XD-300 Series Medium Wave Soldering System

XD-300 Series Medium Wave Soldering System boasts precise temperature control and stable welding performance. Space-saving design fits mass processing of medium & small PCBs with easy maintenance.

  • Achieve automatic continuous wave soldering for DIP through-hole PCBA.
  • Process PCBs with a maximum width of 300mm, compatible with leaded and lead-free processes.
  • Form stable through-hole solder joints and reduce defects such as cold solder and bridging.
  • Integrate the complete procedures of flux spraying, multi-zone preheating and wave soldering.
  • Suitable for small and medium batch production. The XD-300 lead-free wave soldering equipment can connect production lines to improve DIP production efficiency.
ParameterDetails
ModelXD-300MXD-300ML
DimensionsL2900×W1200×H1650MML3500×W1200×H1700MM
Rack SizeL2200×W1250×H1650MML2800×W1250×H1700MM
Pcb Board WidthMax:50-300mmMax.50-300mm
Pcb Board Transportation Height750+20mm750+20mm
Pcb Board Transportation Speed0-1800mm/min0-1800mm/min
Pcb Board Welding Angle3-7°3-7°
Pcb Board Transportation DirectionL→R/R→L(optional)L→R/R→L(optional)
Component Height Limit On PCB BoardvMax:110mmMax.110mm
Peak Height Range0-12mm Adjustable0-12mm Adjustable
Number Of Peaks22
Preheating Zone Length950mm Hot Air Infrared (optional)1500mm Hot Air Infrared (optional)
Number Of Preheating Zones23
Preheating Zone Power6kw9kw
Preheating Zone TemperatureRoom temperature 250℃,which can be setRoom temperature 250℃,which can be set
Heating MethodHot air /infrared(optional)Hot air /infrared(optional)
Number Of Cooling Zones11
Cooling MethodComputer fan coolingComputer fan cooling
Applicable Solder Typelead-free solder/ ordinary solderlead-free solder/ ordinary solder
Tin Furnace Power9kw10kw
Dissolved Tin In Tin FumaceApprox :250KGApprox .300KG
Stove TemperatureRoom temperature-300℃, control accuracy +1-2℃Room temperature-300℃, control accuracy +1-2℃
Temperature Control MethodP.I.D+SSRP.I.D+SSR
Machine Control MethodIndependent PLC+Brand/computer/touch screen buttonsIndependent PLC+Brand/computer/touch screen buttons
Flux CapacityMax:5.2LMax5.2L
Flux Flow10~100ml/min10~100ml/min
Spray MethodStepper motor/+ST-6sprayerStepper motor/+ST-6sprayer
Power Supply3sohase and 5-line mechanism 380v3sohase and 5-line mechanism 380v
Total Powermax:16kwMax.20kw
Normal Operating PowerApprox:3kwApprox:4kw
Gas Source4~7KG/CM24~7KG/CM2
WeightApprox:800kgApprox.1000kg
  • the whole machine configuration for the lead-free process design.
  • adopts PLC to control the whole machine, stable performance, powerful function.
  • The width of the guide rail, the entry and exit of the tin furnace, the lifting and lowering of the tin furnace can be conveniently and quickly adjusted.
  • automatic synchronization into the plate mechanism, into the plate smoothly, No jitter.
  • flux spray system, the use of imported nozzles, coating uniformity, atomization effect is excellent.
  • preheating using efficient hot air circulation heating, fast and balanced temperature supply capacity, reduce the thermal shock of the PCB board.
  • lead-free furnace chamber, low oxidation nozzle design, nozzle width can beadjusted to radically reduce the problem of tin oxidation.
  • Taiwan TCG high temperature resistant tin furnace motor, stepless frequency conversion speed control, independent control.
  • automatic claw washing device.
  • Timer switch on/off, sound and light alarm and emergency brake function.
  • Compact footprint saves space compared with 350/400 models. It supports daily output of tens of thousands of boards for mass production and quick changeover.
  • Turbulent + smooth dual waves improve soldering of connectors and pin headers, reducing missing solder and bridging in shadow zones to boost yield.
  • Optimized solder flow reduces dross. Zonal independent heating and precise flux spray save energy and lower production costs.
  • Modular design with independent spray, preheating, solder pot and conveyor units. The solder pot can be fully pulled out for easy maintenance.
  • Compatible with leaded solder and SAC lead-free alloys. Suitable for FR-4 boards, aluminum substrates and THT mixed PCBA. Applied in home appliances, industrial control and automotive electronics, compliant with RoHS.

Presenting the details of XD-300 lead-free wave soldering equipment

XD-300 Series Medium Wave Soldering System
XD-300 Series Medium Wave Soldering System

XD-300 Series Medium Wave Soldering System boasts precise temperature control and stable welding performance. Space-saving design fits mass processing of medium & small PCBs with easy maintenance.

