Phoenix Micromex|x neo 160 Microfocus X-Ray Inspection System
Phoenix Micromex|x neo 160 Microfocus X-Ray Inspection System adopts a 160 kV open microfocus X-ray tube with optional diamond window, PlanarCT and 3D CT. Phoenix x|act software enables CAD import and automatic solder joint inspection for non-destructive testing of PCBA, semiconductors, power devices and new energy components.
- Inspection of PCBA solder joints, analyzing voids and poor wetting in BGA, QFN and PTH joints.
- Internal defect inspection for semiconductor packages to detect delamination, cracks and package voids.
- Non-destructive testing of internal structures for power devices and IGBTs.
- Inspection of foreign objects, bubbles and packaging integrity of new energy components.
- Failure analysis of electronic parts and internal structure observation for R&D samples.
- Phoenix Micromex|x neo 160 Microfocus X-Ray Inspection System Specifications
- Key Features
- Advantages
| Specifications | Nanome|x neo 180 | Microme|x neo 180 | Microme|x neo 160 |
| X-ray Detector | Option 1: Waygate Technologies high dynamic response flat panel detector DXR2 50RT, 200μm pixel size, active water-cooled constant temperature; Option 2: Waygate Technologies ultra-large imaging area 100μm high-resolution flat panel detector DXR S100Pro, 30cm × 25cm active area. | Option 1: Waygate Technologies ultra-high resolution flat panel detector DXR S85,85μm, 1,536 × 1,536 pixels; Option 2: High-contrast CMOS flat panel detector with ultra-fine 75μm pixel size, 1,536 × 864 pixels | |
| Geometric Magnification | DXR250RT: Max. 1,970x|DXR S100: Max. 2,185x | Max. 1,970x | |
| Overall Magnification on 27″ 2K Monitor | DXR250RT: Max. 36,800x|DXR S100: Max. 40,700x | DXR S85: Max. 84,800x|CMOS: Max. 96,000x | |
| Detail Resolution | Down to 0.2μm | Down to 0.5μm | |
| X-ray Tube Type | Low-maintenance open-type microfocus, unlimited service life, transmission-type 170° target ray with collimation function | Low-maintenance open-type microfocus, unlimited service life, transmission-type 170° target ray with collimation function | Low-maintenance open microfocus, unlimited service life, transmission-type 170° target ray with collimation function |
| Max. Tube Voltage / Power Rating | 180kV / 20W | 180kV / 20W | 160kV / 20W |
| Diamond window; consistent image quality, data acquisition speed tripled. | Standard aluminium target; diamond|window optional | ||
| Filament | Pre-adjusted filament for fast replacement | ||
| Manipulation System | High-precision vibration-free 5-axis synchronous motion | ||
| Max. Inspection Area | 460 mm × 360 mm (18″×14″) with rotary stage; 610 mm × 510 mm (24″×20″) without rotary stage | ||
| Max. Sample Size / Weight | 680 mm × 635 mm (27″×25″) / 10 kg (22 lbs) | ||
| Tilt & Rotation | Continuously adjustable tilt up to 70°, rotation: 0° ~ 360° | ||
| Control | Joystick or mouse (manual mode), CNC automatic mode | ||
| Motion Assistance | Supports n-to-move & n-zoom-to during inspection; actuator ensures sample centering | ||
| Positioning Aid | Laser crosshair alignment | ||
| Anti-collision System | Laser automatic anti-collision system (can be deactivated to reach maximum magnification) | ||
| Machine Dimension (D×W×H) | 2,160 mm × 1,958 mm × 1,590 mm (85″ × 77″ × 62.6″) excluding control platform 2,772 mm × 1,958 mm × 1,770 mm (109″ × 77″ × 69.7″) including control platform | ||
| Minimum Transport Width | 1,770 mm (69.7″) (including control platform) | ||
| Maximum Total Weight | Approx. 3,250 kg / 7,165 lbs | ||
| Radiation Safety | Compliant with German RoV and US CFR Title 21 Part J. The fully shielded radiation cabinet is exempt from type certification; additional official permits may be necessary for operation. | ||
| Radiation Dose Control | Combined with the dose measurement tool Dosemanger, Shadowtarget supports real-time dose monitoring and cuts radiation exposure by up to 60% to prevent damage to sensitive samples. Dosemanger is available as a separate software option for Shadowtarget. | ||
| Image Processing Software | Phoenix-xact: CAD import-enabled X-ray inspection software featuring image enhancement, measurement functions, and streamlined CAD-based automatic alignment & inspection routines. BGA Module (Standard): Intuitive automatic BGA solder joint analysis, including automated wetting evaluation. VC Module (Standard): Intuitive automated void calculation module for multi-die assembly inspection. | ||
