Phoenix Micromex|x neo 160 Microfocus X-Ray Inspection System

Phoenix Micromex|x neo 160 Microfocus X-Ray Inspection System adopts a 160 kV open microfocus X-ray tube with optional diamond window, PlanarCT and 3D CT. Phoenix x|act software enables CAD import and automatic solder joint inspection for non-destructive testing of PCBA, semiconductors, power devices and new energy components.

  • Inspection of PCBA solder joints, analyzing voids and poor wetting in BGA, QFN and PTH joints.
  • Internal defect inspection for semiconductor packages to detect delamination, cracks and package voids.
  • Non-destructive testing of internal structures for power devices and IGBTs.
  • Inspection of foreign objects, bubbles and packaging integrity of new energy components.
  • Failure analysis of electronic parts and internal structure observation for R&D samples.
SpecificationsNanome|x neo 180Microme|x neo 180Microme|x neo 160
X-ray DetectorOption 1: Waygate Technologies high dynamic response flat panel detector DXR2 50RT, 200μm pixel size, active water-cooled constant temperature;
Option 2: Waygate Technologies ultra-large imaging area 100μm high-resolution flat panel detector DXR S100Pro, 30cm × 25cm active area.
Option 1: Waygate Technologies ultra-high resolution flat panel detector DXR S85,85μm, 1,536 × 1,536 pixels;
Option 2: High-contrast CMOS flat panel detector with ultra-fine 75μm pixel size, 1,536 × 864 pixels
Geometric MagnificationDXR250RT: Max. 1,970x|DXR S100: Max. 2,185xMax. 1,970x
Overall Magnification on 27″ 2K MonitorDXR250RT: Max. 36,800x|DXR S100: Max. 40,700xDXR S85: Max. 84,800x|CMOS: Max. 96,000x
Detail ResolutionDown to 0.2μmDown to 0.5μm
X-ray Tube TypeLow-maintenance open-type microfocus, unlimited service life, transmission-type 170° target ray with collimation functionLow-maintenance open-type microfocus, unlimited service life, transmission-type 170° target ray with collimation functionLow-maintenance open microfocus, unlimited service life, transmission-type 170° target ray with collimation function
Max. Tube Voltage / Power Rating180kV / 20W180kV / 20W160kV / 20W
Diamond window; consistent image quality, data acquisition speed tripled.Standard aluminium target; diamond|window optional
FilamentPre-adjusted filament for fast replacement
Manipulation SystemHigh-precision vibration-free 5-axis synchronous motion
Max. Inspection Area460 mm × 360 mm (18″×14″) with rotary stage; 610 mm × 510 mm (24″×20″) without rotary stage
Max. Sample Size / Weight680 mm × 635 mm (27″×25″) / 10 kg (22 lbs)
Tilt & RotationContinuously adjustable tilt up to 70°, rotation: 0° ~ 360°
ControlJoystick or mouse (manual mode), CNC automatic mode
Motion AssistanceSupports n-to-move & n-zoom-to during inspection; actuator ensures sample centering
Positioning AidLaser crosshair alignment
Anti-collision SystemLaser automatic anti-collision system (can be deactivated to reach maximum magnification)
Machine Dimension (D×W×H)2,160 mm × 1,958 mm × 1,590 mm (85″ × 77″ × 62.6″) excluding control platform
2,772 mm × 1,958 mm × 1,770 mm (109″ × 77″ × 69.7″) including control platform
Minimum Transport Width1,770 mm (69.7″) (including control platform)
Maximum Total WeightApprox. 3,250 kg / 7,165 lbs
Radiation SafetyCompliant with German RoV and US CFR Title 21 Part J. The fully shielded radiation cabinet is exempt from type certification; additional official permits may be necessary for operation.
Radiation Dose ControlCombined with the dose measurement tool Dosemanger, Shadowtarget supports real-time dose monitoring and cuts radiation exposure by up to 60% to prevent damage to sensitive samples. Dosemanger is available as a separate software option for Shadowtarget.
Image Processing SoftwarePhoenix-xact: CAD import-enabled X-ray inspection software featuring image enhancement, measurement functions, and streamlined CAD-based automatic alignment & inspection routines.
BGA Module (Standard): Intuitive automatic BGA solder joint analysis, including automated wetting evaluation.
VC Module (Standard): Intuitive automated void calculation module for multi-die assembly inspection.
Optional Softwarexact BGA Inspection Module: CAD-based automatic BGA solder joint analysis
xact PTH Inspection Module: CAD-based automatic PTH solder joint analysis
QP Module: Automatic QFP solder joint inspection
QM Module: Automatic QFN/MLF solder joint inspection
PT Module: Automatic PTH solder joint inspection
C4 Module: Circular solder bump analysis under background structures, e.g. C4 bumps
M Module: Multi-layer PCB inspection
Quality Review: Visualization module for rework and defect display
Flash™: Proprietary image optimization technology from GE
PlanarCT Module: Non-destructive planar 2D slicing & 3D data analysis with 3D Viewer software
Optional HardwareTilt/Rotation Unit: ±45° tilt and continuous 360° rotation, max. sample load 2 kg; Manual Barcode Scanner: For product identification
Optional CT FunctionData Acquisition / Reconstruction Software: Phoenix datasx
Upgrade module supporting combined 2D and 3D (CT) operation
CT Control Unit: High-precision rotary axis
Maximum Geometric Magnification: 100× (CT)
Maximum achievable voxel resolution: down to 0.2 μm, subject to actual sample dimensions
Nanomex supports nanoCT® function for enhanced image sharpness

