BH-7500 High-Precision Semiconductor Encapsulation Cleaning Machine
The BH-7500 high-precision semiconductor encapsulation cleaning machine is tailored for chip packaging processes. It efficiently removes molding residue, pad flux and fine dust. Equipped with high-precision spray cleaning structure, it delivers consistent cleanliness for IC packages and discrete semiconductors. Gentle and corrosion-free with automatic closed-loop circulation, it saves energy and boosts packaging yield steadily.
It cleans molding residue, pin flux and micro-particles on IC and discrete components post packaging, precisely purifies lead frames and chip pads, eliminates process contaminants, protects chips from corrosion and improves packaging yield and component reliability.
- BH-7500 High-Precision Semiconductor Encapsulation Cleaning Machine Specifications
- Key Features
- Advantages
| Relevant parameters | |||
| Net belt width: | 600mm customizable large size | Power Supply: | 380V50Hz |
| Cleaning speed: | 0-1500mm/min adjustable | Total power: | About 129KW |
| Equipment size: | L7000*W1700*H1650(mm) | Equipment weight: | About 3500kg |
- High-precision spray washing system for thorough removal of micro contaminants with superior cleanliness
- Soft cleaning process to avoid corrosion and damage to delicate chips and pins
- Automatic closed-loop liquid circulation for solvent recycling, energy saving and cost reduction
- Wide compatibility with ICs, discrete components and lead frames
- Sealed dust-proof chamber preventing recontamination and stabilizing production yield
- Ultra-high cleaning precision to remove micron-level contaminants, meeting strict cleanliness standards for high-end semiconductor packaging
- Gentle cleaning process protects delicate chips and pins from corrosion and mechanical damage
- Closed-loop solvent recycling cuts consumable and power consumption to lower operating costs
- Fully automatic operation minimizes manual work, ensuring stable mass production and higher yield
- Sealed dustproof chamber prevents secondary contamination after cleaning
Equipment Features
- Designed for high-volume ultra-precision centralized cleaning of advanced semiconductor chips, balancing cleaning efficiency and cleaning performance.
- Adopts high-flow spray cleaning to efficiently remove flux and other organic/inorganic contaminants trapped in bottom gaps.
- Equipped with DI water resistivity monitoring system; real-time concentration monitor is available as an optional accessory.
- Fitted with chemical section condensation recovery system to greatly reduce cleaner consumption and operating costs.
- Constructed entirely from corrosion-resistant SUS304 stainless steel, compatible with alkaline cleaning agents.
- Controlled by PLC system with Chinese/English graphical HMI; programs can be easily configured, modified, saved and recalled.
Cleaning Objects
Flux residues and organic/inorganic contaminants left after soldering of semiconductor devices including IGBT, IPM, CSP, SIP, Flip-Chip and Lead Frame.
Cleaning Process
Board Loading → Isolation → Pre-Chemical Cleaning → Chemical Cleaning 1 → Chemical Cleaning 2 → Chemical Isolation → Air Knife Blow-off → Isolation → DI Water Pre-Rinse → DI Water Rinse 1 → Final Rinse → Isolation → 1-Stage High-Pressure Cold Air Blow →2-Stage High-Pressure Hot Air Blow → 3-Stage High-Pressure Hot Air Blow → Board Unloading
Why choose this product?
The BH-7500 Semiconductor Precision Packaging Cleaning Machine is a high-precision water cleaning equipment specially developed for semiconductor post-packaging processes, suitable for mass production cleaning of high-end precision components. Adopting an all SUS304 anti-corrosion body, the BH-7500 Semiconductor Precision Packaging Cleaning Machine is durable, easy to clean and fully compatible with cleanroom environments. Compared with ordinary cleaning equipment, the BH-7500 Semiconductor Precision Packaging Cleaning Machine is equipped with a constant-temperature DI water spraying system. Its low-pressure and large-flow cleaning mode avoids damage to precision chips. Equipped with a multi-stage water circulation filtration system, it saves water and reduces operating costs. With stable performance and complete automatic configuration, it is the preferred cleaning equipment for high-precision SMT packaging lines.
How It Works
- Spray Cleaning:The BH-7500 Semiconductor Precision Packaging Cleaning Machine adopts densely arranged nozzles to realize 360° dead-angle-free constant-temperature DI water spraying, thoroughly removing flux, dust and tiny impurities on component surfaces.
- Multi-stage Rinsing:Through pre-rinsing, fine rinsing and final rinsing procedures, it completely eliminates residual contaminants to ensure ultra-high cleanliness of semiconductor components.
- Air Knife Dehydration:The high-pressure air knife system quickly blows off surface water stains to avoid residual moisture.
- Constant Temperature Drying:Dual-stage hot air drying realizes dry-in and dry-out operation with no water marks and no oxidation on workpieces.
Application Process
The standard process of the BH-7500 Semiconductor Precision Packaging Cleaning Machine: Automatic loading → Board isolation protection → DI water pre-rinsing → DI water precision cleaning → Final pure water rinsing → High-pressure air knife dewatering → First-stage hot air drying → Second-stage hot air drying → Automatic unloading. The whole process runs fully automatically without manual intervention.
Requirements
Technical & Site Requirements
- Cleanroom Adaptation: The BH-7500 Semiconductor Precision Packaging Cleaning Machine is suitable for standard semiconductor packaging cleanroom environments, meeting high-precision production cleanliness standards.
- Power & Gas Supply: The BH-7500 Semiconductor Precision Packaging Cleaning Machine supports conventional industrial power supply and standard compressed air source, with low requirements for supporting facilities.
- Site Conditions: The BH-7500 Semiconductor Precision Packaging Cleaning Machine requires flat and well-ventilated installation ground, with reserved space for equipment heat dissipation and daily maintenance.
- Line Compatibility: The BH-7500 Semiconductor Precision Packaging Cleaning Machine can be seamlessly docked with automated semiconductor packaging production lines to realize continuous mass production.
Operational Requirements
- Simple Operation: The BH-7500 Semiconductor Precision Packaging Cleaning Machine features a user-friendly interface, enabling operators to proficiently operate the equipment with simple training.
- Stable & Low Maintenance: The BH-7500 Semiconductor Precision Packaging Cleaning Machine has a low failure rate and simple structure, greatly reducing daily maintenance difficulty and cost.
What It Is Used For
Cleaning Objects: The BH-7500 Semiconductor Precision Packaging Cleaning Machine specializes in pre-mold precision cleaning for Flip-Chip, BGA, CSP, SIP, lead frames and various semiconductor components.
Cleaning Function: The BH-7500 Semiconductor Precision Packaging Cleaning Machine thoroughly removes residual water-soluble flux, micro dust and tiny foreign impurities on component surfaces.
Application Fields: The BH-7500 Semiconductor Precision Packaging Cleaning Machine is widely applicable to high-end packaging industries, including consumer electronics, automotive electronics and power semiconductors.
Production Value: The BH-7500 Semiconductor Precision Packaging Cleaning Machine significantly boosts semiconductor packaging yield and enhances finished product stability.
Packaging and Delivery Information:
The BH-7500 Semiconductor Precision Packaging Cleaning Machine is packed with customized shockproof wooden cases, featuring waterproof and anti-collision performance to ensure intact equipment during long-distance transportation. We have sufficient stock and short delivery cycles, providing one-stop services including on-site installation, commissioning and technical training. Fast nationwide after-sales response ensures stable operation of customer mass production lines.
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