| Optional Software | xact BGA Inspection Module: CAD-based automatic BGA solder joint analysis xact PTH Inspection Module: CAD-based automatic PTH solder joint analysis QP Module: Automatic QFP solder joint inspection QM Module: Automatic QFN/MLF solder joint inspection PT Module: Automatic PTH solder joint inspection C4 Module: Circular solder bump analysis under background structures, e.g. C4 bumps M Module: Multi-layer PCB inspection Quality Review: Visualization module for rework and defect display Flash™: Proprietary image optimization technology from GE | ||
| PlanarCT Module: Non-destructive planar 2D slicing & 3D data analysis with 3D Viewer software | |||
| Optional Hardware | Tilt/Rotation Unit: ±45° tilt and continuous 360° rotation, max. sample load 2 kg; Manual Barcode Scanner: For product identification | ||
| Optional CT Function | Data Acquisition / Reconstruction Software: Phoenix datasx Upgrade module supporting combined 2D and 3D (CT) operation CT Control Unit: High-precision rotary axis Maximum Geometric Magnification: 100× (CT) Maximum achievable voxel resolution: down to 0.2 μm, subject to actual sample dimensions Nanomex supports nanoCT® function for enhanced image sharpness | ||
- Phoenix Micromex|x neo 160 Microfocus X-Ray Inspection System is equipped with a new flat-panel detector featuring excellent pixel resolution (85 / 100 μm), making it ideal for the inspection of semiconductors and micro electronic components.
- Optional 160 kV, 20 W microfocus / 20 W nanofocus X-ray tube delivers detail resolution down to 0.5 μm / 0.2 μm.
- User-friendly operation with automatic inspection report generation.
- The x|act software package enables micron-level automated inspection via CAD file import.
- With diamond window: data acquisition speed doubled while maintaining consistent image quality.
- CT scans can be completed in as fast as 10 seconds.
- ShadowTarget avoids radiation damage to sensitive samples by reducing unnecessary radiation dosage.
- The optical sample overview enables visualization of large-size samples and fast defect positioning.
- High-resolution flat-panel detector, optimized for micro-component inspection.
- Microfocus/nanofocus tube delivering ultra-high detail resolution.
- CAD-linked automatic inspection for higher efficiency.
- Optional diamond window to accelerate data acquisition.
- High-speed CT scanning & ShadowTarget sample radiation protection.
- Optical navigation view for fast defect location & automatic report output.
Why choose this product?
- Equipped with microfocus X-ray source for high-resolution internal imaging, accurately detecting hidden defects such as BGA, QFN, voids in solder joints and internal traces.
- Phoenix Micromex|x neo 160 Microfocus X-Ray Machine features compact layout, supporting non-destructive offline inspection for PCBs, semiconductors and packaged components to meet diverse quality inspection demands in electronics manufacturing.
- Excellent magnification and image contrast with automatic image analysis function, efficiently identifying tiny voids, cracks and delamination to reduce missing inspection rate.
- Professional supporting X-Ray analysis software can automatically calculate void ratio. Data can be archived for traceability to facilitate production quality control.
- Stable operation and easy maintenance, widely adopted in high-precision manufacturing industries including automotive electronics, consumer electronics and semiconductor packaging.
How It Works
- Microfocus X-ray tube emits X-rays to penetrate the workpiece.
- Material absorption differences create varied transmitted signals.
- Detector collects signals and outputs digital 2D images.
- x|act software analyzes images to detect internal defects.
- Shadow|target technology optimizes radiation dose output.
Application Process
- Load the test sample and complete positioning via the optical navigation view.
- Import the corresponding CAD file in x|act software to create an inspection program.
- Configure inspection parameters and exposure settings, select 2D inspection or CT scanning mode.
- Start inspection; the system automatically captures X-ray images. Continuous tomography will be performed under CT mode.
- The software automatically compares images with CAD models to identify internal defects such as voids, delamination and cracks.