 

  • Phoenix Micromex|x neo 160 Microfocus X-Ray Inspection System is equipped with a new flat-panel detector featuring excellent pixel resolution (85 / 100 μm), making it ideal for the inspection of semiconductors and micro electronic components.
  • Optional 160 kV, 20 W microfocus / 20 W nanofocus X-ray tube delivers detail resolution down to 0.5 μm / 0.2 μm.
  • User-friendly operation with automatic inspection report generation.
  • The x|act software package enables micron-level automated inspection via CAD file import.
  • With diamond window: data acquisition speed doubled while maintaining consistent image quality.
  • CT scans can be completed in as fast as 10 seconds.
  • ShadowTarget avoids radiation damage to sensitive samples by reducing unnecessary radiation dosage.
  • The optical sample overview enables visualization of large-size samples and fast defect positioning.
  • High-resolution flat-panel detector, optimized for micro-component inspection.
  • Microfocus/nanofocus tube delivering ultra-high detail resolution.
  • CAD-linked automatic inspection for higher efficiency.
  • Optional diamond window to accelerate data acquisition.
  • High-speed CT scanning & ShadowTarget sample radiation protection.
  • Optical navigation view for fast defect location & automatic report output.

Presenting the details of Phoenix Micromex|x neo 160 Microfocus X-Ray Tester

Phoenix Micromex|x neo 160 Microfocus X-Ray Tester
Phoenix Micromex|x neo 160 Microfocus X-Ray Tester

Phoenix Micromex|x neo 160 Microfocus X-Ray Inspection System adopts a 160 kV open microfocus X-ray tube with optional diamond window, PlanarCT and 3D CT. Phoenix x|act software enables CAD import and automatic solder joint inspection for non-destructive testing of PCBA, semiconductors, power devices and new energy components.

Why choose this product?

  • Equipped with microfocus X-ray source for high-resolution internal imaging, accurately detecting hidden defects such as BGA, QFN, voids in solder joints and internal traces.
  • Phoenix Micromex|x neo 160 Microfocus X-Ray Machine features compact layout, supporting non-destructive offline inspection for PCBs, semiconductors and packaged components to meet diverse quality inspection demands in electronics manufacturing.
  • Excellent magnification and image contrast with automatic image analysis function, efficiently identifying tiny voids, cracks and delamination to reduce missing inspection rate.
  • Professional supporting X-Ray analysis software can automatically calculate void ratio. Data can be archived for traceability to facilitate production quality control.
  • Stable operation and easy maintenance, widely adopted in high-precision manufacturing industries including automotive electronics, consumer electronics and semiconductor packaging.

 

How It Works

  • Microfocus X-ray tube emits X-rays to penetrate the workpiece.
  • Material absorption differences create varied transmitted signals.
  • Detector collects signals and outputs digital 2D images.
  • x|act software analyzes images to detect internal defects.
  • Shadow|target technology optimizes radiation dose output.

Application Process

  1. Load the test sample and complete positioning via the optical navigation view.
  2. Import the corresponding CAD file in x|act software to create an inspection program.
  3. Configure inspection parameters and exposure settings, select 2D inspection or CT scanning mode.
  4. Start inspection; the system automatically captures X-ray images. Continuous tomography will be performed under CT mode.
  5. The software automatically compares images with CAD models to identify internal defects such as voids, delamination and cracks.
  6. Review inspection results and mark the location and dimension data of defects.
  7. Automatically generate standardized inspection reports and export data for archiving.
  8. Unload the sample and finish the inspection cycle.
Phoenix Micromex|x neo 160 Microfocus X-Ray Tester
Phoenix Micromex|x neo 160 Microfocus X-Ray Tester

