MIRTEC MV-9 3D Automatic Optical Inspection Equipment
MV-9 Series 3D AOI Inspector is applied to in-line inspection after PCB SMT placement. Adopting 3D imaging technology, it detects various mounting and solder joint defects, precisely measures 3D parameters of solder joints, finds hidden defects unavailable to 2D AOI and realizes efficient quality control.
- MV-9 Series 3D AOI Inspector performs 3D volumetric visual inspection on components after PCB SMT mounting.
- Detect common SMT defects: missing components, offset, tombstoning, reversed parts, wrong components, short circuit, cold solder joints etc.
- Accurately measure solder joint height, volume and coplanarity, overcome the limitation of 2D AOI on height-related defects.
- Meet inspection requirements for high-precision devices such as BGA, QFN, connectors and 01005 micro components.
- Output defective images and defect data in real time to support production quality traceability and process optimization.
- Suitable for in-line automatic inspection after SMT reflow soldering to improve production line automation.
- Screen hidden soldering defects and reduce functional failures and after-sales rework rate of finished products.
- MIRTEC MV-9 3D Automatic Optical Inspection Equipment Specifications
- Key Features
- Advantages
| Model | MV-9 | MV-9U | MV-9DL | ||
| Max PCB Size Range | |||||
| Lineer Motor System [mm] | 50×50-510×460 | 60×60-660×610 | 50×50-330×250 | ||
| OMNI-VISi0N 30/ 20 Inspection Techndlogy | |||||
| 3D Inspectian Technolagy | Dgital Muti Frequancy Quad Moire Techndogy | ||||
| 2D Inspectian Technolagy | ISIS Visian System | ||||
| Height Accuracy | ±3μm | ||||
| Maximum Component Height | 25 Mega Pixel | Option 1 [7.7μm] | 4mm | ||
| 15 Mega Pixel | Option 1 [15μm] | 5mm | |||
| Option 2 [10μm] | 4mm | ||||
| Inspection Item | 2D Inspectian | Mising Conponent Msalgnment. Perlarty Tenh stone Manhatian Brda. Trn ver Mtong Componiant, Socratch. Soler Ball | |||
| 3D Inspectian | Missing Component, Height, Position, Lifted Package Lifted Chip, Lifted Lead, Sader Fillet, Excessive Solder, Insufficlent SolderOpen Sdlder, Dloutle Chip, Manhattan, Tomb Stone, Tilt, Dimension, Foreign, Etc | ||||
| ISIS Vision System [FoV Size] | |||||
| 25 Mega Pixel Camera | CXP 5,120×5,120 Pixel | Option 1 | Pixel Resolution:7.7μm/39.42mm×39.42mm | ||
| CL 5,056×5,056 Pixel | Option 2 | Pixel Resolution:7.7μm/38.93mm×38.93mm | |||
| 15 Mega Pbxel Camera | 3,904×3,904 Pixel | Option 1 | Pixel Resolution:15μm/58.56mm×58.56mm | ||
| Option 2 | Pixel Resolution:10μm/39.04mm×39.04mm | ||||
| 2D Maximum Inspection Speed | |||||
| 25 Mega Pixel Camera | CoaXPress @ 72 fps | Option 1 | Pixel Resolution: 7.7μm /0.33 Sec/FOV /4,593mm2/Sec | ||
| Camera Link @ 23 fps | Option 1 | Pixel Resolution: 7.7μm /0.38 Sec/FOV /3,947mm2/Sec | |||
| 15 Mega Pbxel Camera | CoaXPress @120 fps | Option 1 | Pixel Resolution: 15μm /0.32 Sec/FOV /10,716mm2/Sec | ||
| Option 2 | Pixel Resolution: 10μm /0.30 Sec/FOV /5,080mm2/Sec | ||||
| Camera Link @ 37 fps | Option 1 | Pixel Resolution: 15μm /0.36 Sec/FOV /9,526mm2/Sec | |||
| Option 2 | Pixel Resolution: 10μm /0.34 Sec/FOV /4,482mm2/Sec | ||||
| 3D/2D Maximum Inspection Speed | |||||
| 25 Mega Pixel Camera | CoaXPress @72 fps | Option 1 | Pixel Resolution: 7.7μm /1.05 Sec/FOV /1,460mm2/Sec | ||
| Camera Link @ 23 fps | Option 1 | Pixel Resolution: 7.7μm /1.95 Sec/FOV /698mm2/Sec | |||
| 15 Mega Pbxel Camera | CaaXPress @120 fps | Option 1 | Pixel Resolution: 15μm /0.80 Sec/FOV /4,260mm2/Sec | ||
| Option 2 | Pixel Resolution: 10μm /0.80 Sec/FOV /1,890mm2/Sec | ||||
| Camera Link @ 37 fps | Option 1 | Pixel Resolution: 15μm /1.31 Sec/FOV /2,344mm2/Sec | |||
| Option 2 | Pixel Resolution: 10μm /1.24 Sec/FOV /1,100mm2/Sec | ||||
| System Specification | |||||
| Lens Configuratia | Precision Telecentric Compound Lens | ||||
| Lighting System | Eight Phase Color Lighting | ||||
| Side Viewer Camera System | 10 Mega Pixel Digital Cdor Side Cameras [4ea] | ||||
| PCB Top Side Clearance | 45mm | ||||
| PCB Bottom Side Clearance | 25mm [Qption:50.8amm] | ||||
| Maximum PCB Warpage | ±3μm | ||||
| Barcode System [10/20] | Keyence 10/Leuze [10-Scan]/Data Logic [10]/ Cognex [10/20]/ Micro Scan [10/20] | ||||
| Built-in SPC | Statistical Process Control Software | ||||
| Built-in Repair | Repair Software | ||||
| OLTT [Optiorl | Off-Line Teaching Toal Software | ||||
| Minimum Meesurement Size | 25 Mega Pbxel | Option 1 [7.7μm] | 0201Chip [mm]/ 0.3 Pitch [mm] | ||
| 15 Mega Pxal | Option 1 [15μm] | 0603 Chip [mm]/ 0201 Chip [inch]/ 0.4 Pitch [mm] | |||
| Option 2 [10μm] | 03015 [mm]/ 0.3 Pitch [mm] | ||||
| Robot Positioning System | X/Y Axis | Precision Linear Drive Motor System | |||
| Resdlution | 0.5μm | ||||
| Repeatability | ±2μm | ||||
| Power Requirements | MV-9 [Single Lane] | Single Phase[s]200-240V 50-60Hz,1.1 KW | |||
| MV-9DL [Oual Lane] | Single Phase[s]200-240V 50-60Hz,1.5 KW | ||||
| Air Requiraments | 5Kgf/cm2[0.5MPa] | ||||
| Dimension and Weight | |||||
| Dimenslon [mm] | 1,250[W]x 1,500[D]x 1,800[H] | 1400[W]x1,850[D] x 1,800[H] | 1,250[W]x 1,500[D]x 1,800[H] | ||
| Weight | Approx. 1,200 kg | Apprax. 1,500 Kg | Approx. 1,400 Kg | ||
* We willnot be responsble for any problams caused by using unverifed BARCODE READER Contact our HO for the listof alowed BARCODE READER models to use.
