Phoenix X|aminer Microfocus X-Ray Inspection System
Phoenix X|aminer Microfocus X-Ray Inspection System offers ultra-high resolution with automatic inspection and optional CT function, suitable for non-destructive testing, failure analysis and production quality control of microelectronic components.
- Conduct non-destructive penetration inspection for PCBs and semiconductor components without damaging samples.
- Detect hidden internal defects of BGA/QFN solder joints including voids, cold solder, offset and cracks.
- Inspect packaging defects such as delamination, lead abnormalities and foreign objects inside packaged chips.
- Support quality control for incoming materials and finished products of automotive electronics and precision components.
- Automatically calculate solder void ratio, store image data and realize production quality traceability.
- Phoenix X|aminer Microfocus X-Ray Inspection System Specifications
- Key Features
- Advantages
| Phoenix|aminer | |
| X-Ray Detector | Option 1: Waygate Technologies DXR S85 ultra-high resolution flat-panel detector, 85μm, 1,536×1,536 pixels Option 2: High contrast CMOS flat-panel detector, 75μm pixel pitch, 1,536×864 pixels |
| Geometric Magnification | Up to 2,000x |
| Total Magnification | Up to 91,000x |
| Detail Resolution | Down to 0.5μm |
| X-Ray Tube Type | Low-maintenance open microfocus tube with unlimited service life; transmission 170° conical beam with collimation function. |
| Max. Tube Voltage / Target Power | 160kV / 20W |
| Filament | Pre-adjusted filament for fast replacement; filament change within 20 minutes |
| Mechanical Structure | High-precision anti-vibration synchronously driven 5-axis stage |
| Max. Inspection Area | 410mm×410mm (16”×16”) |
| Max. Workpiece Size / Weight | 510mm×510mm (20”×20”) / 5kg (11 lbs.) |
| OVHM – Oblique View Rotation | Adjustable viewing angle up to 70°, continuous n×360° rotation |
| Control System | Joystick or mouse (Manual Mode), CNC (Automatic Mode) |
| Assistant Control Functions | X-ray image navigation, click-to-move, click-to-zoom, automatic view centering, laser alignment positioning, collision avoidance function |
| Minimum System Dimensions (W×H×D) | 1800mm×1900mm×1430mm (70.9”×74.8”×56.3”) (Excluding control console and detachable rear extension stage) |
| Height-Adjustable Control Panel | Adjustable range: 400mm (15.75”) |
| Max. Weight | Approx. 2,050 kg / 4,520 lbs |
| Radiation Safety Shielding | Lead-steel shielding enclosure with leaded glass window, complying with X-ray equipment safety standards of Germany, France, USA and other regions. Equipment operation must comply with local safety regulations. |
| Radiation Leakage Dose Rate | Radiation leakage dose rate <1.0 μSv/h, compliant with international standards |
| Image Processing Software | Phoenix X|act base: Fully-featured X-ray image analysis software with image enhancement, measurement functions and efficient CNC automatic positioning inspection routines. bga|Module (Standard): Intuitive automatic BGA solder joint analysis including automatic wetting analysis. vc|Module (Standard): Intuitive automatic void calculation function for multi-chip assembly inspection. c4|Module: Circular solder bump analysis under complex background structures, such as C4 bumps. ml|Module: Multi-layer PCB inspection. |
| Software Configuration (Optional) | x|act BGA Inspection Module: Automatic analysis of BGA solder joints based on CAD data x|act PTH Inspection Module: Automatic analysis of PTH solder joints based on CAD data qfp|Module: Automatic inspection of QFP solder joints qfn|Module: Automatic inspection of QFN/MLF solder joints pth|Module: Automatic inspection of PTH solder joints X|act review: Visualization module for rework and defect presentation Flash!™: Proprietary image optimization technology of Waygate Technologies. Flash! Electronics, tailor-made for electronics inspection applications, is also available as an option. |
| CT Function (Optional) | Data Acquisition / Reconstruction Software: Phoenix Datos|x Upgrade module integrating 2D and 3D (CT) operations CT Manipulation Unit: High-precision rotary axis Max. Geometric Magnification: 100x (CT) Max. Voxel Resolution: Down to 2μm, subject to actual part dimensions |
| Phoenix X|act Operator Version (Optional) | Advanced image processing software, including view-based automatic inspection routines |
| Basic CT Axis (Optional) | High-precision rotary unit for CT applications requiring high resolution |
| Easyfix CT Axis (Optional) | Rotary unit equipped with clamping fixture for enhanced workpiece stability during CT scanning |
| Barcode Scanning | Manual barcode reader for identification of test samples |
| Tilt / Rotation Unit (Optional) | ±45° tilt and continuous n×360° rotation, maximum workpiece weight: 2kg |
| Auxiliary Positioning Device (Optional) | Crosshair laser positioning device |
| PCB Holder for Rotary Stage (Optional) | Supports PCB boards up to 310mm×310mm |
| XY Stage (Optional) | Extends inspection area up to 510mm×510mm (20”×20”). Rotary stage cannot be used when equipped. |
- New flat-panel detector upgraded with scintillator technology delivers high-quality inspection for electronic components.