Requirements

 

  • The Phoenix Micromex|x neo 160 Industrial X-Ray Inspection System shall be placed on flat, load-bearing and anti-static floor.
  • Ambient temperature shall be kept at 18–26℃ to avoid drastic fluctuations.
  • Relative humidity maintained at 40%–70% without condensation.
  • Keep away from vibration sources, dust, corrosive gas and strong electromagnetic fields.
  • Connect to stable single-phase industrial power supply with reliable grounding.
  • Reserve adequate space in the operation area for sample handling and maintenance of Phoenix Micromex|x neo 160 Industrial X-Ray Inspection System.
  • Operators must complete specialized training on radiation safety and operation of Phoenix Micromex|x neo 160 Industrial X-Ray Inspection System.
  • Comply with local radiation protection regulations and conduct regular radiation leakage inspection.

 

What It Is Used For

  • PCBA solder joint inspection (void & wetting analysis).
  • Detection of delamination, cracks and voids in semiconductor packaging.
  • Non-destructive testing for power devices and IGBTs.
  • Failure analysis of electronic parts to locate internal failure causes.
  • Phoenix Micromex|x neo 160 Industrial X-Ray Inspection Equipment observes the internal structure of R&D samples and supports process verification for new products..
  • Mass production quality control to continuously monitor the consistency of internal product processes.

 

Phoenix Micromex|x neo / Nanome|x neo Premium Micro/Nano Focus X-Ray & CT Inspection Solution

 

Phoenix Micromex|x neo / Nanome|x neo integrates 2D X-ray and 3D CT technology with excellent positioning accuracy for research, defect analysis and quality control.Equipped with Phoenix x|act software for CAD-based micron-level auto inspection. The actively cooled high-dynamic DXR detector reaches 30fps, delivering crisp images and fast CT scanning.Adopts Shadow|target intelligent dose control, cutting radiation dose by up to 60% and slowing component ageing.

 

Core Customer Benefits of Phoenix Micromex|x / Nanome|x neo

 

  • Baker Hughes high-dynamic-response DXR digital detector enables clear real-time inspection imaging.
  • High-power 180 kV / 20W micro & nano focus X-ray tube, capable of penetrating high-absorption electronic products.
  • Efficient automatic CAD inspection program minimizes system setup time.
  • Enables real-time matching between CAD and inspection results, even under rotated and tilted viewing angles.
  • Delivers excellent defect coverage and repeatability.
  • Ultimate detail resolution: 0.5 μm for microfocus tube, 0.2 μm for nanofocus tube.
  • Optional Flash!™ image optimization technology.
  • 27-inch display facilitates easier defect identification.
Phoenix Micromex|x neo 160 Microfocus X-Ray Tester
Phoenix Micromex|x neo 160 Microfocus X-Ray Tester

Conclusion

Phoenix Micromex|x neo 160 Microfocus X-Ray Inspection System targets non-destructive testing in electronics. Phoenix Micromex|x neo 160 features high-resolution flat-panel detector, optional nanofocus tube and diamond window for sharp imaging and faster acquisition.

Supported by x|act software for CAD-based automatic inspection, together with high-speed CT and ShadowTarget sample protection. Phoenix Micromex|x neo 160 detects internal defects on PCBA, semiconductors and new energy parts, acting as premium microfocus X-Ray equipment for electronic quality control.

 

For inquiries, please contact us at +8613537875415 or Lizzy@smtlinemachine.com. Visit us at Xintian Industrial Area, Baoan, Shenzhen City, China.

FAQ

 

Do you provide after-sales service?

  • Our professional after-sales service team will quickly resolve any emergencies you may encounter during use.

Warranty period?

  • -The entire machine is covered by a one-year warranty, with free technical support provided after that year.

Do you provide installation and commissioning?

  • On-site installation and commissioning will incur additional fees, including accommodation and airfare.

Shipping method?

  • Typically, shipping is by sea or land. Air freight is more expensive for urgent needs.

 

Packaging and Delivery Information:

 

Delivery: Standard equipment is in stock, while less commonly used models require 10-15 days depending on the situation..

Minimum Order: We accept orders for a single machine or mixed orders to suit your needs.

Transportation: Products are shipped either in bulk or via containers, depending on the order size and destination.

Payment Terms: Flexible payment options are available, including L/C, D/A, D/P, T/T, Western Union, and MoneyGram.

Price: Prices are negotiable to ensure you receive the best possible value.

Packaging: We offer both standard export boxes and robust hardwood packages to ensure your order arrives safely and securely.

 

If you have any other questions, please contact us to obtain more information

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