XD-250 Series Small Wave Soldering System
XD-250 Series Small Wave Soldering System features compact space-saving design, stable temperature control and low tin consumption, ideal for small-batch production and prototype testing.
- Wave soldering processing for DIP through‑hole PCBs.
- Automatic soldering of through‑hole components.
- Meet small‑and‑medium‑batch production of through‑hole boards.
- Sample soldering for lab and mini production lines.
- Complete DIP soldering for post‑SMT processes.
- XD-250 Series Small Wave Soldering System Specifications
- Key Features
- Advantages
| Parameter | Details | |
| Model | XD-250M | XD-250ML |
| Rack size | L1450×W1050×H1400mm | L1800×W1050×H1400mm |
| Dimensions | L2250*W1100*H1600±20MM | L2600*W1100*H1600+20MM |
| Adjustable width of PCB board | Max.50-250mm | Max.50-250mm |
| PCB board transportation height | 750±20mm | 750±20mm |
| PCB board transportation speed | 0-1800mm/min | 0-1800mm/min |
| PCB board welding angle | 3-7º | 3-7º |
| PCB board transportation direction | L→R/R→L(optional) | L→R/R→L(optional) |
| Height on PCB | Max.100mm | Max.100mm |
| Peak height range | 0-12mm Adjustable | 0-12mm Adjustable |
| Number of peaks | 2 | 2 |
| Preheating zone length | 700mm | 950mm |
| Number of preheating zones | 2 | 2 |
| Preheating zone power | 6kw | 7kw |
| Preheating zone temperature | Room temperature 250℃，which can be set | Room temperature 250℃,which can be set |
| heating method | Hot air /infrared(optional) | Hot air/ infrared(optional) |
| Applicable solder type | lead-free solder/ ordinary solder | lead-free solder/ ordinary solder |
| Tin furnace power | 5kw | 6kw |
| Dissolved tin in tin fumace | Approx.130KG | Approx.180KG |
| Stove temperature | Indoor temperature-300℃ | Indoor temperature-300°C |
| temperature control method | P.I.D+SSR | P.I.D+SSR |
| Machine control method | Independent PLC+ touch screen | Independent PLC+ touch screen |
| Flux capacity | Max5.2L | Max5.2L |
| Flux flow | 10~100ml/min | 10~100ml/min |
| spray method | Stepper motor | Stepper motor |
| power supply | 3sohase and 5-line mechanism 380V | 3sohase and 5-line mechanism 380V |
| total power | Max. 12kw | Max. 14kw |
| normal operating power | Approx.2kw | Approx.3kw |
| Gas source | 4~7KG/CM2 | 4~7KG/CM2 |
| weight | Approx.400kg | Approx.500kg |
- Two-stage independent preheating zone, full hot air preheating, so that the PCB can get a good soldering effect.
- Stable and wear-resistant transportation system, patented alloy chain claws, not easy to deform, long service life.
- Curved observation window, elegant appearance, convenient operation and maintenance.
- The tin furnace can be lifted up and down, and the tin fumace can be adjusted in and out.
- Patented tin fumace nozzle design; ultra-low oxidation of tin slag; wave peak can be adjusted with the width of PCB board, which greatly reduces the oxidation of tin when soldering small PCB boards.
- The spray is driven by a stable and durable stepper motor.
- XD‑250 Series Small Wave Soldering System features compact body and small footprint.
- Accurate temperature control, stable soldering performance.
- Simple and user‑friendly operation.
- XD‑250 Series Small Wave Soldering System is suitable for small‑medium‑batch and sample production.
- Low energy consumption, low maintenance cost.
- Well‑matched with DIP through‑hole process requirements.
Why choose this product?
