Best reflow oven Supplier in China
Reflow soldering is an automated precision joining process essential in electronics manufacturing, specifically designed for permanently bonding surface-mount components to PCBs. This technique employs metallurgically engineered solder paste (e.g., SAC305 Type 4) that undergoes phase transformation during a multi-stage thermal profile, achieving reliable electrical interconnections.
Some advantages of MSD-B7710-LF Computer hot air reflow oven
- Easy to program
- Reduce cleaning needs
- Versatility
- High degree of automation
- Strong adaptability
- Specification
- Model and brand of key accessories
| Section | Description |
|---|---|
| PLC and Temperature Control Module | Hesen PLC |
| Computer Control Host, Monitor | Lenovo |
| Number of Heating Zones | 7 small circulation heating zones on top, 7 small circulation heating zones on bottom. |
| Length of Heating Zones | 2760MM |
| Number of Cooling Zones | 1 built-in cooling zone + 1 external air cooling |
| Length of Cooling Zones | 400MM + 350MM = 850MM |
| Conveyor Belt Width | 450 mm |
| Guide Rail Width Adjustment Range | 50～350 mm |
| PCB Dimensions | 50-350 mm |
| PCB Height Limit | 25mm |
| Conveying Direction | L-R (R—L), direction can be chosen before manufacturing |
| Conveying Method | Belt + Guide Rail |
| Conveyor Belt Height | 900±20 mm |
| PCB Transport Speed | 0～1.8m/min |
| Temperature Control Accuracy | ±1-2℃ (static) |
| Temperature Control Range | Room temperature to 300℃ adjustable |
| Applicable Solder Types | Lead-free solder/Tin-lead solder |
| Temperature Control Method | PID+SSR |
| Types of Components Used | CSP, BGA, μBGA, 0201 chip, etc., for single/double-sided panels |
| Abnormal Alarm | Temperature (over-temperature alarm after stabilization) |
| Power Failure Protection | UPS effectively prevents PCB board damage during sudden power outages |
| Power Supply | 3Φ, 380V, 50HZ |
| Startup Power | 35KW |
| Operating Power | 7KW |
| Heating Time | Approx. 20min |
| Machine Dimensions | L44009501450 mm |
| Net Weight | 1100kg |
| Component | Description |
|---|---|
| PLC and Temperature Control Module | Hoson PLC |
| Computer Control Host | Professional brand machine: CPU: Intel G530 dual core, Motherboard: Gigabyte H61M |
| Memory | Kingston 2GB |
| Hard Drive | SSD Solid State 60GB |
| Monitor | Lenovo 18.5-inch LCD |
| Conveyance Motor | Taiwan Leohard |
| Gearbox | Taiwan Leohard 90W 1:100K |
| UPS Power Supply | ATA |
| Hot Air Motor | Sanyo 90W |
| Chain | 35B Carbon Steel Chain |
| Cylinder | AKS |
| Solenoid Valve | AKS |
| Regulating Valve, Fittings | AKS |
| Intermediate Relay | Chint |
| Frequency Converter | Taiwan Delta |
| Heating Wire | Taiwan Taizhan, imported nickel-chromium wire |
| Photoelectric Switch | Omron |
| Solid State Relay | Berme 40A |
| Main Switch | Chint |
| Air Switch | Chint |
| Cooling Fan | Chint |
| Three-Color Light | Chint |
| Fuse | Chint |
| Emergency Stop Switch | Chint |
| Buzzer | Chint |
| AC Contactor | Chint |
| Thermocouple | Insulated K-type, Taiwan Pandate |
| Push Button Switch | Chint |
MSD-B7710-LF Computer hot air reflow oven characteristics
🔥 1. Mission-Critical Control System
- Hexin PLC + Industrial PC dual-control architecture
- ±1°C thermal stability with offline production capability during host failures
💻 2. Advanced Human-Machine Interface
- Windows 7 Embedded OS with intuitive thermal profiling
- Real-time reflow curve visualization
⚡ 3. Electro-Mechanical Safety
- Motorized lead-screw lift system for safe furnace access
- IP54-rated electrical enclosures
🤖 4. SMT Line Integration Ready
- SMEMA-compatible synchronous rail transmission
- Zero-sag mesh belt with automatic tensioning
- 0.15mm PCB positioning accuracy
⛽ 5. Intelligent Lubrication Management
- PLC-controlled oil metering (±0.5ml precision)
- Usage-based maintenance alerts
🌡️ 6. Multi-Zone Thermal Control
- Independent PID loops for all reflow zones
- Top/bottom asymmetric heating capability
🔄 7. High-Mix Production Flexibility
- Closed-loop conveyor control
- Simultaneous processing of mixed PCB profiles
🚨 8. Multi-Layer Protection
- Leakage current protection (<30mA trip)
- Audible/visual fault alarms (21 error codes)
🔋 9. Critical Failure Safeguards
- Industrial UPS with 90-min thermal runway protection
- Auto-save reflow profiles during outages
⚙️ 10. Advanced Thermal Engineering
- Cell-based convective heating technology
- CFD-optimized ducts boost heat transfer by 40%
- <3-min recovery time after door opening
📊 11. Real-Time Thermal Balancing
- Per-zone thermocouples with auto-compensation
- ±0.8°C zone uniformity
🔒 12. Enterprise-Grade Security
- Password-protected reflow profiles
- Audit trail logging for parameter changes
❄️ 13. Rapid Quenching Technology
- Forced-air cooling at 4-6°C/sec descent rate
Technical Validation & Compliance
| Standard | Requirement | MSD-B7710-LF Performance |
|---|---|---|
| IPC-7531 | Thermal profile stability | ±1°C (Class 3) |
| UL 61010-1 | Electrical safety | Certified |
| ISO 13849-1 | Safety control systems | PLd Category 3 |
| IPC-A-610 | Solder joint quality | Class 3 compliant |
The difference between reflow soldering and wave soldering
Soldering quality:
Reflow soldering:
Because the soldering process takes place in a controlled environment, soldering quality is usually high and the solder joints are uniform and consistent.
Wave soldering:
Soldering quality may be affected by wave stability and solder contamination, which may lead to poor soldering.
Cost:
Reflow soldering:
Equipment costs are usually higher, but long-term operating costs may be lower due to the closed soldering process and less solder waste.
Wave soldering:
The equipment cost is relatively low, but the waste of solder may be more, and the long-term operating cost may be higher.
Cleaning and maintenance:
Reflow soldering:
The soldering process produces less flux residue and is relatively easy to clean and maintain.
Wave soldering:
The soldering process may produce more flux residue, cleaning and maintenance work may be more complicated.
Flexibility:
Reflow soldering:
Can adapt to a variety of soldering materials and processes, high flexibility.
Wave soldering:
Usually suitable for specific solder and soldering process, less flexibility.
FAQ
Question:
How to maintain and calibrate reflow equipment?
Answer:
Regular cleaning, inspection and calibration of temperature sensors and transfer systems in reflow furnaces is a necessary maintenance work.
Question:
What types of PCBS does reflow apply to?
Answer:
Reflow soldering is suitable for single and dual panels, as well as high density complex circuit boards.
Question:
How often does reflow oven need maintenance?
Answer:
The maintenance cycle of reflow oven usually depends on the frequency of use and the manufacturer’s recommendation, and it is generally recommended to carry out a full maintenance every six months or a year.
