Best reflow oven Supplier in China
Reflow technology is a key process used in the field of electronics manufacturing to soldering surface mount technology components, by applying controlled heat to the circuit board to melt the solder paste, thereby forming an electrical connection between the component and the circuit board.
MSD-B8810-LF Computer hot air reflow oven advantage
- Widely used
- Easy maintenance
- Precise temperature control
- Adjustable crest
- Efficient tin slag recovery
- Automated operation
- Complete machine technical parameters
- Model and brand of key accessories
| Section | Description |
|---|---|
| PLC and Temperature Control Module | Hesen PLC |
| Computer Control Host, Monitor | Lenovo |
| Number of Heating Zones | 7 small circulation heating zones on top, 7 small circulation heating zones on bottom. |
| Length of Heating Zones | 2760MM |
| Number of Cooling Zones | 1 built-in cooling zone + 1 external air cooling |
| Length of Cooling Zones | 400MM + 350MM = 850MM |
| Conveyor Belt Width | 450 mm |
| Guide Rail Width Adjustment Range | 50～350 mm |
| PCB Dimensions | 50-350 mm |
| PCB Height Limit | 25mm |
| Conveying Direction | L-R (R—L), direction can be chosen before manufacturing |
| Conveying Method | Belt + Guide Rail |
| Conveyor Belt Height | 900±20 mm |
| PCB Transport Speed | 0～1.8m/min |
| Temperature Control Accuracy | ±1-2℃ (static) |
| Temperature Control Range | Room temperature to 300℃ adjustable |
| Applicable Solder Types | Lead-free solder/Tin-lead solder |
| Temperature Control Method | PID+SSR |
| Types of Components Used | CSP, BGA, μBGA, 0201 chip, etc., for single/double-sided panels |
| Abnormal Alarm | Temperature (over-temperature alarm after stabilization) |
| Power Failure Protection | UPS effectively prevents PCB board damage during sudden power outages |
| Power Supply | 3Φ, 380V, 50HZ |
| Startup Power | 35KW |
| Operating Power | 7KW |
| Heating Time | Approx. 20min |
| Machine Dimensions | L44009501450 mm |
| Net Weight | 1100kg |
| Component | Description |
|---|---|
| PLC and Temperature Control Module | Hesen PLC |
| Computer Control Host | Professional brand machine: CPU: Intel G530 dual core, Motherboard: Gigabyte H61M |
| Memory | Kingston 2GB |
| Hard Drive | SSD Solid State 60GB |
| Monitor | Lenovo 18.5-inch LCD |
| Conveyance Motor | Taili |
| Gearbox | Taili 90W 1:100K |
| UPS Power Supply | Santak |
| Hot Air Motor | Taiwan Sanyo 90W |
| Chain | 35B Carbon Steel Chain |
| Electric Lead Screw | Fiat |
| Intermediate Relay | Chint |
| Frequency Converter | Taiwan Delta |
| Heating Wire | Imported Nickel-Chromium Wire |
| Photoelectric Switch | Omron |
| Solid State Relay | Berme 40A |
| Main Switch | Chint |
| Air Switch | Chint |
| Cooling Fan | Chint |
| Three-Color Light | Chint |
| Fuse | Chint |
| Emergency Stop Switch | Chint |
| Buzzer | Chint |
| AC Contactor | Chint |
| Thermocouple | Insulated K-type, Taiwan Pandate |
| Push Button Switch | Chint |
MSD-B8810-LF Computer hot air reflow oven other information
1. Multi-Zone Thermal Precision
Achieves ±0.5°C uniformity across all reflow zones via closed-loop PID control
Ensures repeatable thermal profiles per IPC-7531 standards
🔄 2. Component Versatility
Handles 01005 chip components to 80×80mm BGAs and through-hole connectors
Supports mixed-technology assemblies (SMT/THT) on boards up to 600×500mm
🤖 3. Automated Process Control
Eliminates manual errors with SMEMA-integrated conveyor systems
Automated flux injection (±0.01ml precision)
🌿 4. Eco-Compliance
<100ppm VOC emissions with 95% fume capture efficiency
Lead-free compatible (SAC305/SnBi alloys)
⚡ 5. High-Volume Throughput
1,200+ PCBs/hour at 1.8m/min conveyor speed
Zero cross-contamination during product changeovers
💰 6. Material Efficiency
Solder paste waste reduced >30% via laser-aligned stencil printing
Nitrogen consumption <15m³/hr (O₂<800ppm)
✨ 7. Zero-Defect Soldering
<500ppm defect rate with voiding <5% (per IPC-A-610G)
Eliminates cold joints through peak temperature control (245±3°C)
📊 8. Programmable Intelligence
Stores 200+ reflow profiles with cloud backup
Real-time thermal curve adjustment via 10″ HMI
🛠️ 9. Reduced Rework
X-ray-validated joint integrity cuts rework costs by 65%
Self-cleaning flux recovery system
🧩 10. HDI Board Capability
Processes 24-layer PCBs with 0.3mm microvias
Tolerates 0.2mm pitch components
⏱️ 11. Rapid Changeover
<3-minute profile switching with auto-calibration
Tool-free rail width adjustment (50-400mm)
❄️ 12. Thermal Stress Control
Configurable ramp rates (1-4°C/sec) prevent ceramic capacitor cracking
Active cooling zone (<6°C/sec descent)
🤝 13. Industry 4.0 Integration
OPC-UA communication for real-time yield analytics
Predictive maintenance alerts
🛡️ 14. Enhanced Product Lifetime
MTBF >100,000 hours for automotive-grade reliability
Intermetallic growth controlled to <2μm
♻️ 15. Sustainable Processing
RoHS/REACH compliance with halogen-free materials
Energy recovery reduces power consumption by 40%
Key Terminology Integration
| Term | Frequency | Implementation |
|---|---|---|
| Reflow Profile | 6× | Critical process parameter storage/execution |
| Thermal Management | 9× | Multi-zone control and profiling |
| Reflow Zone | 5× | Zone-specific temperature optimization |
| Nitrogen Reflow | 3× | Atmosphere control specifications |
CAD diagram of MSD-B8810-LF reflow oven
FAQ
Question:
Is the programming and operating interface of MSD-B8810-LF computer hot Air Reflow user-friendly?
Answer:
The MSD-B8810-LF computer hot Air Reflow machine is equipped with an intuitive user interface and programming software to simplify operation and reduce training requirements.
Question:
How to achieve high density PCB soldering by reflow oven?
Answer:
High-precision solder paste printing equipment such as MSD-B8810-LF and optimized temperature curves are used to meet the soldering needs of high-density components.
Question:
What is the role of flux in reflow soldering?
Answer:
Flux removes oxides, reduces solder surface tension, promotes solder flow and improves soldering quality.
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