XD-B Series Medium Reflow Oven
XD-B Series Medium Reflow Oven with balanced and stable temperature control, moderate energy consumption, suitable for mass soldering of standard-size PCBs.
- Complete reflow soldering of mounted PCBs.
- Weld circuit boards for consumer electronics and home appliances.
- Continuous mass production for small and medium SMT lines.
- XD-B Series Medium Reflow Oven Specifications
- Key Features
- Advantages
| Parameter | Details | ||
| Model | XD-B6610 | XD-B8810 | XD-B1010 |
| Dimensions | 3700×950×1450 | 4400×950×1450 | 5100×950×1450 |
| gross weight | 1500KG | 1800KG | 2000KG |
| Number of heating zones | Top6/Bot6 | Top8/Bot8 | Top10/Bot10 |
| Heating zone length | 2100mm | 2800mm | 3500mm |
| heating method | Small circulation heating | ||
| Number of cooling zones | 1(built-in) | ||
| Cooling zone length | 500MM | ||
| cooling method | Air Cooling | ||
| Machine color | Computer White | ||
| Air volume requirements | 10M3/minx2(thoroughfare) | ||
| Hearth open | cylinder | ||
| Shipping Part Parameters | |||
| mode of transport | Chain+mesh belt | ||
| Transport belt width | 450MM | ||
| Ralil width adjustment range | 50-300MM | ||
| Transport connection height | 900±20MM | ||
| transport speed | 300-2000mm/min | ||
| Shipping direction | Left to right (optional;right to left) | ||
| control section parameters | |||
| PCB three-point temperature difference | ±1.5℃ | ||
| Temperature Control Accuracy | ±1℃ | ||
| Adjacent temperature difference | The heating zone is around 50 degrees, and the heating and welding zones are around 100 degrees | ||
| Temperature control range | room temperature~350℃ | ||
| temperature control method | closed loop control+SSR | ||
| power supply | 3-phase 5-wire system | ||
| total power | 26KW | 36KW | 46KW |
| Normal working power consumption | settable | settable | settable |
| starting power | 8KW/13KW | 12KW/18KW | 15KW/23KW |
| Abnormal alarm | Temperature alarm (ultra-high and ulra-low temperature after constant temperature) | ||
- Windows 7 system, the Chinese and English interface can be switched freely online.
- PLC+ modular control, stable and reliable performance, high repeatability.
- Small circulation heating in the upper and lower temperature zones, turbocharged air transport structure and square heating wire design.
- Double brake cylinders are lifted to open the fumnace, which is safe and reliable, and is convenient for fumace maintenance.
- The soldering area can be set as double soldering area and triple soldering area to meet the soldering temperature requirements of different lead-free solder pastes.
- The conveying speed is controlled by computer closed-loop, and the width of guide rail can be controlled by computer and manually, which is easy to operate.
- Each temperature zone is equipped with an independent temperature sensing sensor to monitor and compensate the temperature balance of each temperature zone in real time.
- The whole machine is equipped with electric leakage protection and various fuses to ensure the safety of operators and machines.
- Compact structure saves factory space.
- Even zoning temperature control ensures stable soldering yield.
- Low energy consumption for energy-saving small & medium batch production.
- Easy disassembly for simple daily maintenance.
- Universal interfaces compatible with standard SMT lines.
Why choose this product?
Small and medium-sized processing factories commonly encounter problems with reflow ovens:
- Uneven temperature rise, cold solder joints and bridging, scrapped solder paste due to oxidation, high equipment energy consumption, and poor compatibility for mixed production of small and medium-sized PCBs.
The XD-B medium 8-zone reflow oven solves these pain points specifically:
- Independent temperature-controlled zones ensure uniform heating and eliminate cold solder joints and short circuits.
- The sealed chamber with hot air circulation reduces oxidation loss of solder paste.
- Optimized power consumption design cuts electricity expenses.
- Flexibly adjustable track width enables mixed production of different-sized circuit boards without equipment replacement.
Boasting a low failure rate and easy daily maintenance with no dedicated operator required, the XD-B medium 8-zone reflow oven balances production quality and manufacturing costs. It is a cost-effective option for SMT mass production in small and medium electronics workshops.
How It Works
- PCBs enter each temperature zone of the oven uniformly via conveyor.
- Each zone adopts independent temperature control to finish preheating, soaking, reflow and cooling step by step.
- Hot air circulation system delivers even heat to melt solder paste and form solder joints.
