MIRTEC MV-6 OMNI 3D AOI Inspection Machine
MIRTEC MV-6 OMNI inline 3D AOI adopts 3D Moiré projection inspection technology with ±3μm high precision. It accurately detects various soldering and component defects on PCBs, widely used for quality control in high-end SMT production lines.
- Detect SMD defects including missing components, offset, tombstoning and component reversal.
- Identify solder joint failures such as cold solder, insufficient solder, excess solder, bridging and pinholes.
- Inspect appearance and soldering quality of micro-components like 0201, 03015 chips.
- Carry out 3D measurement of component height and solder paste thickness for 3D dimension verification.
- Support SPC quality data statistical analysis to trace the root cause of production defects.
- Meet inline quality inspection demands of high-precision PCBs for consumer electronics and automotive electronics.
- MIRTEC MV-6 OMNI 3D AOI Inspection Machine Specifications
- Key Features
- Advantages
| Model | MV-6 OMNI | ||||
| Type Code | MV-6_M_OMNI_S_SL | MV-6_M_OMNI_S_DL | MV-6_M_OMNI_T_SL | ||
| Max PCB Size Range | |||||
| Inline AOI | 50 × 50 ~ 510 × 460 mm | 50 × 50 ~ 510 × 590 mm (Single) 50 × 50 ~ 510 × 300 mm (Dual) | 50 × 50 ~ 330 × 460 mm 50 × 50 ~ 510 × 460 mm | ||
| OMNI-Vision 3D/2D Inspection Technology | |||||
| 3D Inspection Technology | Digital 12-projection Moiré Technology | ||||
| High Accuracy | ±3μm | ||||
| Max 3D/2D Inspection Speed | |||||
| 25MP Camera (CoaXPress) | Option | 7.7μm | 1,460mm²/Sec | ||
| 15MP Camera (CoaXPress) | 10μm | 1,890mm²/Sec | |||
| 15μm | 4,260mm²/Sec | ||||
| Max 2D Inspection Speed | |||||
| 25MP Camera (CoaXPress) | Option | 7.7μm | 4,593mm²/Sec | ||
| 15MP Camera (CoaXPress) | 10μm | 5,080mm²/Sec | |||
| 15μm | 10,716mm²/Sec | ||||
| System Specifications | |||||
| Lighting System | 8-segment coaxial color lighting system | ||||
| Side Camera System | Option | 18MP / 10MP digital color side cameras (4 units) | |||
| Software | Standard | Built-in SPC, built-in maintenance software | |||
| Optional | RMS, RRS, IRS, OLTT, RDS, Remote SPC, ePM-AOI | ||||
| Front PCB Clearance | 45mm | ||||
| Rear PCB Clearance | 50mm | ||||
| Max PCB Thickness | 0.5mm~5mm | ||||
| Max PCB Weight | 4kg | ||||
| Min Measurable Size | 25M CXP Camera | 7.7μm | 03015 Chip (mm) / 0.3 Pitch (mm) | ||
| 15M CXP Camera | 10μm | 03015 Chip (mm) / 0.3 Pitch (mm) | |||
| 15μm | 0603 Chip (mm) / 0201 Chip (inch) / 0.4 Pitch (mm) | ||||
| Mechanical Positioning System | X/Y Axis | Synchronized servo motor system | |||
| Power Requirement | Single Phase 200~240V 50~60Hz, 1.1kw | ||||
| Air Pressure | 5 Kgf/cm² (0.5 MPa), 5 LPM | ||||
| Dimension & Weight | |||||
| Dimension (mm) | Machine | 1,080(W) × 1,470(D) × 1,610(H) | |||
| Width (Machine & Conveyor) | 1,110 | 1,110 | 1,270 / 1,450 / 1,630 | ||
| Weight | Approx. 950 kg | Approx. 1000 kg | Approx. 950 kg | ||
※ Disclaimer: Our company accepts no liability for problems arising from the use of uncertified barcode readers. Please contact our headquarters for the catalog of supported barcode reader models.
- Inline 3D AOI featuring OMNI-VISION combined 3D/2D inspection technology and digital 12-projection Moiré technology.
- High inspection accuracy up to ±3μm, capable of inspecting ultra-miniature components such as 0201 and 03015 chips.
- Optional 25MP / 15MP CoaXPress high-speed industrial cameras with flexible inspection speeds.
- Standard 8-segment coaxial color lighting system; 4 sets of digital side cameras available as option.
- Synchronized servo X/Y motion system ensures stable operation and excellent repeat positioning accuracy.
- Compatible with various PCB sizes, suitable for inline inspection in high-end consumer electronics and automotive electronics SMT production.
- Equipped with OMNI-VISION 3D/2D hybrid inspection and 12-projection Moiré technology to lower false calls.
