PARMI SIGMA X 3D AOI Automatic Optical Inspection System
PARMI SIGMA X 3D AOI Automatic Optical Inspection System applies 3D vision to detect PCBA solder and component defects. It delivers high-speed in-line inspection with reduced false alarms to secure assembly quality of SMT lines.
- Inspect assembly defects including missing, offset, reversed and wrong components on SMT PCBA.
- Identify solder abnormalities such as cold joints, insufficient solder, excess solder, short circuits and tombstoning.
- Conduct in-line inspection on SMT lines to screen PCB assembly defects after reflow in real time.
- Collect defect data and generate inspection reports to support production process optimization.
- Meet assembly quality inspection requirements for consumer electronics, automotive electronics and industrial control boards.
- PARMI SIGMA X 3D AOI Automatic Optical Inspection System Specifications
- Key Features
- Advantages
| Model | SIGMA X Standarc | SIGMA X Large | SIGMA X Dual | SIGMA X XLarge | ||
| SIGMAXBlue | SIGMA X Orange | SIGMAXBlue | SIGMA X Orange | |||
| RSCVll 3D Sensor Camera | ||||||
| Measuring Principle | Shadow Free Dual Laser Optical Triangulation | |||||
| Camera System | High Frame Rate C-MOS Sensor (4 Mega Pixels) | |||||
| Scan Speed (sq.cm/sec) | 60 | 100 | 60 | 100 | 100 | 100 |
| X-Y Resolution (μm) | 10×10 | |||||
| Lateral Length (mm) | 32 | |||||
| Height Resolution (μm) | 0.1 | |||||
| Paste Type Supported | All (Pb or Pb Free) | |||||
| Board Type Supported | All Colors and All Pads | |||||
| X-Y-ZRobot | Sensor Head Move in X-Y-Z Axis | |||||
| Performance | ||||||
| Height Repeatability | 3 Sigma < 1μm, on a certification target | |||||
| Area Repeatability | 3 Sigma < 1%, on a certification target | |||||
| Volume Repeatability | 3 Sigma < 1%, on a certification target | |||||
| Height Accuracy | 2μm, on a certification target | |||||
| Gage R&R | <<10% | |||||
| Measurement | ||||||
| Inspection Type | Height, Area, Volume, Offset, Bridge, Shape, Warpage, PCB shrink | |||||
| PCB Warpage | ±5 mm (2%) | |||||
| Min.Paste Size (μm) | 100×100 | |||||
| Max. Paste Size (mm) | 20×20 | |||||
| Min.Paste Pitch (μm) | 80 | |||||
| Max. Paste Height (μm) | 1,000 | |||||
| Board Dimension | ||||||
| Minimum Size (mm) | 50×50 | |||||
| Maximum Size (mm) | 480×350 3 Stage Conveyor Option: 480×350 | 580×510 | 430×320 3 Stage Conveyor Option: 430×320 | 810×610 | ||
| Board Thickness (mm) | 0.4~5.0 | 0.4~5.0 | 0.4~5.0 | 0.4~10.0 | ||
| Maximum Board Weight (kg) | 2 | 5 | 2 | 10 | ||
| TOP/Bottom Edge Clearance (mm/mm) | 2.5/3.0 | 2.5/3.0 | 2.5/3.0 | 2.5/4.0 | ||
| Underside Clearance | 30 | 30 | 30 | 50 | ||
| System Dimensions | ||||||
| Dimensions (W×D×H) | 850×1,205×1,510 3 Stage Conveyor Option:1,450×1,205×1,510 | 950×1,365×1,510 | 850×1,580×1,510 3 Stage Conveyor Option: 1,450×1,580×1,510 | 1,310×1,540×1,525 | ||
| Weight (kg) | 670 | 730 | 760 | 800 | 760 | 930 |
| Conveyor Height (mm) | 860-970 | |||||
| Conveyor Speed Range (mm/sec) | 300~1,000 | |||||
| Flow Direction | Left→Right or Right→Left (Factory Setting) | |||||
| Conveyor Width Adjusting | Auto Adjustable | |||||
| Computer & Console | ||||||
| CPU | I5 4570, RAM 16GB | I5 4570, RAM 16 GB | I5 4570, RAM 16 GB | I5 4570, RAM 32 GB | ||
| Operating System | MS-Window 7 64bit | |||||
| Display | 24″ LED | |||||
| Enclosure | Conforms to CE Regulations | |||||
| Supplies | AC 220V, 5Kgf/sq.cm | |||||
| Software System | ||||||
| Inspection Program | SPlworksPro | |||||
| Offline Teaching | EPM-SPI | |||||
| SPC & Process Monitoring | SPCworksPro | |||||
| Remote Machine Control | RMCworks | |||||
| Defect Analyzer | AnalyzerPro | |||||
| System Diagnosis | SPlmanager | |||||
| Options | ||||||
| Ultra Sonic Sensor | PCB Detect by Ultrasonic Sensor | |||||
| Fixed Barcode System | Top/Bottom Side Recognition (Input, Output Conveyor 150mm Extension)/1D or 1D+2D | |||||
| Sensor Embeded Barcode System | Topside Recognition (1D+2D) | |||||
| Back Up Plate | Back Up Plate /Back Up Pin (Bottom Clearance 25mm) | |||||
| UPS | PC Power Save (7~8 min) | |||||
| HDD RAID System | HDD Mirroring System | |||||
*Specifications in this catalog are subjected to change without notice for quality improvement.
