- Constant temperature protection:Precise temperature control prevents damage to delicate chips.
- Fully automatic operation:Integrated auto washing and drying process saves labor and boosts output.
- Wide product compatibility: Adjustable fixtures fit all types of semiconductor packages.
- Corrosion-resistant body: Sealed stainless steel structure, long service life and low maintenance.
- CNSMT-BH-3500CL packaging cleaning machine Specifications
- Key Features
- Advantages
| Relevant parameters | |||
| Net belt width: | 600mm customizable large size | Power Supply: | 380V50Hz |
| Cleaning speed: | 0-1500mm/min adjustable | Total power: | About 80KW |
| Equipment size: | L3500*W1700*H1650(mm） | Equipment weight: | About 1800kg |
- Multi-angle high-pressure spraying: Thoroughly remove flux residues without blind areas for BGA, SIP and lead frames.
- Circulating water filtration system: Multi-stage filter recycles cleaning water to cut pure water cost.
- Precise constant temperature control: Protect tiny chips from damage during the whole cleaning process.
- Fully automatic workflow: Auto loading, cleaning, rinsing and drying to lower labor cost.
- Adjustable fixtures: Compatible with different sizes of semiconductor packaging components.
- Stainless steel sealed cabinet: Anti-corrosion, waterproof, long service life and easy maintenance.
- Excellent cleaning effect: Multi-directional high-pressure spray eliminates all flux residue to improve product yield.
- Low operating cost: Circulating water filtration reduces pure water consumption and resource waste.
- Safe cleaning process: Constant temperature design prevents scratches and damage to delicate chips.
- High production efficiency: Fully automatic one-stop operation greatly cuts manual labor input.
- Strong universality: Adjustable fixtures support various semiconductor packaging products.
- Stable long service life: Sealed stainless steel body resists chemical corrosion with simple daily maintenance.
Equipment Features
It is applicable to high-precision inline DI water cleaning systems for mass-production semiconductor chips. Adopting the design principle of medium-low pressure and large flow rate, the machine delivers cost-effective and high-efficiency cleaning performance. It supports DI ice water spraying with heating function to efficiently remove water-soluble flux, dust and foreign contaminants. The whole machine is constructed with corrosion-resistant SUS304 stainless steel for long service life. The nozzles are also made of SUS304 stainless steel with dense layout, which ensures even and large flow output under medium and low pressure. Equipped with PLC control system and Chinese & English graphical operation interface, the programs can be easily set, modified, saved and recalled.
TCleaning Objects:
Water cleaning for flux residues before molding of packaging devices including Flip-Chip, SIP, CSP, BGA and Lead Frame.
Cleaning Process:
Loading → Board Isolation → DI Pre-rinse → DI Fine Rinse → Final Rinse → Air Knife Cutting → Hot Air Drying 1 → Hot Air Drying 2 → Unloading
Why choose this product?
CNSMT-BH-3500CL packaging cleaning machine is a professional automated cleaning device for semiconductor packaging industries.It stands out for high cleanliness, low energy consumption and stable operation, solving the residual and dust pollution problems of traditional cleaning methods. With intelligent constant temperature and circulating water system, the CNSMT-BH-3500CL packaging cleaning machine improves product yield while cutting production costs, ideal for precision packaging production lines.
How It Works
- Omnidirectional high-pressure spray cleaning: The CNSMT-BH-3500CL packaging cleaning machine adopts rotating high-pressure nozzles to achieve dead-angle-free cleaning, thoroughly removing flux residue and fine particles on component surfaces and gaps.
- Constant temperature circulating cleaning: It maintains stable cleaning liquid temperature to avoid damage to precision chips, ensuring consistent cleaning effect for the CNSMT-BH-3500CL packaging cleaning machine in long-term operation.
- Integrated filtration and drying: Multi-stage filtration purifies circulating water, and automatic hot air drying finishes the whole process efficiently, realizing one-stop cleaning of the machine.
Application Process
- Automatic feeding and positioning by the CNSMT-BH-3500CL packaging cleaning machine.
- High-pressure constant-temperature main cleaning.
- Precision pure water rinsing to remove residual impurities.
- Hot air drying to prevent oxidation and water stains.
- Automatic unloading to connect subsequent packaging procedures.
Requirements
Technical & Site Requirements
- The working environment for the CNSMT-BH-3500CL packaging cleaning machine needs to be dust-free, dry and well-ventilated, meeting workshop cleanliness standards.
- Stable power and pure water supply are required to support normal operation of the equipment.
- Reserve enough space for equipment installation, heat dissipation and daily maintenance.
Operational Requirements
- Operators shall master the parameter setting and touch operation of the CNSMT-BH-3500CL packaging cleaning machine.
- Regularly check nozzles and filter elements to guarantee cleaning stability.
- Follow standard operating procedures and complete daily maintenance work.
What It Is Used For
- The CNSMT-BH-3500CL packaging cleaning machine is used for precision cleaning of BGA, SIP, lead frames and other semiconductor packaging parts.
- Effectively remove solder residue, dust and foreign particles in packaging processes.
- Widely applied in consumer electronics, automotive electronics and semiconductor mass production lines.
Packaging and Delivery Information:
The CNSMT-BH-3500CL packaging cleaning machine adopts shockproof and waterproof wooden box packaging for safe transportation. All equipment is fully debugged and tested before delivery. We provide fast delivery and professional door-to-door installation and commissioning services to support rapid production launch for customers.
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