- The High Precision Inline 3D AOI Machine delivers inspection accuracy up to ±3μm, supporting defect inspection for micro components including 03015 and 0201 chips.
- Optional CoaXPress high-definition cameras balancing speed and imaging quality.
- 8-segment coaxial lighting, optional side cameras to detect hidden solder joints.
- Servo X/Y drive system ensures stable operation and consistent mass production inspection.
- Built-in SPC software enables data recording and defect traceability.
- Supports various PCB sizes for inline inspection of automotive & consumer electronics.
Why choose this product?
- 3D+2D hybrid imaging system detects height and visual defects simultaneously.
- Patented Moiré fringe technology removes shadows and improves accuracy for BGA and tiny components.
- High-speed algorithm matches SMT tact time, ideal for mass inline production.
- User-friendly software shortens NPI programming time.
- Precisely detects various PCBA soldering defects and reduces escape rate.
- Stable the 3D AOI Inspection Machine operation lowers maintenance costs.
- Complies with strict standards for automotive, industrial and consumer electronics.
How It Works
- PCBA is transported into the inspection area by conveyor, and the camera together with multi-group light sources captures images.
- 3D Moiré fringe optical technology acquires component height data, combined with 2D planar images to form hybrid information.
- The system automatically compares and analyzes captured images against golden sample data.
- The algorithm identifies various planar and volumetric defects including insufficient solder, excess solder, offset, lifted components and cold joints.
- Defect positions are marked in real time, and inspection data is recorded and saved.
- The PCB exits the MIRTEC 3D AOI Testing Equipment after inspection to realize continuous inline testing.
Application Process
- PCBA is conveyed into the inspection station.
- Multi-directional light sources and imaging system capture 2D planar images and 3D height data.
- The SMT 3D Optical Inspection Machine compares measured data with golden sample references.
- Intelligent algorithm identifies defects such as excess solder, insufficient solder, offset, lifted components and cold joints.
- Mark defect coordinates, store inspection data and output test results synchronously.
- After inspection, PCBA is conveyed out for continuous inline inspection.
Requirements
- The installation environment shall be clean to prevent dust and corrosive gas from interfering with optical lenses.
- Place the SMT 3D Optical Inspection Machine on level ground and minimize vibration to guarantee 3D optical inspection accuracy.
- Stable power supply with reliable grounding is required for continuous operation.
- Ambient temperature and humidity should be kept within specified range to avoid condensation damage to optical components.
- Reserve sufficient space for PCBA loading and unloading to connect with production line.
- Operators shall receive basic training to master programming and routine inspection.
- Regular cleaning of lenses, light sources and conveyor is needed to maintain stable inspection performance.
What It Is Used For
- Conduct inline quality inspection for soldering and assembly of SMT components on PCBA.
- Adopt 3D+2D imaging to detect volumetric and planar defects, overcoming limitations of pure 2D AOI.
- Identify defects including insufficient solder, excess solder, component offset, tombstoning, lifted parts, cold joints and foreign debris.
- Deliver high-precision 3D inspection for BGA, QFN and tiny components.
- Sort defective PCBs in real time to prevent defective products from flowing downstream and reduce customer complaints.
- Collect and archive inspection data to support quality traceability and process optimization.
Conclusion
MIRTEC 3D AOI for Electronic Manufacturing adopts 3D+2D hybrid imaging and Moiré fringe optical technology for inline detection of planar and volumetric soldering defects on SMT PCBA. It delivers high inspection accuracy, especially for BGA, QFN and tiny components, with operating speed matching high-speed SMT production lines. Intelligent software simplifies programming and debugging, effectively reducing escape rate and stopping defective boards. Featuring stable performance, it is widely used in automotive electronics, industrial control and consumer electronics production lines to support PCBA quality control and process traceability.
Do you provide after-sales service?
- Our professional after-sales service team will quickly resolve any emergencies you may encounter during use.
Warranty period?
- -The entire machine is covered by a one-year warranty, with free technical support provided after that year.
Do you provide installation and commissioning?
- On-site installation and commissioning will incur additional fees, including accommodation and airfare.
Shipping method?
- Typically, shipping is by sea or land. Air freight is more expensive for urgent needs.
Packaging and Delivery Information:
Delivery: Standard equipment is in stock, while less commonly used models require 10-15 days depending on the situation..
Minimum Order: We accept orders for a single machine or mixed orders to suit your needs.
Transportation: Products are shipped either in bulk or via containers, depending on the order size and destination.
Payment Terms: Flexible payment options are available, including L/C, D/A, D/P, T/T, Western Union, and MoneyGram.
Price: Prices are negotiable to ensure you receive the best possible value.
Packaging: We offer both standard export boxes and robust hardwood packages to ensure your order arrives safely and securely.
If you have any other questions, please contact us to obtain more information
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