XD-E Series Small Reflow Oven
XD-E Series small reflow oven features compact size, precise temperature control and low energy consumption, ideal for PCB prototyping, small batch production and laboratory use.
- PCB soldering for laboratory samples & R&D prototyping.
- Reflow soldering for small-batch SMT patch products.
- Soldering practice for universities and training institutions.
- Chip disassembly, soldering and rework for circuit boards in repair workshops.
- Soldering of new energy micro modules and tiny precision components.
- Curing & soldering for FPC flexible circuits and miniature PCBs.
- XD-E Series Small Reflow Oven Specifications
- Key Features
- Advantages
| Parameter | Details | |
| Model | XD-B6610 | XD-B8810 |
| Dimensions | 3500×710×1450 | 4200×710×1450 |
| gross weight | 1000KG | 1200KG |
| Number of heating zones | Top6/Bot6 | Top8/Bot8 |
| Heating zone length | 1980mm | 2650mm |
| heating method | Small circulation heating | |
| Number of cooling zones | 1(built-in) | |
| Cooling zone length | 50OMM | |
| cooling method | Air Cooling | |
| Machine color | Computer White | |
| Air volume requirements | 10M3/minx2(thoroughfare) | |
| Hearth open | Manual | |
| Shipping Part Parameters | ||
| mode of transport | Chain+webbing/webbing | |
| Transport belt width | 35OMM | |
| Rall width adjustment range | 50-250MM | |
| Transport connection height | 900±20MM | |
| transport speed | 300-2000mm/min | |
| Shipping direction | Left to right(optional;right to left) | |
| control section parameters | ||
| PCB three-point temperature difference | ±1.5℃ | |
| Temperature Control Accuracy | ±1℃ | |
| Adjacent temperature difference | The heating zone is around 50 degrees, and the heating and welding zones are around 100 degrees | |
| Temperature control range | room temperature~350º | |
| temperature control method | closed loop control+SSR | |
| power supply | 3-phase 5-wire system | |
| total power | 24KW | 32KW |
| Normal working power consumption | settable | settable |
| starting power | 6KW/12KW | 11KW/17KW |
| Abnormal alarm | Temperature alarm (ultra-high and ultra-low temperature after constant temperature) | |
- Compact footprint, desktop placement available.
- Independent temperature zones with precise, editable thermal profiles.
- Hot air convection heating ensures even heating to prevent cold solder joints.
- Energy-saving & low power consumption, lower prototyping cost.
- Intelligent touch control, one-click recall of common thermal curves.
- Insulated closed chamber, cool outer shell for anti-scald safety.
- Compatible with PCB, FPC, micro-module small boards soldering.
- Fast startup & heating speed, high efficiency for R&D sampling.
- Compact size with small footprint, suitable for laboratories and miniature production lines.
- Precise temperature control, tiny temperature difference, high soldering yield.
- Fast temperature rise, low startup energy consumption, energy-saving and eco-friendly.
- Modular structure, easy inspection & maintenance, low operating cost.
- Optional nitrogen welding to meet soldering requirements of precision PCBs.
- Intelligent temperature control system with touch parameter setting, easy operation.
Why choose this product?
Common pain points for small R&D studios and maker workshops:
- Large reflow ovens take up excessive space and consume high power, unsuitable for soldering a small number of prototypes. They also feature long preheating time and complicated debugging procedures.
The XD-E desktop reflow oven solves these pain points precisely:
- The XD-E desktop reflow oven has a compact footprint and heats up rapidly after startup.
- 6 temperature zones deliver precise temperature control to prevent cold solder joints during prototyping.
- Low energy consumption avoids power waste from long-time standby for sporadic prototype processing.
- User-friendly operation allows new operators to use it proficientl.
- The XD-E desktop reflow oven is perfectly suited for R&D prototyping and small-batch trial production with outstanding cost performance.
How It Works
- PCBs coated with solder paste are fed into the XD-E laboratory reflow oven and conveyed at a constant speed.
- Six temperature zones complete preheating, soaking, reflow and cooling separately.
- Even hot air melts solder paste to form solder joints.
- Cooling solidifies joints, and PCBs exit to finish soldering.
Application Process
- Loading: PCBs coated with solder paste are fed into the conveyor track of the XD-E laboratory reflow oven.
- Preheating: Gradual heating removes moisture to protect components.