- 160kV/20W high-power X-ray tube with unlimited service life, capable of penetrating highly absorbent workpieces.
- Fully-featured CT module for simple and fast operation.
- Intuitive operation and user-friendly software.
- Flash!™ Electronics is optimized for electronics inspection. It maximizes productivity with fast and precise image processing.
- Supports real-time CAD data matching.
- Automatic real-time X-ray sample navigation enables rapid positioning on the top, bottom and internal areas of samples.
- Laser collision avoidance design protects workpieces.
- Compact footprint.
- Optional 27-inch 2K monitor.
- OPC-UA data interface exports process and equipment data for equipment status statistical analysis.
- Extensive defect detection range ensures ease of use while meeting high-quality requirements.
- Quick and convenient sample loading.
- Equipped with automatic inspection capability.
- Microfocus X-ray tube with unlimited service life.
- Detail resolution down to 0.5 μm.
- Flash! Electronics image optimization technology – ideal solution for electronic component inspection.
- 27-inch monitor enables easier observation and identification of defects.
- OPC-UA interface improves efficiency and minimizes downtime.
Why choose this product?
Phoenix X|aminer Microfocus X-Ray Inspection System is a high-performance non-destructive testing platform. This Phoenix X|aminer Microfocus X-Ray Inspection System is fitted with a 160kV microfocus X-Ray tube. Phoenix X|aminer SMT X-Ray inspection equipment integrates 2D imaging and optional 3D CT functions. Phoenix X|aminer efficiently detects various hidden internal defects of BGA and QFN. Equipped with Phoenix X|act software, the Phoenix X|aminer SMT X-Ray inspection equipment is widely applied to quality control of PCBA, automotive electronics and power electronics.
How It Works
- The 160kV microfocus X-Ray tube generates high-energy rays to penetrate PCBA and packaged components.
- The DXR flat-panel detector receives transmitted rays to form 2D images; optional 3D CT supports multi-angle scanning.
- Materials absorb X-rays differently, creating contrast to visualize internal component structures.
- Phoenix X|act software analyzes images to detect hidden defects including voids, cracks and delamination.
- Automatically archive image data, mark defects and conduct measurements for quality traceability.
Application Process
- Place PCBA or electronic components on the stage and complete position calibration.
- Load inspection programs and select 2D penetration inspection or optional 3D CT scanning mode.
- The 160kV microfocus X-ray source captures internal penetration images of components.
- Phoenix X|act software identifies internal defects such as voids, cracks, delamination and cold solder joints.
- Store images and data, and generate inspection reports for quality traceability.
- Upon completion of inspection, take out the workpiece. Phoenix X|aminer SMT X-Ray inspection equipment resets for the next sample test.
High-Quality 160 kV Microfocus X-Ray Inspection System (CT Function Optional)
- The Phoenix X|aminer X-Ray Inspection System integrates high-resolution 2D X-Ray technology and 3D CT imaging. It is specially designed to meet the special requirements of high-resolution inspection for electronic components and PCBA.
