XJ-L830 Single Station Laser Depaneling Machine
Non-contact laser cutting generates no mechanical depaneling stress and protects tiny components. With precise vision positioning, it is ideal for cutting ultra-thin and high-precision PCBs.
- Contact-free laser depaneling for PCB and FPC.
- Cutting processing of tiny and ultra-thin circuit boards.
- Cut micro tabs with zero stress to protect components.
- Suitable for mass production of precision boards for communication, medical electronics.
- XJ-L830 Single Station Laser Depaneling Machine Specifications
- Key Features
- Advantages
| Parameter | Details |
| Laser wavelength and power | Wavelength 355 Power UV 25W |
| Single cutting range | 50*50 |
| Laser size range | 300*300 |
| Laser cutting speed | 100m/s-3000m/s adjustable |
| Splicing Precision | ±10um |
| XY platform repeatability accuracy | ±1um |
| Comprehensive Machining Precision | ±20um |
| CCD positioning accuracy | ±5um |
| File format | Gerber(*.gbr)/DXF(*.dxf)/DwG(*.dwg) |
| Chiller Power Supply | 220V |
| Cooling method | Constant temperature water cooling |
| Host Machine Overall Dimensions | 880*1440*1675mm |
| Host power supply | AC 380V 50Hz |
| Smoking machine dimensions | 650*700*1500mm |
| Smoking machine power supply | AC 380V 50Hz |
| Air source | 0.5-0.7Mpa |
| Load bearing requirements | 500Kg/m2 |
| Environmental requirements | Temperature: 25 + 5℃,humidity: RH 60% + 10% |
| Clean room Class | No requirements |
| Vibration amplitude | ≤10um |
| External exhaust interface | 50mm |
- The laser features excellent beam quality and stable performance, with a maintenance-free service life of up to 100,000 hours.
- CCD visual pre-scanning & automatic target capture and positioning, with automatic compensation and correction.
- Laser cutting is adopted to design and cut various patterns or texts freely, which is convenient and efficient, and shortens the delivery time.
- The cutting edge is smooth and flat, with minimal heat-affected zone and low tendency to deform.
- The fixture is compatible with products of multiple sizes and multiple design files.
- Contact-free laser cutting with zero depaneling stress.
- Smooth cutting edge without burrs, no secondary polishing needed.
- No molds required; switch products by editing programs to lower costs.
- High precision, perfect for miniature precision circuit boards.
- Dust-free processing to prevent scratch and contamination.
- Easy operation with high automation.
Why choose this product?
- Contact-free laser cutting with zero mechanical stress, avoiding damage to components and circuits.
- No mold development required; switch products by modifying programs to greatly save mold costs.
- High cutting precision, suitable for ultra-thin, miniature high-precision PCBs and FPCs.
- Smooth burr-free cutting edges without secondary processing, improving production efficiency.
- Built-in vision positioning for automatic deviation correction and stable yield.
- The XJ-L830 Single Station PCB Laser Separator is equipped with fume purification system for dust-free and eco-friendly production in clean workshops.
How It Works
- The laser emits high-energy beam and focuses accurately on the cutting path of boards.
- High energy instantly melts and vaporizes connecting areas of PCB/FPC for separation.
- Vision positioning system calibrates board position to guarantee cutting precision.
- Full contact-free processing without mechanical stress to protect components.
- Matched fume purification system extracts vaporized dust simultaneously to keep clean environment.

Application Process
- Import PCB drawing and edit laser cutting path program.
- Power XJ-L830 Laser PCB Depanel Equipment on for self-check and turn on fume purifier.
- Place circuit board on fixture and fix for positioning.
- Vision system automatically calibrates board coordinates.
- Activate laser to finish contact-free depaneling along preset path.
- Take out finished boards after cutting, clean fume and waste for cyclic production.
Requirements
- Install in dust-free constant-temperature workshop with flat stable ground.
- Stable dedicated 220V power supply with grounding protection.
- Ambient temperature: 20–28℃, control dust and moisture strictly.
- Equip industrial dust extractor to exhaust cutting fume timely.
- Operators must wear laser goggles; staring at light source is prohibited.
- Clean optical path regularly and maintain laser as standard specification.

What It Is Used For
XJ-L830 Laser PCB Depanel Equipment adopts contact-free laser cutting to separate PCB and FPC circuit boards, cuts connecting tabs with zero stress to protect components and circuits, specially designed for damage-free depaneling of miniature, ultra-thin precision boards in medical and communication industries.
Conclusion
Do you provide after-sales service?
- Our professional after-sales service team will quickly resolve any emergencies you may encounter during use.
Warranty period?
- -The entire machine is covered by a one-year warranty, with free technical support provided after that year.
Do you provide installation and commissioning?
- On-site installation and commissioning will incur additional fees, including accommodation and airfare.
Shipping method?
- Typically, shipping is by sea or land. Air freight is more expensive for urgent needs.
Packaging and Delivery Information:
Delivery: Standard equipment is in stock, while less commonly used models require 10-15 days depending on the situation..
Minimum Order: We accept orders for a single machine or mixed orders to suit your needs.
Transportation: Products are shipped either in bulk or via containers, depending on the order size and destination.
Payment Terms: Flexible payment options are available, including L/C, D/A, D/P, T/T, Western Union, and MoneyGram.
Price: Prices are negotiable to ensure you receive the best possible value.
Packaging: We offer both standard export boxes and robust hardwood packages to ensure your order arrives safely and securely.