- PARMI SIGMA X 3D Automatic Optical Inspection System adopts high-speed 3D projection imaging technology to simultaneously acquire 3D data of components and solder joints.
- Accurately detect 3D defects such as cold solder joints and tombstoning hard to be identified by 2D AOI.
- Supports inspection of high-precision devices including 01005 micro components, QFN and BGA.
- High-speed in-line inspection, perfectly matching tact time of post-reflow SMT production lines.
- Optimized intelligent algorithm reduces false alarm rate with complete quality traceability data output.
- High-speed 3D imaging to acquire 3D information of components and solder joints simultaneously.
- Effectively identify various 3D soldering defects and make up for limitations of 2D inspection.
- Optimized intelligent algorithm greatly reduces false alarm and missed detection rate.
- PARMI SIGMA X 3D Automatic Optical Inspection System is compatible with high-precision components such as 01005 micro components, BGA and QFN.
- High-speed in-line operation matches SMT line tact time and facilitates quality traceability.
Why choose this product?
Choose PARMI SIGMA X 3D AOI Inspector featuring high-speed 3D projection imaging technology. PARMI SIGMA X In-line 3D AOI Equipment can simultaneously collect 3D data of components and solder joints, effectively detecting 3D defects undetectable by 2D inspection. PARMI SIGMA X 3D AOI supports high-precision components including 01005 micro components, BGA and QFN, and reduces false alarms via intelligent algorithms. With stable in-line inspection performance, PARMI SIGMA X In-line 3D AOI Equipment optimizes SMT processes, strictly controls PCB soldering quality and lowers the risk of defective outflow.
Printer Doctor
PARMl’s Exclusive Printer Doctor takes prompt action to judge the mostprobable reason of defects by itemizing all of the potential defect elements inthe printing process.
- Patent pending advanced technology.
- Constantly analyzes solder paste deposit data in real time.
- Identifies symptoms individually and by trend in real time to determine if the process is at fault.
- Offers user defined corrective actions for operators.
- Defect description instructs the operator what to look for and where the issue(s) are.
- Intuitive user-friendly interface.
- Manager editable descriptions allow for additional instructions for the operator.
How It Works
- The optical module projects grating to collect 3D contour signals of components and solder joints.
- PARMI SIGMA X SMT Automatic Optical Inspection Equipment synchronously generates PCB 3D images and extracts accurate 3D measurement data.
- The system compares measured data with standard templates for calculation.
- Intelligent algorithms judge various 3D defects such as missing parts, cold solder joints and height abnormalities.
- Output inspection results and store defect images and measurement data.
Application Process
- PCB is fed into PARMI SIGMA X 3D AOI and positioned automatically by conveyor.
- The 3D projection optical module captures 3D contour information of PCB.
- The system generates 3D images and extracts measurement data of components and solder joints.
- Intelligent algorithms compare with standard templates to identify various soldering and component defects.
- Defect information is recorded; qualified PCBs pass through, defective boards are conveyed to rework area.
Requirements
- Installed in constant-temperature, dust-free and anti-static SMT workshop.
- Supply stable power and keep voltage fluctuation within the allowable range of PARMI SIGMA X SMT Automatic Optical Inspection Equipment.
- Flat floor with shock absorption measures for installation area.
- Avoid direct strong light to prevent interference with 3D optical imaging.
- The surface of PCBs to be inspected shall be clean without oil stains or sundries.
- The specifications of the front docking conveyor shall match the transport tact time of PARMI SIGMA X SMT Automatic Optical Inspection Equipment.
What It Is Used For
Phoenix X|aminer Microfocus X-Ray Inspection Machine is non-destructive testing equipment. It is mainly applied to penetration inspection of PCBA and electronic packaged components, detecting hidden internal defects including voids, cracks, delamination and cold solder joints of BGA and QFN. It supports 2D inspection and optional 3D CT scanning to ensure the quality of finished automotive electronics and power electronics products.
Conclusion
PARMI SIGMA X 3D AOI Inspector adopts high-speed 3D projection imaging technology and is a high-performance 3D AOI equipment. PARMI SIGMA X In-line 3D AOI Equipment simultaneously collects 3D data of components and solder joints, accurately identifies 3D soldering defects and makes up for the shortcomings of 2D inspection. PARMI SIGMA X In-line 3D AOI Equipment supports inspection of 01005 micro components, BGA and QFN. It reduces false alarms with intelligent algorithms and improves quality control of SMT production lines through high-speed in-line inspection.
Do you provide after-sales service?
- Our professional after-sales service team will quickly resolve any emergencies you may encounter during use.
Warranty period?
- -The entire machine is covered by a one-year warranty, with free technical support provided after that year.
Do you provide installation and commissioning?
- On-site installation and commissioning will incur additional fees, including accommodation and airfare.
Shipping method?
- Typically, shipping is by sea or land. Air freight is more expensive for urgent needs.
Packaging and Delivery Information:
Delivery: Standard equipment is in stock, while less commonly used models require 10-15 days depending on the situation..
Minimum Order: We accept orders for a single machine or mixed orders to suit your needs.
Transportation: Products are shipped either in bulk or via containers, depending on the order size and destination.
Payment Terms: Flexible payment options are available, including L/C, D/A, D/P, T/T, Western Union, and MoneyGram.
Price: Prices are negotiable to ensure you receive the best possible value.
Packaging: We offer both standard export boxes and robust hardwood packages to ensure your order arrives safely and securely.