Why choose this product?

  • Compact structure saves floor space compared with 350/400 models, suitable for medium and small production lines and supports mass production and quick changeover.
  • Turbulent + smooth dual waves reduce missing solder and bridging, improve yield and cut rework.
  • Low-dross design, zonal heating and precise flux spraying lower energy and material consumption to save production costs.
  • Modular construction; the solder pot can be fully pulled out for easy disassembly and maintenance.
  • XD-300 medium wave soldering machine supports leaded/SAC lead-free processes, compatible with various circuit boards for home appliances, industrial control and automotive electronics, compliant with RoHS.

 

How It Works

  • Fixtures convey THT PCBA into the XD-300 Dual Wave Soldering Machine at constant speed.
  • Precise flux spraying removes oxidation on circuit boards.
  • Zonal preheating heats boards gradually to reduce thermal shock.
  • Turbulent wave and smooth wave contact board bottom sequentially to solder through-hole component pins.
  • Boards cool down and exit to complete continuous THT wave soldering process.
XD-300 Series Medium Wave Soldering System
XD-300 Series Medium Wave Soldering System

Application Process

  1. Loading: Fixtures carry THT PCBA onto the XD-300 Dual Wave Soldering Machine conveyor track.
  2. Flux Spraying: Evenly spray flux to remove oxidation on boards.
  3. Zonal Preheating: Gradually heat PCBA to reduce thermal shock.
  4. Dual Wave Soldering: Pass turbulent wave and smooth wave sequentially for through-hole soldering.
  5. Cooling & Unloading: Boards cool down and exit the XD-300 Dual Wave Soldering Machine after soldering.

 

Requirements

 

  • Connect standard three-phase AC power and stable air supply & exhaust systems.
  • Maintain workshop ventilation and equip waste gas treatment device.
  • Prepare suitable solder: leaded solder or SAC lead-free alloy.
  • Process THT through-hole PCBA. V-cut boards and panel boards must meet process specifications.
  • Ambient temperature and humidity shall be within the allowable range of XD-300 DIP wave soldering machine. Keep the machine away from dust and corrosive gas.
DIP PRODUCTION LINE
DIP PRODUCTION LINE

What It Is Used For

  • Achieve automatic continuous through-hole wave soldering for THT PCBA.
  • Complete soldering of connectors, pin headers, horizontal components and other through-hole parts.
  • XD-300 PCB wave soldering equipment fits small and medium-batch THT production for home appliances, industrial control, lighting and automotive electronics.
  • Dual-wave technology reduces missing solder and bridging defects to stabilize soldering quality.
  • Build flexible medium-sized THT production lines and boost manufacturing efficiency.

 

Conclusion

XD-300 Series Medium Wave Soldering System features a compact layout for small and medium-batch THT production. Equipped with turbulent + smooth dual waves, it effectively reduces missing solder and bridging defects. Energy-saving design cuts solder dross, power and material costs. With modular construction for easy maintenance, it supports leaded and SAC lead-free processes and fits various circuit boards. Widely adopted in home appliances, industrial control, lighting and automotive electronics and compliant with RoHS, it is an ideal soldering solution for flexible medium-sized THT production lines.

For inquiries, please contact us at +8613537875415 or Lizzy@smtlinemachine.com. Visit us at Xintian Industrial Area, Baoan, Shenzhen City, China.

FAQ

How to choose between single-wave and dual-wave soldering?
  • Single-wave is recommended for simple single-layer PCBs with sparse components to lower investment. Dual-wave is preferred for boards with high-density through-hole parts, abundant connectors and mixed assembly, which reduces the rate of missing solder and bridging defects.

Do you provide after-sales service?

  • Our professional after-sales service team will quickly resolve any emergencies you may encounter during use.

Warranty period?

  • -The entire machine is covered by a one-year warranty, with free technical support provided after that year.

Do you provide installation and commissioning?

  • On-site installation and commissioning will incur additional fees, including accommodation and airfare.

Shipping method?

  • Typically, shipping is by sea or land. Air freight is more expensive for urgent needs.

 

Packaging and Delivery Information:

 

Delivery: Standard equipment is in stock, while less commonly used models require 10-15 days depending on the situation..

Minimum Order: We accept orders for a single machine or mixed orders to suit your needs.

Transportation: Products are shipped either in bulk or via containers, depending on the order size and destination.

Payment Terms: Flexible payment options are available, including L/C, D/A, D/P, T/T, Western Union, and MoneyGram.

Price: Prices are negotiable to ensure you receive the best possible value.

Packaging: We offer both standard export boxes and robust hardwood packages to ensure your order arrives safely and securely.

 

If you have any other questions, please contact us to obtain more information

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