- Review inspection results and mark the location and dimension data of defects.
- Automatically generate standardized inspection reports and export data for archiving.
- Unload the sample and finish the inspection cycle.

Requirements
- The Phoenix Micromex|x neo 160 Industrial X-Ray Inspection System shall be placed on flat, load-bearing and anti-static floor.
- Ambient temperature shall be kept at 18–26℃ to avoid drastic fluctuations.
- Relative humidity maintained at 40%–70% without condensation.
- Keep away from vibration sources, dust, corrosive gas and strong electromagnetic fields.
- Connect to stable single-phase industrial power supply with reliable grounding.
- Reserve adequate space in the operation area for sample handling and maintenance of Phoenix Micromex|x neo 160 Industrial X-Ray Inspection System.
- Operators must complete specialized training on radiation safety and operation of Phoenix Micromex|x neo 160 Industrial X-Ray Inspection System.
- Comply with local radiation protection regulations and conduct regular radiation leakage inspection.
What It Is Used For
- PCBA solder joint inspection (void & wetting analysis).
- Detection of delamination, cracks and voids in semiconductor packaging.
- Non-destructive testing for power devices and IGBTs.
- Failure analysis of electronic parts to locate internal failure causes.
- Phoenix Micromex|x neo 160 Industrial X-Ray Inspection Equipment observes the internal structure of R&D samples and supports process verification for new products..
- Mass production quality control to continuously monitor the consistency of internal product processes.
Phoenix Micromex|x neo / Nanome|x neo Premium Micro/Nano Focus X-Ray & CT Inspection Solution
Phoenix Micromex|x neo / Nanome|x neo integrates 2D X-ray and 3D CT technology with excellent positioning accuracy for research, defect analysis and quality control.Equipped with Phoenix x|act software for CAD-based micron-level auto inspection. The actively cooled high-dynamic DXR detector reaches 30fps, delivering crisp images and fast CT scanning.Adopts Shadow|target intelligent dose control, cutting radiation dose by up to 60% and slowing component ageing.
Core Customer Benefits of Phoenix Micromex|x / Nanome|x neo
- Baker Hughes high-dynamic-response DXR digital detector enables clear real-time inspection imaging.
- High-power 180 kV / 20W micro & nano focus X-ray tube, capable of penetrating high-absorption electronic products.
- Efficient automatic CAD inspection program minimizes system setup time.
- Enables real-time matching between CAD and inspection results, even under rotated and tilted viewing angles.
- Delivers excellent defect coverage and repeatability.
- Ultimate detail resolution: 0.5 μm for microfocus tube, 0.2 μm for nanofocus tube.
- Optional Flash!™ image optimization technology.
- 27-inch display facilitates easier defect identification.

Conclusion
Phoenix Micromex|x neo 160 Microfocus X-Ray Inspection System targets non-destructive testing in electronics. Phoenix Micromex|x neo 160 features high-resolution flat-panel detector, optional nanofocus tube and diamond window for sharp imaging and faster acquisition.
Supported by x|act software for CAD-based automatic inspection, together with high-speed CT and ShadowTarget sample protection. Phoenix Micromex|x neo 160 detects internal defects on PCBA, semiconductors and new energy parts, acting as premium microfocus X-Ray equipment for electronic quality control.
Do you provide after-sales service?
- Our professional after-sales service team will quickly resolve any emergencies you may encounter during use.
Warranty period?
- -The entire machine is covered by a one-year warranty, with free technical support provided after that year.
Do you provide installation and commissioning?
- On-site installation and commissioning will incur additional fees, including accommodation and airfare.
Shipping method?
- Typically, shipping is by sea or land. Air freight is more expensive for urgent needs.
Packaging and Delivery Information:
Delivery: Standard equipment is in stock, while less commonly used models require 10-15 days depending on the situation..
Minimum Order: We accept orders for a single machine or mixed orders to suit your needs.
Transportation: Products are shipped either in bulk or via containers, depending on the order size and destination.
Payment Terms: Flexible payment options are available, including L/C, D/A, D/P, T/T, Western Union, and MoneyGram.
Price: Prices are negotiable to ensure you receive the best possible value.
Packaging: We offer both standard export boxes and robust hardwood packages to ensure your order arrives safely and securely.