Choose XD‑250 Benchtop Wave Soldering Equipment for its compact footprint which greatly saves workshop space. XD‑250 Benchtop Wave Soldering Equipment provides stable temperature control and reliable soldering quality, perfect for R&D sampling and small‑to‑medium‑batch DIP production. XD‑250 Benchtop Wave Soldering Equipment features simple operation, convenient maintenance and low investment cost. XD‑250 Series Small Wave Soldering System is compatible with simple DIP production lines, serving as an ideal Small Wave Soldering System for sampling and small‑batch manufacturing.
How It Works
- Spray flux evenly on PCBA surface to activate pads.
- Preheat circuit board to reduce soldering thermal shock.
- Solder pot heats solder into liquid state.
- Impeller stirs liquid solder to form stable solder wave.
- PCBA passes over solder wave at constant speed to complete through‑hole pin soldering.
- Solder joints cool and solidify after soldering for reliable connection.
Application Process
- Load unsoldered PCBA on the conveyor track and feed into XD‑250 Benchtop Wave Soldering Equipment.
- Spray flux evenly to clean PCB pads.
- Preheat circuit board to reduce thermal shock and meet soldering requirements.
- PCBA passes over solder wave at constant speed to finish THT pin soldering.
- Solder joints cool down and solidify to form firm joints.
- Finished PCBA exits XD‑250 Benchtop Wave Soldering Equipment, take out the workpiece.
Requirements
- Connect XD‑250 small‑scale PCB wave‑soldering rated power supply; voltage must conform to XD‑250 small wave soldering specifications.
- Place on well‑ventilated bench, keep away from vibration, dust and corrosive gas.
- External exhaust device is recommended to vent soldering fumes timely.
- Dimensions and weight of unsoldered PCBA must comply with allowable limits for XD‑250 small‑scale PCB wave soldering.
- Keep the XD‑250 small‑scale PCB wave‑soldering machine placed horizontally to ensure stable solder wave.
- Refill solder and flux regularly, clean solder pot and transmission parts.
What It Is Used For
- Perform wave soldering for THT through‑hole components on DIP‑inserted PCBA.
- Suitable for R&D sampling and process verification test.
- Realize automatic soldering for small‑scale PCBs to satisfy small‑batch production.
- Used for soldering‑parameter debugging and test evaluation.
- Compatible with simple DIP lines to complete basic insertion soldering process.
Conclusion
XD‑250 Series Laboratory Wave Soldering System is a compact wave‑soldering machine. XD‑250 Series Laboratory Wave Soldering System features small footprint to save workshop space, ideal for medium‑and‑small‑batch DIP insertion soldering. XD‑250 Series Laboratory Wave Soldering System delivers stable temperature control with consistent and reliable soldering performance, simple operation and easy maintenance. Suitable for R&D sampling and small‑batch mass production, XD‑250 Series Laboratory Wave Soldering System can connect to simple DIP lines, making it a cost‑effective Small Wave Soldering System.
- Single-wave is recommended for simple single-layer PCBs with sparse components to lower investment. Dual-wave is preferred for boards with high-density through-hole parts, abundant connectors and mixed assembly, which reduces the rate of missing solder and bridging defects.
Do you provide after-sales service?
- Our professional after-sales service team will quickly resolve any emergencies you may encounter during use.
Warranty period?
- -The entire machine is covered by a one-year warranty, with free technical support provided after that year.
Do you provide installation and commissioning?
- On-site installation and commissioning will incur additional fees, including accommodation and airfare.
Shipping method?
- Typically, shipping is by sea or land. Air freight is more expensive for urgent needs.
Packaging and Delivery Information:
Delivery: Standard equipment is in stock, while less commonly used models require 10-15 days depending on the situation..
Minimum Order: We accept orders for a single machine or mixed orders to suit your needs.
Transportation: Products are shipped either in bulk or via containers, depending on the order size and destination.
Payment Terms: Flexible payment options are available, including L/C, D/A, D/P, T/T, Western Union, and MoneyGram.
Price: Prices are negotiable to ensure you receive the best possible value.
Packaging: We offer both standard export boxes and robust hardwood packages to ensure your order arrives safely and securely.