- Soaking: Evenly heat boards and activate flux inside solder paste.
- Reflow: High temperature melts solder paste to form sturdy solder joints.
- Cooling: Solder joints solidify rapidly.
- Unloading: The PCB is conveyed out of the XD-E laboratory reflow oven, and the soldering process is completed.
Full Line Configuration List of XD-E Small Reflow Oven (Including Optional Equipment)
Standard Configuration: XD-E desktop small reflow oven, simple loading conveyor, unloading conveyor, temperature control cabinet, oven exhaust and dust removal assembly
Optional Expansion Equipment: small semi-automatic solder paste printer, desktop mini mounter, miniature AOI inspector, PCB buffer station, compact nitrogen generator, stencil cleaning machine, ESD turnover rack, simplified MES data acquisition module
USP Advantages of XD-E Small Reflow Oven Whole Line Solution
- Lightweight layout with tiny footprint, deployable in laboratories and R&D studios.
- Fast heating startup without long preheating, ready for prototype sampling anytime to save power.
- Precise 6-zone temperature control reduces voids and cold solder joints for stable prototype yield.
- Low operation threshold and easy operation, new operators can debug production rapidly.
- Flexible configuration; printers, mounters and inspection devices can be added on demand for seamless capacity expansion later.
- Low maintenance cost, simple structure and low failure rate, ideal for R&D sampling and small-batch trial production.
Requirements
- Power supply: single-phase 220V commercial power.
- Site: flat ground with space for ventilation and heat dissipation.
- Environment: dust-free & dry, away from dust and corrosive gas.
- Exhaust: connect exhaust duct to discharge soldering waste gas.
- Placement: install horizontally to prevent tilt and vibration.
- Air supply (nitrogen model optional): clean and dry compressed air.
SMT PRODUCTION LINE
What It Is Used For
The XD-E PCB prototyping reflow oven is mainly applied to soldering for circuit board R&D prototyping, small-batch trial production of new products, teaching and training in educational institutions, SMT processing for maker workshops, and circuit board rework & repair.
Conclusion
The XD-E low-power reflow oven is designed for R&D laboratories, maker workshops and university training scenarios. Adopting a precise 6-zone temperature control structure, it runs on single-phase 220V power supply with a compact footprint and energy-saving performance, and features rapid preheating upon startup.
It is specially suitable for PCB prototype fabrication, small-batch trial production and circuit board rework. Printing, mounting and AOI equipment can be optionally added to the full production line for phased upgrading.
Featuring user-friendly operation and low failure rate, the XD-E low-power reflow oven greatly lowers the threshold for launching small-batch SMT production.
Project application cases: Multiple electronics R&D studios in India have adopted this model for consumer electronics prototype development; maker workshops in Thailand and Malaysia across Southeast Asia have deployed it in batches for small-volume production of Bluetooth module PCBs; electronics repair workshops in Mexico use the XD-E low-power reflow oven for circuit board rework.
All clients have commented on its fast temperature rise, small space occupation and low operation & maintenance costs, making it ideal for niche R&D and micro production lines.
- It is designed for PCB prototyping, pilot run, board rework and educational training, perfect for micro production lines. Choose XD-B medium reflow oven for mass manufacturing.
Does XD-E break down easily when used in India and Southeast Asia?
- The machine adopts simplified structure with few wearing parts. Long-term usage feedback from studios in India, Thailand, Malaysia and Mexico shows extremely low failure rates, only basic cleaning maintenance required.
Warranty period?
- -The entire machine is covered by a one-year warranty, with free technical support provided after that year.
Do you provide installation and commissioning?
- On-site installation and commissioning will incur additional fees, including accommodation and airfare.
Shipping method?
- Typically, shipping is by sea or land. Air freight is more expensive for urgent needs.
Packaging and Delivery Information:
Delivery: Standard equipment is in stock, while less commonly used models require 10-15 days depending on the situation..
Minimum Order: We accept orders for a single machine or mixed orders to suit your needs.
Transportation: Products are shipped either in bulk or via containers, depending on the order size and destination.
Payment Terms: Flexible payment options are available, including L/C, D/A, D/P, T/T, Western Union, and MoneyGram.
Price: Prices are negotiable to ensure you receive the best possible value.
Packaging: We offer both standard export boxes and robust hardwood packages to ensure your order arrives safely and securely.