BH-8208UL Ultrasonic Immersion Cleaning Machine

The BH-8208UL Ultrasonic Immersion Cleaning Machine is developed for semiconductor packaging cleaning. The BH-8208UL Ultrasonic Immersion Cleaning Machine removes residual flux and micro impurities from power devices and lead frames via ultrasonic immersion. The BH-8208UL Ultrasonic Immersion Cleaning Machine cleans IGBT and flip chips gently, stabilizing packaging yield for mass precision electronics production.

  • High-frequency ultrasonic cavitation penetrates gaps to eliminate flux and micro contaminants
  • Adjustable soft ultrasonic power ensures damage-free cleaning for IGBT, lead frames and delicate chips
  • Closed solvent recycling reduces consumable cost and energy consumption
  • Multi-tank staged cleaning boosts mass productivity with bilingual PLC intelligent control
  • Anti-corrosion tank compatible with acid/alkaline cleaners, real-time water monitoring for stable cleanliness

 

 

 

Relevant parameters
Net belt width:350 * 350 * 350mm can be customized in large sizesPower Supply:380V50Hz
Cleaning speed:3-15 minutes per basket (adjustable)Total power:About 75KW
Equipment size:L8000*W2200*H2100(mm)Equipment weight:About 3000kg
  • High-frequency ultrasonic cavitation achieves deep decontamination in micro gaps
  • Continuously adjustable ultrasonic power enables gentle cleaning for delicate chips
  • Closed-loop solvent recycling saves consumables and cuts operating costs
  • Multi-tank segmented immersion design supports high-volume automatic production
  • Acid & alkali resistant tank compatible with eco-friendly semiconductor detergents
  • Bilingual PLC control with parameter storage for easy operation and maintenance

 

 

 

 

  • Uniform full-range ultrasonic field achieves higher cleaning coverage in tiny gaps than standard spray cleaning
  • Soft-start ultrasonic buffer delivers low-stress cleaning, preventing crack and latent damage to thin chips and fine pins
  • Constant closed-loop temperature control avoids packaging defects caused by thermal expansion and contraction
  • Multi-stage circulating self-purification extends cleaning fluid service life and reduces consumable replacement frequency
  • Modular flexible stations support fast switching between components, lead frames and power devices for versatile production
  • Built-in safety self-check triggers automatic alarm for abnormal liquid level, temperature and power, securing stable mass operation

 

 

 

 

Presenting the details of BH-8208UL Ultrasonic Immersion Cleaning Machine
Machine

Cleaning Objects

 

Flux residues and organic/inorganic contaminants left after soldering of semiconductor components such as IGBT, IPM, CSP, SIP, Flip-Chip and Lead Frame.

Equipment Features

 

  • Designed for high-volume ultra-precision centralized cleaning of advanced semiconductor chips, balancing cleaning efficiency and cleaning performance.
  • Immersion cleaning effectively removes flux and organic/inorganic contaminants trapped in bottom gaps of components.
  • Fitted with DI water resistivity monitoring system; real-time concentration monitor is available as an optional accessory.
  • Integrated chemical filtration and recovery system drastically cuts detergent consumption and operating costs.
  • Constructed with imported SUS304 stainless steel, delivering high cleanliness without dust or particle shedding, compatible with acidic and alkaline cleaning solvents.
  • PLC control system with Chinese & English graphical HMI allows convenient setup, modification, storage and recall of operation programs.

Cleaning Process

 

Board Loading → Chemical Immersion Tank → Chemical Immersion Tank → Spray Rinse Tank → DI Water Pre-Rinse Tank → DI Water Rinse Tank → DI Water Fine Rinse Tank → Centrifugal Spin-Drying Tank → 1-Stage Cold Air Tank → 2-Stage High-Pressure Hot Air Tank → Board Unloading

 

 

BH-8208UL Ultrasonic Immersion Cleaning Machine

Why choose this product?

 

  • The BH-8208UL Ultrasonic Immersion Cleaning Machine features immersion ultrasonic design, accessing tiny bottom gaps to remove stubborn flux residues that regular cleaning cannot eliminate.
  • Constructed from imported SUS304 stainless steel, it maintains high cleanliness without shedding dust and works well with both acidic and alkaline cleaning solutions.
  • It is fitted with chemical recovery and DI water resistivity monitoring systems, with optional concentration detectors to lower consumable costs effectively.
  • Equipped with a Chinese-English PLC control system, the BH-8208UL Ultrasonic Immersion Cleaning Machine supports program saving and quick retrieval for stable mass production.

How It Works

 

  • High-frequency ultrasonic cavitation generates bursting microbubbles in cleaning liquid to strip organic and inorganic contaminants stuck in component gaps.
  • Dual-tank chemical immersion delivers deep decontamination, followed by multi-stage gradient DI water rinsing to neutralize residual liquid and secure high cleanliness.
  • Integrated centrifugal spin-drying and segmented hot & cold air drying prevents water stains and finishes precision cleaning.

Application Process

 

Board Loading → Chemical Immersion Tank → Secondary Chemical Immersion Tank → Spray Rinse Tank → DI Water Pre-Rinse → DI Water Rinse → DI Water Fine Rinse → Centrifugal Spin-Drying → 1-Stage Cold Air → 2-Stage High-Pressure Hot Air → Board Unloading

Requirements

 

  • The BH-8208UL Ultrasonic Immersion Cleaning Machine needs special environmentally friendly cleaning agents for semiconductors and qualified ultrapure water supply.
  • The workshop must be fitted with standard exhaust systems and waste liquid collection and treatment devices to comply with environmental and safety production standards.

Technical & Site Requirements

 

  • The installation floor meets load-bearing standard with reserved maintenance space; the workshop needs constant-temperature, constant-humidity and dust-free environment.
  • Stable three-phase industrial power, compressed air and pure water shall be connected, matched with waste liquid pipelines and ventilation purification system.

Operational Requirements

 

Operators must receive pre-job training to set ultrasonic duration and temperature properly. Regular filter replacement, water sensor calibration and maintenance for ultrasonic vibrators and drying units are required.

What It Is Used For

 

  • The BH-8208UL Ultrasonic Immersion Cleaning Machine targets IGBT, IPM, CSP, SIP, Flip-Chip and Lead Frame semiconductor components.
  • It removes residual flux, dust, organic and inorganic contaminants left after welding procedures.
  • It supports high-precision cleaning procedures for post-semiconductor packaging mass production.

For inquiries, please contact us at +8613537875415 or Lizzy@smtlinemachine.com. Visit us at Xintian Industrial Area, Baoan, Shenzhen City, China.

Packaging and Delivery Information:

 

The BH-8208UL Ultrasonic Immersion Cleaning Machine is packed in moisture-proof shockproof wooden cases with independent cushion protection for ultrasonic modules and electric control parts. Special vehicle delivery is adopted, with on-site installation, commissioning, operation training, warranty and long-term technical support provided by professional engineers.

cooperative clients

 

sales network

 

CNSMT-BH-3500CL packaging cleaning machine

If you have any other questions, please contact us to obtain more information

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