- The cooling section shapes joints rapidly to prevent cold solder and bridging defects.
- Finished PCBs are conveyed out of the XD-B PLC intelligent reflow oven, completing the SMT soldering process.
Application Process
- Loading: PCBs are transported into the reflow oven by conveyor rails.
- Preheating: Heat up mildly to evaporate moisture and avoid component cracking.
- Soaking: Equalize temperature fully and activate flux inside solder paste.
- Reflow Soldering: High temperature melts solder paste to form firm solder joints.
- Cooling & Shaping: Rapid cooling solidifies joints to avoid bridging and cold solder joints.
- Unloading: PCBs are conveyed out from the XD-B PLC intelligent reflow oven, marking the completion of the SMT soldering process.
Four Unique Selling Points of XD-B Reflow Oven
- 8 independent temperature zones greatly improve soldering yield.
- Sealed hot air structure cuts solder paste consumption cost.
- Adjustable rail supports mixed production of various PCB sizes.
- Low failure rate, no dedicated operator needed for lower maintenance cost
Requirements
- Power supply: Stable three-phase 380V industrial power.
- Environment: Dust-free & ventilated workshop, ambient temperature 18–28℃.
- Installation: Level load-bearing floor with maintenance space reserved.
- Air source: Clean and dry compressed air access.
- Matching equipment: Connect with conveyor to link front and rear SMT production lines.
- Operator requirement: Staff familiar with reflow soldering specifications.
SMT PRODUCTION LINE
What It Is Used For
- Used in SMT production lines to melt solder paste on PCBs and fix electronic components by soldering.
- Adopt zoning temperature control to reduce defects such as cold solder, bridging and component cracking.
- The XD-B low-void reflow oven is suitable for lead-free mass soldering production of medium and small PCBs, consumer electronics and home appliance circuit boards.
- Capable of connecting full SMT production lines to realize automatic continuous mounting production.
- Meet mass production demands of small and medium electronics factories and improve soldering yield.
Conclusion
The XD-B Series Medium Reflow Oven centers on three core features: 8 independent temperature-controlled zones, energy-saving sealed air ducts and adjustable track width, which specifically resolve industry pain points for small and medium electronics manufacturers such as uneven heating during reflow, cold solder joints and bridging, excessive energy consumption, and difficulties in mixed production of multi-size PCBs.
Equipped with a PLC intelligent control system, the XD-B low-void reflow soldering oven requires easy maintenance without dedicated on-site operators, substantially cutting manufacturers’ production and labor costs.
This XD-B low-void reflow soldering oven is highly compatible and applicable to lead-free SMT mass production for consumer electronics, household appliance control boards and compact automotive electronic circuit boards. Up to now, this model has been mass deployed on multiple production lines, including mobile phone mainboard lines in India, home appliance factories in Southeast Asia, and consumer electronics assembly workshops in Mexico.
Practical customer operation results show a remarkable decline in solder void rate, a 7%~12% increase in overall production yield, and roughly 15% lower electricity and maintenance expenses. With outstanding cost performance and reliable durability, it has become the mainstream reflow equipment adopted by small and medium-sized SMT workshops throughout Southeast Asia and Latin America
- It fits small & medium SMT factories in India, Southeast Asia and Mexico, which produce consumer electronic mainboards, home appliance circuit boards and compact automotive PCBs for mixed batch production.
Can PCBs of different widths run simultaneously on the XD-B reflow oven?
- The electrically adjustable rail allows mixed production of various PCB sizes without equipment replacement, perfect for flexible manufacturing with multiple orders.
Warranty period?
- -The entire machine is covered by a one-year warranty, with free technical support provided after that year.
Do you provide installation and commissioning?
- On-site installation and commissioning will incur additional fees, including accommodation and airfare.
Shipping method?
- Typically, shipping is by sea or land. Air freight is more expensive for urgent needs.
Packaging and Delivery Information:
Delivery: Standard equipment is in stock, while less commonly used models require 10-15 days depending on the situation..
Minimum Order: We accept orders for a single machine or mixed orders to suit your needs.
Transportation: Products are shipped either in bulk or via containers, depending on the order size and destination.
Payment Terms: Flexible payment options are available, including L/C, D/A, D/P, T/T, Western Union, and MoneyGram.
Price: Prices are negotiable to ensure you receive the best possible value.
Packaging: We offer both standard export boxes and robust hardwood packages to ensure your order arrives safely and securely.