- MIRTEC MV-9 In-line 3D Automatic Optical Inspection Equipment adopts high-precision 3D imaging technology to inspect 3D profiles of solder joints and various SMT placement defects.
- Accurately detect hidden soldering defects hard to identify by 2D AOI.
- Suitable for inspection of high-precision components including BGA, QFN and micro chips.
- High-speed in-line inspection, compatible with post-reflow process in SMT line.
- Real-time data output to facilitate quality traceability and process improvement.
- 3D volumetric inspection to accurately capture 3D data such as solder joint height and volume.
- Effectively detect hidden soldering defects undetectable by 2D AOI.
- High inspection precision, compatible with BGA, QFN and micro components.
- High-speed in-line inspection without disrupting SMT line cycle time.
- Complete defect data output for easy quality traceability and process improvement.
Why choose this product?
Choose MV-9 Series 3D AOI Inspection Machine. It adopts advanced 3D imaging technology to accurately capture 3D information of solder joints and effectively detect hidden soldering defects that cannot be identified by 2D AOI. Featuring high inspection accuracy, it supports in-line inspection of precision components such as BGA, QFN and micro components. Its inspection speed matches the tact time of SMT production lines. Complete data traceability facilitates process optimization. Stable and reliable equipment performance continuously controls PCB mounting quality and reduces defect rate and rework cost.
How It Works
Application Process
- PCB is fed into the MV-9 In-line 3D AOI, and automatically transported and positioned by the conveyor track.
- he 3D optical system captures high-definition 3D images of the circuit board.
- The system compares reference data to detect component and solder joint defects.
- Defective boards are marked, defect images and test data are saved in real time.
- Qualified boards pass through normally, defective PCBs are conveyed to rework station.
Requirements
- MV-9 3D AOI SMT PCB inspector is installed in constant-temperature, dust-free and anti-static production workshop.
- Equipped with stable power supply, voltage fluctuation within allowable range.
- Flat floor with shock absorption treatment for installation area.
- Avoid direct strong light in working environment to prevent interference with 3D imaging.
- Keep incoming PCB surface clean without excess oil and debris.
- Production line docking matches standard PCB transport size and cycle time.
What It Is Used For
MV-9 3D AOI SMT PCBA Defect Detector is used for in-line inspection after PCB SMT placement on production lines. It identifies various placement defects and solder joint faults, measures 3D parameters of solder joints, detects hidden problems hard to be found by 2D inspection, and realizes quality monitoring of the production line.
Conclusion
MIRTEC MV-9 3D Automatic Optical Inspection Equipment is a high-performance 3D AOI device. With 3D imaging technology, it performs 3D inspection after PCB placement and accurately captures 3D profiles of solder joints to detect hidden defects hard to identify by 2D AOI. The MV-9 3D AOI supports in-line inspection of various precision components. It strengthens quality control of SMT production lines with reliable 3D inspection capability, gives full play to the advantages of 3D AOI volumetric inspection and continuously optimizes soldering processes.
Do you provide after-sales service?
- Our professional after-sales service team will quickly resolve any emergencies you may encounter during use.
Warranty period?
- -The entire machine is covered by a one-year warranty, with free technical support provided after that year.
Do you provide installation and commissioning?
- On-site installation and commissioning will incur additional fees, including accommodation and airfare.
Shipping method?
- Typically, shipping is by sea or land. Air freight is more expensive for urgent needs.
Packaging and Delivery Information:
Delivery: Standard equipment is in stock, while less commonly used models require 10-15 days depending on the situation..
Minimum Order: We accept orders for a single machine or mixed orders to suit your needs.
Transportation: Products are shipped either in bulk or via containers, depending on the order size and destination.
Payment Terms: Flexible payment options are available, including L/C, D/A, D/P, T/T, Western Union, and MoneyGram.
Price: Prices are negotiable to ensure you receive the best possible value.
Packaging: We offer both standard export boxes and robust hardwood packages to ensure your order arrives safely and securely.