- Phoenix X|aminer is equipped with an infinitely durable 160kV/20 W microfocus X-Ray tube. Benefiting from the high-energy and high-power X-Ray tube, the system delivers effective and reliable solutions for electronic applications including power electronics.
- Phoenix X|act technology enables convenient manual and automatic inspection functions.
- The new DXR flat-panel detector from Waygate Technologies leverages advanced CsI scintillator technology and ultra-high 85μm resolution to elevate 2D image quality and real-time imaging to a new level.
Requirements
- Stable single-phase AC power is required. The workshop shall be dust-free with constant temperature and humidity to prevent vibration interference.
- Tested PCBA and components must be within the rated dimension and weight limits of Phoenix X|aminer Microfocus X-Ray Inspection Machine.
- Sufficient rotating space shall be reserved in the sample area if optional 3D CT function is enabled.
- Equipped with Phoenix X|act inspection software. Operators shall program in standard procedures to ensure precision of 2D imaging and CT inspection.
- Provide radiation protection for the area of Phoenix X|aminer Microfocus X-Ray Inspection Machine and comply with safety regulations for X-Ray equipment.
What It Is Used For
Phoenix X|aminer Microfocus X-Ray Inspection Machine is non-destructive testing equipment. It is mainly applied to penetration inspection of PCBA and electronic packaged components, detecting hidden internal defects including voids, cracks, delamination and cold solder joints of BGA and QFN. It supports 2D inspection and optional 3D CT scanning to ensure the quality of finished automotive electronics and power electronics products.
High-quality X-Ray Inspection Ensures Product Reliability
The reliability of electronic assembly mainly depends on solder joint quality. All features and dimensions of solder joints are displayed in images: diameter, thickness (grayscale value), pads and contact areas (dark and bright rings), and voids (bright spots). All defects affecting solder joint shape can be detected. Beyond visible surfaces, X-Ray images reveal hidden characteristics of internal connection areas, which are critical to solder joint reliability.
Detectable defects are listed below:
Bridging (especially solder joints beneath electronic components), open circuits, solder paste printing defects, poor coplanarity, insufficient solder filling, poor wetting, insufficient reflow, alignment deviation, cracks, missing solder joints, warpage, component cracking, tilted components, voids, diameter deviation, roundness, shape deviation, blurred edges (insufficient reflow), misalignment.
Conclusion
Phoenix X|aminer Microfocus X-Ray Inspection System is a high-performance microfocus X-Ray inspection system. Adopting clear penetration imaging, this Phoenix X|aminer Microfocus X-Ray Inspection System performs non-destructive inspection for PCBs, BGA and semiconductor packages. Phoenix X|aminer Microfocus X-Ray Inspection System accurately identifies hidden defects such as solder voids, delamination and internal cracks, and supports void ratio measurement and data traceability. Widely used in automotive electronics and precision electronics industries, the Phoenix X|aminer Microfocus X-Ray Inspection System serves as a trusted offline non-destructive testing solution for electronics manufacturing.
Do you provide after-sales service?
- Our professional after-sales service team will quickly resolve any emergencies you may encounter during use.
Warranty period?
- -The entire machine is covered by a one-year warranty, with free technical support provided after that year.
Do you provide installation and commissioning?
- On-site installation and commissioning will incur additional fees, including accommodation and airfare.
Shipping method?
- Typically, shipping is by sea or land. Air freight is more expensive for urgent needs.
Packaging and Delivery Information:
Delivery: Standard equipment is in stock, while less commonly used models require 10-15 days depending on the situation..
Minimum Order: We accept orders for a single machine or mixed orders to suit your needs.
Transportation: Products are shipped either in bulk or via containers, depending on the order size and destination.
Payment Terms: Flexible payment options are available, including L/C, D/A, D/P, T/T, Western Union, and MoneyGram.
Price: Prices are negotiable to ensure you receive the best possible value.
Packaging: We offer both standard export boxes and robust hardwood packages to ensure your order arrives safely and securely.